Abstract: A replaceable integrated circuit device which replaces the connecting socket, the interposer and the pins in prior art with plural solder balls on the bottom of the integrated circuit package contacting and connecting the corresponding contact pad on the circuit board for electrical conduction. The contacting surface of the solder balls and the corresponding contact pad can be made as plane or as curve as possible to increase the contacting area. More over, there are many buckling apparatus placed on the circuit board to buckle the integrated circuit package and the circuit board firmly and to provide the extra downward force to make the solder balls and the corresponding contact pad contact and connect each other tightly. In the present invention, for the solder balls contacting the contact pads of the circuit board directly, which reduce the space that a connecting socket used in prior art and improve the usage ratio of the layout on a circuit board.

Abstract: A combination device of the IC package connection device and the main board comprises a socket and a main board. The socket has a holding assembly which is placed on the top surface of the socket. The holding assembly connects to the external IC package electrically and the socket has a plurality of solder balls. The solder balls are placed on the bottom surface of the socket and connect to the holding assembly electrically. The socket is stable on the top surface of the main board and connects to the main board electrically. The positions of a plurality of PTHs in the main board are corresponding to the plurality of solder balls. The totally melting temperature of the solder balls is higher than that in prior art in order to make the solder balls be in controllable semi-solid state in solder reflow step.

Abstract: A pin grid array integrated circuit connecting device which including a substrate, a sliding slice, a guiding frame and a driving apparatus. Said substrate further includes multiple holes to hold pins of a integrated circuit package, multiple conductive positioning components in the holes to hold said pins and connect said pins electrically, circuit device with proper circuit layout and multiple electrical connecting spots on the bottom of said substrate which connecting said multiple conductive positioning components thru said circuit device. The extra electronic components placed on said substrate will provide the additional function. Said sliding slice is placed on the top of said substrate and can be moved relatively. Multiple holes are placed on said sliding slice and positioned correspondingly to the holes on said substrate. Said guiding frame is placed on at least the two opposite sides of said substrate which guide said sliding move linearly along the extension of said guiding frame.

Abstract: A combination device of the IC package connection device and the main board comprises a socket and a main board. The socket has a holding assembly which is placed on the top surface of the socket. The holding assembly connects to the external IC package electrically and the socket has a plurality of solder balls. The solder balls are placed on the bottom surface of the socket and connect to the holding assembly electrically. The socket is stable on the top surface of the main board and connects to the main board electrically. The positions of a plurality of PTHs in the main board are corresponding to the plurality of solder balls. The totally melting temperature of the solder balls is higher than that in prior art in order to make the solder balls be in controllable semi-solid state in solder reflow step.

Abstract: A pin grid array integrated circuit connecting device which comprises a substrate, a sliding slice, a guiding frame and a driving apparatus. Said substrate further comprises multiple holes to hold pins of a integrated circuit package, multiple conductive positioning components in the holes to hold said pins and connect said pins electrically, circuit device with proper circuit layout and multiple electrical connecting spots on the bottom of said substrate which connecting said multiple conductive positioning components thru said circuit device. The extra electronic components placed on said substrate will provide the additional function. Said sliding slice is placed on the top of said substrate and can be moved relatively. Multiple holes are placed on said sliding slice and positioned correspondingly to the holes on said substrate. Said guiding frame is placed on at least the two opposite sides of said substrate which guide said sliding move linearly along the extension of said guiding frame.

Abstract: A replaceable integrated circuit device which replaces the connecting socket, the interposer and the pins in prior art with plural solder balls on the bottom of the integrated circuit package contacting and connecting the corresponding contact pad on the circuit board for electrical conduction. The contacting surface of the solder balls and the corresponding contact pad can be made as plane or as curve as possible to increase the contacting area. More over, there are many buckling apparatus placed on the circuit board to buckle the integrated circuit package and the circuit board firmly and to provide the extra downward force to make the solder balls and the corresponding contact pad contact and connect each other tightly. In the present invention, for the solder balls contacting the contact pads of the circuit board directly, which reduce the space that a connecting socket used in prior art and improve the usage ratio of the layout on a circuit board.