Patents by Inventor Kun Mo Chu

Kun Mo Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SURFACE COATING LAYER AND HEAT EXCHANGER INCLUDING THE SURFACE COATING LAYER
    Publication number: 20120181004
    Abstract: A surface coating layer, in contact with a surface of a base material of a heat exchanger, comprises a plurality of composite layers comprising a first layer contacting a surface of the base material, the first layer comprising a first matrix and a first nanobody, and a second layer contacting a surface of the first layer and having an interface with the air, where the first layer and the second layer each include a different amount by volume of the first nanobody and the second nanobody, respectively.
    Type: Application
    Filed: May 17, 2011
    Publication date: July 19, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yoon Chul SON, Sang Eui LEE, Ha Jin KIM, Dong Ouk KIM, Dong Earn KIM, Kun Mo CHU
  • HEAT DISSIPATION MATERIAL AND LIGHT EMITTING DIODE PACKAGE INCLUDING A JUNCTION PART MADE OF THE HEAT DISSIPATION MATERIAL
    Publication number: 20120056234
    Abstract: Disclosed are a heat dissipation material comprising a metallic glass and an organic vehicle and a light emitting diode package including at least one of a junction part, wherein the junction part includes a heat dissipation material including a metallic glass.
    Type: Application
    Filed: August 19, 2011
    Publication date: March 8, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eun Sung Lee, Sang Soo Jee, Kun Mo Chu, Se Yun Kim, Kyu Hyoung Lee, Sang Mock Lee