Abstract: An electronic device according to an embodiment includes a battery supplying power to the electronic device, at least one circuit board having one or more components disposed thereon, a first temperature sensor disposed in a first region of the circuit board that is adjacent to one of the one or more components, a second temperature sensor disposed in a second region away from the first region, and a processor configured to measure a first temperature corresponding to the first region using the first temperature sensor, measure a second temperature corresponding to the second region or the outside of the electronic device using the second temperature sensor, determine a third temperature for the battery based at least on the first and second temperatures, and control the use of a resource of the electronic device when the third temperature satisfies a specified condition. Other various embodiments are also possible.

Abstract: A method is provided for manufacturing a printed circuit board assembly. A method includes applying a liquefied radiant-heat material on a heating component mounted on the printed circuit board; mounting a shield unit on the printed circuit board in contact with the liquefied radiant-heat material; and simultaneously curing the liquefied radiant-heat material and bonding the shield unit.

Abstract: A method is provided for manufacturing a printed circuit board assembly. A method includes applying a liquefied radiant-heat material on a heating component mounted on the printed circuit board; mounting a shield unit on the printed circuit board in contact with the liquefied radiant-heat material; and simultaneously curing the liquefied radiant-heat material and bonding the shield unit.

Abstract: A method and apparatus for determining a control temperature to control a function of an electronic device by using an atmospheric temperature when controlling a temperature of the electronic device, and for controlling the function of the electronic device according to a control step of the determined control temperature are provided. A method of operating an electronic device includes measuring an atmospheric temperature, determining at least one control temperature corresponding to the measured atmospheric temperature, measuring an internal temperature of the electronic device, and controlling a function in accordance with the measured internal temperature of the electronic device and the determined at least one control temperature.

Abstract: An electronic device according to an embodiment includes a battery supplying power to the electronic device, at least one circuit board having one or more components disposed thereon, a first temperature sensor disposed in a first region of the circuit board that is adjacent to one of the one or more components, a second temperature sensor disposed in a second region away from the first region, and a processor configured to measure a first temperature corresponding to the first region using the first temperature sensor, measure a second temperature corresponding to the second region or the outside of the electronic device using the second temperature sensor, determine a third temperature for the battery based at least on the first and second temperatures, and control the use of a resource of the electronic device when the third temperature satisfies a specified condition. Other various embodiments are also possible.

Abstract: A mobile communication terminal with a radiant-heat function is provided. The mobile communication terminal includes: a display module; a rear cover; an inner support structure positioned between the display module and the rear cover and including a first surface facing the display module and a second surface facing an opposite side to the display module; a first radiant-heat sheet positioned between the first surface of the support structure and the display module; a printed circuit board positioned between the first radiant-heat sheet and the first surface of the support structure; and a second radiant-heat sheet positioned between the second surface of the support structure and the rear cover.

Abstract: A method is provided for manufacturing a printed circuit board assembly. A method includes applying a liquefied radiant-heat material on a heating component mounted on the printed circuit board; mounting a shield unit on the printed circuit board in contact with the liquefied radiant-heat material; and simultaneously curing the liquefied radiant-heat material and bonding the shield unit.

Abstract: A mobile communication terminal with a radiant-heat function is provided. The mobile communication terminal includes: a display module; a rear cover; an inner support structure positioned between the display module and the rear cover and including a first surface facing the display module and a second surface facing an opposite side to the display module; a first radiant-heat sheet positioned between the first surface of the support structure and the display module; a printed circuit board positioned between the first radiant-heat sheet and the first surface of the support structure; and a second radiant-heat sheet positioned between the second surface of the support structure and the rear cover.

Abstract: A method and apparatus for determining a control temperature to control a function of an electronic device by using an atmospheric temperature when controlling a temperature of the electronic device, and for controlling the function of the electronic device according to a control step of the determined control temperature are provided. A method of operating an electronic device includes measuring an atmospheric temperature, determining at least one control temperature corresponding to the measured atmospheric temperature, measuring an internal temperature of the electronic device, and controlling a function in accordance with the measured internal temperature of the electronic device and the determined at least one control temperature.

Abstract: A shield can fixing device of an electronic device is provided. The fixing device includes a base having a specific length and attached to a shield can fixing line of the printed circuit board, a pair of panels, each of which is bent upwards and formed on the base to have a slit between them for inserting a lateral portion of the shield can, at least one opening portion formed in any one or both of the panels, and an insertion protrusion formed in the lateral portion located in a corresponding position to the opening portion in a protruding manner to ensure a fixing force of the shield can. The shield can fixing device is fixed by inserting a lateral portion of a shield can between double walls.

Abstract: A method of manufacturing a Through Mold Via (TMV) package-on-package device while preventing a bad solder joint from occurring in the TMV package-on-package device is provided. The method includes coating exposed portions of a lower semiconductor package with an organic soldering preservative, and stacking a top semiconductor package on the lower semiconductor package and connecting lower solder balls of the top semiconductor package with the top solder balls of the lower semiconductor package. According to the method, a bad solder joint may be prevented from occurring when a top semiconductor package is bonded to a lower semiconductor package.

Abstract: A display panel and a method of manufacturing the same are provided. The display panel includes a plurality of chip panels, each chip panel having an upper surface, a lower surface disposed parallel to the upper surface, a side surface between the upper surface and the lower surface and a connection portion between the side surface and at least one of the upper surface and the lower surface, the connection portion having a rounded configuration, and an adhesive layer interposed between the chip panels in order to vertically stack the chip panels to connect the chip panels. Therefore, in the display panel, the strength of the edge portion can be improved. Also, by forming a connection portion, a stress can be suppressed from being concentrated at the edge portion by an external mechanical stress.

Abstract: A shield can fixing device of an electronic device is provided. The fixing device includes a base having a specific length and attached to a shield can fixing line of the printed circuit board, a pair of panels, each of which is bent upwards and formed on the base to have a slit between them for inserting a lateral portion of the shield can, at least one opening portion formed in any one or both of the panels, and an insertion protrusion formed in the lateral portion located in a corresponding position to the opening portion in a protruding manner to ensure a fixing force of the shield can. The shield can fixing device is fixed by inserting a lateral portion of a shield can between double walls.

Abstract: An apparatus and method of improving power noise of a Ball Grid Array (BGA) package are provided. The method includes securing a space for a passive element mounting pad, on which a passive element can be mounted, adjacent to a power pad on a Printed Circuit Board (PCB) corresponding to a power pin of the BGA package, mounting the passive element on the passive element mounting pad, and mounting the BGA package at a position on the PCB, wherein the position on the PCB overlaps the passive element and further wherein the BGA package is mounted above the passive element.

Abstract: A mobile communication terminal with a radiant-heat function is provided. The mobile communication terminal includes: a display module; a rear cover; an inner support structure positioned between the display module and the rear cover and including a first surface facing the display module and a second surface facing an opposite side to the display module; a first radiant-heat sheet positioned between the first surface of the support structure and the display module; a printed circuit board positioned between the first radiant-heat sheet and the first surface of the support structure; and a second radiant-heat sheet positioned between the second surface of the support structure and the rear cover.