Patents by Inventor Kunihiko Akai
Kunihiko Akai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240105653Abstract: A method for forming solder bumps by using a solder paste containing solder particles, a flux, and a volatile dispersion medium, the method including: applying the solder paste on a member having a plurality of electrodes on the surface; heating the member and the solder paste at a temperature below the melting point of solder constituting the solder particles to form a solder particle-containing layer; heating the member and the solder particle-containing layer at a temperature equal to or higher than the melting point of the solder constituting the solder particles to form solder bumps; and removing, by cleaning, a residue of the solder particle-containing layer remaining between adjacent solder bumps, in which the solder particles have an average particle size of 10 ?m or less, and the content of the dispersion medium in the solder paste is 30% by mass or more.Type: ApplicationFiled: February 3, 2021Publication date: March 28, 2024Inventors: Yoshinori EJIRI, Shinichirou SUKATA, Kunihiko AKAI, Masumi SAKAMOTO, Chiaki SHIMIZU, Junichi KAKEHATA, Ayumi YOSHIBA
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Publication number: 20240079345Abstract: A conductive member includes an adhesive layer and a metal foil layer. The adhesive layer consists of an adhesive composition containing conductive particles. The metal foil layer is disposed on the adhesive layer. The conductive member can be used to form, for example, a predetermined metal film.Type: ApplicationFiled: January 18, 2022Publication date: March 7, 2024Inventors: Masashi OHKOSHI, Nozomu TAKANO, Daisuke FUJIMOTO, Hiroyuki IZAWA, Tomohiko KOTAKE, Kunihiko AKAI, Yuka ITOH, Shunsuke TAKAGI
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Publication number: 20230397337Abstract: A method for manufacturing a substrate with built-in components includes providing an intermediate member including an electronic component with a first electrode provided on a first surface thereof, and a first electrically conductive layer provided on the first surface of the electronic component so as to cover the first electrode, and forming a first insulating resin layer on a first surface of the intermediate member. The first electrically conductive layer includes a first curable adhesive layer formed from a curable adhesive layer including electrically conductive particles and a cured adhesive composition, and a first metal foil layer disposed on the first curable adhesive layer that is a surface on a side opposite to the electronic component. The electrically conductive particles of the first curable adhesive layer electrically connect the first electrode of the electronic component and the first metal foil layer.Type: ApplicationFiled: August 6, 2021Publication date: December 7, 2023Inventors: Hiroyuki IZAWA, Hikari MURAI, Nozomu TAKANO, Kunihiko AKAI, Yuka ITOH, Masashi OHKOSHI
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Publication number: 20230328897Abstract: A member for forming a wiring includes an adhesive layer and a metal foil layer. The adhesive layer is formed from an adhesive composition including electrically conductive particles. The metal foil layer is disposed on the adhesive layer. In this member for forming a wiring, a ratio of surface roughness Rz of a first surface of the metal foil layer on a side attached to the adhesive layer with respect to an average particle diameter of the electrically conductive particles is 0.05 to 3.Type: ApplicationFiled: August 6, 2021Publication date: October 12, 2023Inventors: Hiroyuki IZAWA, Hikari MURAI, Nozomu TAKANO, Kunihiko AKAI, Yuka ITOH, Masashi OHKOSHI
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Publication number: 20230060577Abstract: A connection structure including: a first circuit member having a plurality of first electrodes; a second circuit member having a plurality of second electrodes; and an intermediate layer having a plurality of bonding portions electrically connecting the first electrodes and the second electrodes, in which at least one of the first electrode and the second electrode that are connected by the bonding portion is a gold electrode, and 90% or more of the plurality of bonding portions include a first region containing a tin-gold alloy and connecting the first electrode and the second electrode and a second region containing bismuth and being in contact with the first region.Type: ApplicationFiled: December 4, 2020Publication date: March 2, 2023Inventors: Kunihiko AKAI, Masayuki MIYAJI, Junichi KAKEHATA, Yoshinori EJIRI, Toshimitsu MORIYA
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Publication number: 20230042727Abstract: A solder bump forming member including: a base substrate having a plurality of recesses; and solder particles in the recesses, in which the solder particle has an average particle diameter of 1 to 35 ?m and a C.V. value of 20% or less, and a part of the solder particle projects from the recess, or in cross-sectional view, when a depth of the recess is designated as H1, and a height of the solder particle is designated as H2, H1<H2 is established.Type: ApplicationFiled: December 15, 2020Publication date: February 9, 2023Inventors: Kunihiko AKAI, Masayuki MIYAJI, Junichi KAKEHATA, Yoshinori EJIRI
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Patent number: 11287313Abstract: The disclosure provides a detecting composition or layer; a film, a device, a tape and a detecting system having the detecting layer; and methods of use thereof.Type: GrantFiled: November 29, 2018Date of Patent: March 29, 2022Assignees: Showa Denko Materials Co., Ltd., Showa Denko Materials (America), Inc.Inventors: Kunihiko Akai, Shingo Kobayashi, Nobuyuki Ogawa
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Publication number: 20210229222Abstract: A method for producing solder particles, which includes: a preparation step wherein a base material that has a plurality of recesses and solder fine particles are prepared; an accommodation step wherein at least some of the solder fine particles are accommodated in the recesses; and a fusing step wherein the solder fine particles accommodated in the recesses are fused, thereby forming solder particles within the recesses. With respect to this method for producing solder particles, the average particle diameter of the solder particles is from 1 ?m to 30 ?m; and the C.V. value of the solder particles is 20% or less.Type: ApplicationFiled: June 26, 2019Publication date: July 29, 2021Applicant: Showa Denko Materials Co., Ltd.Inventors: Kunihiko AKAI, Yoshinori EJIRI, Yuuhei OKADA, Toshimitsu MORIYA, Shinichirou SUKATA, Masayuki MIYAJI
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Publication number: 20210114147Abstract: A method for producing an anisotropic conductive film, which includes: a preparation step wherein a base material that has a plurality of recesses and solder fine particles are prepared; an accommodation step wherein at least some of the solder fine particles are accommodated in the recesses; a fusing step wherein the solder fine particles accommodated in the recesses are fused, thereby forming solder particles within the recesses; a transfer step wherein an insulating resin material is brought into contact with the recess opening side of the base material that includes the solder particles in the recesses, thereby obtaining a first resin layer on which the solder particles have been transferred; and a layering step wherein a second resin layer that is configured from an insulating resin material is formed on the surface of the first resin layer, on which the solder particles have been transferred, thereby obtaining an anisotropic conductive film.Type: ApplicationFiled: June 26, 2019Publication date: April 22, 2021Applicant: Showa Denko Materials Co., Ltd.Inventors: Kunihiko AKAI, Yoshinori EJIRI, Yuuhei OKADA, Toshimitsu MORIYA, Shinichirou SUKATA, Masayuki MIYAJI
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Publication number: 20210114145Abstract: The present invention relates to solder particles, each of which partially has a flat portion in the surface. By using these solder particles, electrodes facing each other are able to be appropriately connected, thereby achieving an anisotropic conductive material that exhibits excellent conduction reliability and excellent insulation reliability.Type: ApplicationFiled: June 26, 2019Publication date: April 22, 2021Applicant: Showa Denko Materials Co., Ltd.Inventors: Kunihiko AKAI, Yoshinori EJIRI, Yuuhei OKADA, Toshimitsu MORIYA, Shinichirou SUKATA, Masayuki MIYAJI
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Publication number: 20190195686Abstract: The disclosure provides a detecting composition or layer; a film, a device, a tape and a detecting system having the detecting layer; and methods of use thereof.Type: ApplicationFiled: November 29, 2018Publication date: June 27, 2019Inventors: Kunihiko Akai, Shingo Kobayashi, Nobuyuki Ogawa
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Patent number: 8480970Abstract: The present invention relates to an analytical pretreatment device, comprising a supporting material 1, m inlet ports 3 as fluid injection ports, n outlet ports 4 as fluid outlet port, m×n hollow filament 5 communicating between the inlet ports and the outlet ports, and n filler cartridges 6 connected to the outlet ports (wherein, m is a natural number; and n is a natural number) that provides an analytical pretreatment device allowing easier automation of the analytical pretreatment step for improvement in operational accuracy and saving in labor.Type: GrantFiled: November 30, 2005Date of Patent: July 9, 2013Assignee: Hitachi Chemical Co., Ltd.Inventors: Hiroshi Kawazoe, Kunihiko Akai, Kiyoshi Yasue
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Patent number: 8480971Abstract: The present invention relates to an analytical pretreatment device, comprising a supporting material 1, m inlet ports 3 as fluid injection ports, n outlet ports 4 as fluid outlet port, m×n hollow filament 5 communicating between the inlet ports and the outlet ports, and n filler cartridges 6 connected to the outlet ports (wherein, m is a natural number; and n is a natural number) that provides an analytical pretreatment device allowing easier automation of the analytical pretreatment step for improvement in operational accuracy and saving in labor.Type: GrantFiled: April 15, 2011Date of Patent: July 9, 2013Assignee: Hitachi Chemical Co., Ltd.Inventors: Hiroshi Kawazoe, Kunihiko Akai, Kiyoshi Yasue
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Patent number: 8383016Abstract: Conductive fine particles have core particle surfaces coated with a metal-plated coating film layer containing nickel and phosphorus and a multilayer conductive layer comprising a palladium layer as the outer surface. The phosphorus content in region A of the metal-plated coating film layer, at a distance of no greater than 20% of the thickness of the entire metal-plated coating film layer from the surface of the core particle, is 7-15 wt % of the entire region A. The phosphorus content in region B of the metal-plated coating film layer, at a distance of no greater than 10% of the thickness of the entire metal-plated coating film layer from the surface of the metal-plated coating film layer on the palladium layer side, is 0.1-3 wt % of the entire region B, and the phosphorus content of the entire metal-plated coating film layer is 7 wt % or greater.Type: GrantFiled: March 9, 2012Date of Patent: February 26, 2013Assignee: Hitachi Chemical Company, Ltd.Inventors: Nana Enomoto, Kunihiko Akai
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Publication number: 20120228559Abstract: Conductive fine particles have core particle surfaces coated with a metal-plated coating film layer containing nickel and phosphorus and a multilayer conductive layer comprising a palladium layer as the outer surface. The phosphorus content in region A of the metal-plated coating film layer, at a distance of no greater than 20% of the thickness of the entire metal-plated coating film layer from the surface of the core particle, is 7-15 wt % of the entire region A. The phosphorus content in region B of the metal-plated coating film layer, at a distance of no greater than 10% of the thickness of the entire metal-plated coating film layer from the surface of the metal-plated coating film layer on the palladium layer side, is 0.1-3 wt % of the entire region B, and the phosphorus content of the entire metal-plated coating film layer is 7 wt % or greater.Type: ApplicationFiled: March 9, 2012Publication date: September 13, 2012Applicant: Hitachi Chemical Company, Ltd.Inventors: Nana Enomoto, Kunihiko Akai
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Publication number: 20110206558Abstract: The present invention relates to an analytical pretreatment device, comprising a supporting material 1, m inlet ports 3 as fluid injection ports, n outlet ports 4 as fluid outlet port, m×n hollow filament 5 communicating between the inlet ports and the outlet ports, and n filler cartridges 6 connected to the outlet ports (wherein, m is a natural number; and n is a natural number) that provides an analytical pretreatment device allowing easier automation of the analytical pretreatment step for improvement in operational accuracy and saving in labor.Type: ApplicationFiled: April 15, 2011Publication date: August 25, 2011Applicant: HITACHI CHEMICAL CO., LTD.Inventors: Hiroshi KAWAZOE, Kunihiko AKAI, Kiyoshi YASUE
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Publication number: 20110140300Abstract: The present invention relates to a microfluid-system-supporting unit, comprising a fixing layer formed on a substrate, a protective layer or a fixing layer, wherein part of at least one hollow filament in any shape is placed and fixed in the fixing layer. Thus, it provides a microfluid-system-supporting unit lower in surface irregularity even when there are multiple hollow filaments different in external diameter or the hollow filaments crosses each other and resistant to positional deviation of the hollow filament in the crossing regions, and a production method thereof.Type: ApplicationFiled: February 14, 2011Publication date: June 16, 2011Applicant: HITACHI CHEMICAL CO., LTD.Inventors: Kunihiko AKAI, Hiroshi KAWAZOE
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Publication number: 20110132535Abstract: The present invention relates to a microfluid-system-supporting unit, comprising a fixing layer formed on a substrate, a protective layer or a fixing layer, wherein part of at least one hollow filament in any shape is placed and fixed in the fixing layer. Thus, it provides a microfluid-system-supporting unit lower in surface irregularity even when there are multiple hollow filaments different in external diameter or the hollow filaments crosses each other and resistant to positional deviation of the hollow filament in the crossing regions, and a production method thereof.Type: ApplicationFiled: February 14, 2011Publication date: June 9, 2011Applicant: HITACHI CHEMICAL CO., LTD.Inventors: Kunihiko AKAI, Hiroshi KAWAZOE
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Publication number: 20110135817Abstract: The present invention relates to a microfluid-system-supporting unit, comprising a fixing layer formed on a substrate, a protective layer or a fixing layer, wherein part of at least one hollow filament in any shape is placed and fixed in the fixing layer. Thus, it provides a microfluid-system-supporting unit lower in surface irregularity even when there are multiple hollow filaments different in external diameter or the hollow filaments crosses each other and resistant to positional deviation of the hollow filament in the crossing regions, and a production method thereof.Type: ApplicationFiled: February 14, 2011Publication date: June 9, 2011Applicant: HITACHI CHEMICAL CO., LTD.Inventors: Kunihiko AKAI, Hiroshi KAWAZOE
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Publication number: 20110044864Abstract: The present invention provides a supporting unit of microfluid system having a smaller restriction on the number of the steps and capacity of the reaction and analysis that can be produced easily, and a microfluid-system supporting unit allowing mounting of complicated fluid circuits densely. The present invention relates to a microfluid-system supporting unit, comprising a first supporting plate and at least one hollow filament constituting the channel of the microfluid system, wherein the hollow filament is placed on the first supporting plate in any shape and a particular internal region of the hollow filament has a function.Type: ApplicationFiled: November 3, 2010Publication date: February 24, 2011Applicant: HITACHI CHEMICAL CO., LTD.Inventors: Hiroshi Kawazoe, Kiyoshi Yasue, Kunihiko Akai, Yoshinori Inoue