Abstract: Network game system comprising: a center server is provided with means for storing object data received from each arcade system in a database, means for executing a competing game using data on the basis of each object data, and means for distributing the arcade ID, and player ID corresponding to the object data which won the race to each arcade server; the arcade server is provided with means for comparing the arcade ID received from the center server with a player's own arcade ID, and when they match each other, for transmitting the player ID to a game device within the arcade system; the game device is provided by comparing the player ID received from the arcade server with the player ID of an storage medium, and when they match each other, for judging that the player is the winner, and for writing bonus data into the storage medium.

Abstract: A ceramic base used for a semiconductor device is plate-shaped and is made of a material consisting essentially of ceramic. In plan view, the base is rectangular and has four corner portions each located between two adjacent side walls. The corner portion comprises a main bevel and two auxiliary bevels located at respective sides of the main bevel and extending to the two side walls, respectively, so that two first corners are defined between the main bevel and the auxiliary bevels, respectively, and two second corners are defined between the auxiliary bevels and the side walls of the base, respectively.

Abstract: A ceramic package used for a semiconductor device comprises a ceramic base including a die-bonding area and wire-bonding areas defined. A metal underlayer formed on the die-bonding or wire-bonding areas essentially consists of two-plated layers of: a cobalt layer plated on the ceramic base and a nickel layer plated on the cobalt layer. The underlayer is annealed and, them, a gold-plated layer is formed on the underlayer.

Abstract: A ceramic package for semiconductor devices comprises a ceramic base, a gold-plated die-bonding area formed on the base for mounting thereon a semiconductor die, a gold-plated wire-bonding area, and a plurality of outerlead portions for electrically connecting the package to external printed circuits or the like. Cobalt or cobalt alloy, instead of nickel, is plated on the die-bonding and wire-bonding areas as underlayers of the gold-plated layers. Cobalt can also be plated on the outerlead portions, which may or may not have gold plated thereon.

Abstract: The present invention provides a process for distillation of styrenes which can be stably operated without loss of energy saving effect, by leading a part or all of low boiling point component vapor from the top to a compressor to use as a heat source for a reboiler and returning the low boiling point components condensed in the reboiler or a mixture of the condensate and a part of the uncondensed vapor to a recycling line of a distillation column.