Patents by Inventor Kunihiko Fujimoto
Kunihiko Fujimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240079345Abstract: A conductive member includes an adhesive layer and a metal foil layer. The adhesive layer consists of an adhesive composition containing conductive particles. The metal foil layer is disposed on the adhesive layer. The conductive member can be used to form, for example, a predetermined metal film.Type: ApplicationFiled: January 18, 2022Publication date: March 7, 2024Inventors: Masashi OHKOSHI, Nozomu TAKANO, Daisuke FUJIMOTO, Hiroyuki IZAWA, Tomohiko KOTAKE, Kunihiko AKAI, Yuka ITOH, Shunsuke TAKAGI
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Patent number: 11597827Abstract: To provide a resin composition, a pellet, a composite molded article, a method for manufacturing a composite molded article and a tank, all capable of enabling tight joining and integration of the polyacetal resin molded article and the polyethylene resin molded article, and of suppressing formaldehyde emission and occurrence of mold deposit. The resin composition contains a resin ingredient and melamine, the resin ingredient containing a polyacetal resin and a maleic anhydride-modified polyethylene resin, the polyacetal resin and the maleic anhydride-modified polyethylene resin following a mass proportion of (20 to 49):(80 to 51), and molar concentration of the maleic anhydride group capable of reacting with amino group of melamine contained in the resin composition being 5 to 25 ?mol/g.Type: GrantFiled: August 28, 2019Date of Patent: March 7, 2023Assignees: MITSUBISHI ENGINEERING-PLASTICS CORPORATION, JAPAN POLYETHYLENE CORPORATIONInventors: Kunihiko Fujimoto, Kei Takahashi, Ritsuya Matsumoto
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Patent number: 11384237Abstract: To provide a polyacetal resin composition which is good sliding characteristics and is less likely to produce the blister; a molded article; and a method for manufacturing the polyacetal resin composition. The polyacetal resin composition containing: (A) 100 parts by mass of a polyacetal resin; (B1) a polyolefin resin grafted with a silicone compound; (B2) a non-grafted silicone compound; and (C) 0.5 to 1.8 parts by mass of a polyolefinic lubricant, with a total of content of the silicone compound in the (B1) polyolefin resin and content of the (B2) non-grafted silicone compound, being adjusted to 0.6 to 2.5 parts by mass, per 100 parts by mass of the (A) polyacetal resin, and with (B1)/(B2), which is a ratio by mass of the content of the (B1) polyolefin resin and the content of the (B2) non-grafted silicone compound, being adjusted to 68/32 to 45/55.Type: GrantFiled: June 5, 2018Date of Patent: July 12, 2022Assignee: MITSUBISHI ENGINEERING-PLASTICS CORPORATIONInventors: Kunihiko Fujimoto, Makiko Ooshima
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Publication number: 20210198466Abstract: To provide a resin composition, a pellet, a composite molded article, a method for manufacturing a composite molded article and a tank, all capable of enabling tight joining and integration of the polyacetal resin molded article and the polyethylene resin molded article, and of suppressing formaldehyde emission and occurrence of mold deposit. The resin composition contains a resin ingredient and melamine, the resin ingredient containing a polyacetal resin and a maleic anhydride-modified polyethylene resin, the polyacetal resin and the maleic anhydride-modified polyethylene resin following a mass proportion of (20 to 49):(80 to 51), and molar concentration of the maleic anhydride group capable of reacting with amino group of melamine contained in the resin composition being 5 to 25 ?mol/g.Type: ApplicationFiled: August 28, 2019Publication date: July 1, 2021Applicants: MITSUBISHI ENGINEERING-PLASTICS CORPORATION, JAPAN POLYETHYLENE CORPORATIONInventors: Kunihiko FUJIMOTO, Kei TAKAHASHI, Ritsuya MATSUMOTO
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Patent number: 10668494Abstract: A substrate processing apparatus according to the present disclosure includes a holding unit, a nozzle, a driving unit, and a controller. The holding unit holds a substrate. The nozzle supplies a processing liquid to the substrate held on the holding unit. The driving unit moves the nozzle. The controller controls the driving unit, so as to move the nozzle while supplying the processing liquid to the substrate from the nozzle. Further, the controller controls the driving unit based on recipe information including step information including positions of first and second points above the substrate, total time for moving the nozzle between the first and second points, and a moving speed of the nozzle, so as to cause reciprocation of the nozzle.Type: GrantFiled: September 20, 2017Date of Patent: June 2, 2020Assignee: Tokyo Electron LimitedInventors: Go Ayabe, Minoru Tashiro, Kunihiko Fujimoto
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Publication number: 20200115542Abstract: To provide a polyacetal resin composition which is good sliding characteristics and is less likely to produce the blister; a molded article; and a method for manufacturing the polyacetal resin composition. The polyacetal resin composition containing: (A) 100 parts by mass of a polyacetal resin; (B1) a polyolefin resin grafted with a silicone compound; (B2) a non-grafted silicone compound; and (C) 0.5 to 1.8 parts by mass of a polyolefinic lubricant, with a total of content of the silicone compound in the (B1) polyolefin resin and content of the (B2) non-grafted silicone compound, being adjusted to 0.6 to 2.5 parts by mass, per 100 parts by mass of the (A) polyacetal resin, and with (B1)/(B2), which is a ratio by mass of the content of the (B1) polyolefin resin and the content of the (B2) non-grafted silicone compound, being adjusted to 68/32 to 45/55.Type: ApplicationFiled: June 5, 2018Publication date: April 16, 2020Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATIONInventors: Kunihiko FUJIMOTO, Makiko OOSHIMA
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Patent number: 10254816Abstract: A control unit of a substrate processing apparatus has a storage medium that stores operation commands as a single macro. The operation commands include an operation command for shutdown of the substrate processing apparatus by which the substrate processing apparatus is automatically transferred from a normally-operating condition to a condition suitable for man power maintenance, and an operation command for startup of the substrate processing apparatus by which the substrate processing apparatus is automatically transferred to a condition suitable for normal operation after completion of the man power maintenance. The control unit makes a display unit display both the operation commands for shutdown and startup together on a single ejection screen of the display unit, and allows editing of the macro on the single edit screen by using the input unit.Type: GrantFiled: January 30, 2015Date of Patent: April 9, 2019Assignee: Tokyo Electron LimitedInventors: Seiichiro Yuasa, Kunihiko Fujimoto
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Patent number: 10131781Abstract: The invention is a polyacetal resin composition containing a polyacetal resin (A) and a polyethylene resin (B), in which the blending proportion of the polyacetal resin (A) occupying in the total mass of the polyacetal resin (A) and the polyethylene resin (B) is 10 to 90 mass %, the melt flow rate of the polyacetal resin (A) measured at a condition of 190° C. and 2.16 kg load is 30 g/10 minutes or less, and the polyethylene resin (B) consists of a modified polyethylene resin and the modification rate is 0.01 mass % or more based on 100 mass % of the total mass of the polyethylene resin and the melt flow rate of the polyethylene resin (B) measured at a condition of 190° C. and 2.16 kg load is 2.5 g/10 minutes or less.Type: GrantFiled: August 1, 2013Date of Patent: November 20, 2018Assignees: MITSUBISHI ENGINEERING-PLASTICS CORPORATION, JAPAN POLYETHYLENE CORPORATIONInventors: Ryusuke Yamada, Masayuki Nagai, Satoshi Nagai, Kunihiko Fujimoto, Kei Takahashi
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Publication number: 20180085769Abstract: A substrate processing apparatus according to the present disclosure includes a holding unit, a nozzle, a driving unit, and a controller. The holding unit holds a substrate. The nozzle supplies a processing liquid to the substrate held on the holding unit. The driving unit moves the nozzle. The controller controls the driving unit, so as to move the nozzle while supplying the processing liquid to the substrate from the nozzle. Further, the controller controls the driving unit based on recipe information including step information including positions of first and second points above the substrate, total time for moving the nozzle between the first and second points, and a moving speed of the nozzle, so as to cause reciprocation of the nozzle.Type: ApplicationFiled: September 20, 2017Publication date: March 29, 2018Inventors: Go Ayabe, Minoru Tashiro, Kunihiko Fujimoto
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Patent number: 9850367Abstract: Provided is a polyacetal resin composition in which at least one dihydrazone compound (B) selected from the group of two kinds of dihydrazone compounds is blended in 0.02 to 5 parts by mass with respect to 100 parts by mass of a polyacetal resin (A).Type: GrantFiled: January 27, 2015Date of Patent: December 26, 2017Assignee: MITSUBISHI ENGINEERING-PLASTICS CORPORATIONInventors: Makiko Oshima, Kunihiko Fujimoto, Masayuki Nagai, Hidetoshi Nawata, Koki Sato, Ryusuke Tamaki
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Publication number: 20160333170Abstract: Provided is a polyacetal resin composition in which at least one dihydrazone compound (B) selected from the group of two kinds of dihydrazone compounds is blended in 0.02 to 5 parts by mass with respect to 100 parts by mass of a polyacetal resin (A).Type: ApplicationFiled: January 27, 2015Publication date: November 17, 2016Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATIONInventors: Makiko OSHIMA, Kunihiko FUJIMOTO, Masayuki NAGAI, Hidetoshi NAWATA, Koki SATO, Ryusuke TAMAKI
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Publication number: 20150220136Abstract: A control unit of a substrate processing apparatus has a storage medium that stores operation commands as a single macro. The operation commands include an operation command for shutdown of the substrate processing apparatus by which the substrate processing apparatus is automatically transferred from a normally-operating condition to a condition suitable for man power maintenance, and an operation command for startup of the substrate processing apparatus by which the substrate processing apparatus is automatically transferred to a condition suitable for normal operation after completion of the man power maintenance. The control unit makes a display unit display both the operation commands for shutdown and startup together on a single ejection screen of the display unit, and allows editing of the macro on the single edit screen by using the input unit.Type: ApplicationFiled: January 30, 2015Publication date: August 6, 2015Inventors: Seiichiro YUASA, Kunihiko FUJIMOTO
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Publication number: 20150183982Abstract: The invention is a polyacetal resin composition containing a polyacetal resin (A) and a polyethylene resin (B), in which the blending proportion of the polyacetal resin (A) occupying in the total mass of the polyacetal resin (A) and the polyethylene resin (B) is 10 to 90 mass %, the melt flow rate of the polyacetal resin (A) measured at a condition of 190° C. and 2.16 kg load is 30 g/10 minutes or less, and the polyethylene resin (B) consists of a modified polyethylene resin and the modification rate is 0.01 mass % or more based on 100 mass % of the total mass of the polyethylene resin and the melt flow rate of the polyethylene resin (B) measured at a condition of 190° C. and 2.16 kg load is 2.5 g/10 minutes or less.Type: ApplicationFiled: August 1, 2013Publication date: July 2, 2015Applicants: JAPAN POLYETHYLENE CORPORATION, MITSUBISHI ENGINEERING-PLASTICS CORPORATIONInventors: Ryusuke Yamada, Masayuki Nagai, Satoshi Nagai, Kunihiko Fujimoto, Kei Takahashi
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Patent number: 8846788Abstract: A polyacetal resin composition containing 100 parts by weight of a polyacetal resin, 0.01 to 5 parts by weight of a colorant selected from inorganic and organic pigments, 0.01 to 3 parts by weight of a polyamide resin having a melting point or softening point of 180° C. or less, or a polyetheresteramide resin, 0.01 to 1 part by weight of an aromatic dihydrazide compound or an aliphatic dihydrazide compound having a solubility of less than 1 g relative to 100 g of water at 20° C., and 0.01 to 1 part by weight of a sterically hindered phenolic compound, or a combination of a hindered amine-based light stabilizer and an ultraviolet absorber, exhibits an excellent thermal stability and is capable of suppressing formaldehyde generation and mechanical strength deterioration.Type: GrantFiled: September 3, 2009Date of Patent: September 30, 2014Assignee: Mitsubishi Engineering-Plastics CorporationInventors: Masayuki Nagai, Kunihiko Fujimoto
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Publication number: 20110230602Abstract: A polyacetal resin composition containing 100 parts by weight of a polyacetal resin, 0.01 to 5 parts by weight of a colorant selected from inorganic and organic pigments, 0.01 to 3 parts by weight of a polyamide resin having a melting point or softening point of 180° C. or less, or a polyetheresteramide resin, 0.01 to 1 part by weight of an aromatic dihydrazide compound or an aliphatic dihydrazide compound having a solubility of less than 1 g relative to 100 g of water at 20° C., and 0.01 to 1 part by weight of a sterically hindered phenolic compound, or a combination of a hindered amine-based light stabilizer and an ultraviolet absorber, exhibits an excellent thermal stability and is capable of suppressing formaldehyde generation and mechanical strength deterioration.Type: ApplicationFiled: September 3, 2009Publication date: September 22, 2011Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATIONInventors: Masayuki Nagai, Kunihiko Fujimoto