Abstract: One embodiment of the present invention relates to a method of manufacturing a green sheet, a method of manufacturing a silicon nitride sintered body, or a green sheet molding material. The method of manufacturing the green sheet includes a step of obtaining a silicon nitride water slurry that contains at least silicon nitride, water, and a binder and whose water blending amount is 10 to 70 parts by mass per 100 parts by mass of silicon nitride, a decompression treatment step of decompressing the silicon nitride water slurry to obtain a slurry for green sheet molding, and a sheet molding step of molding the slurry for green sheet molding to obtain a sheet molded body.

Abstract: An element-mounting substrate includes a ceramic substrate, an electrode layer formed on the substrate and a ceramic coating layer which is formed on a part of the electrode layer and has a thickness of 5 to 50 ?m. A process for producing the element-mounting substrate includes the steps of forming an electrode precursor layer in the shape of a pattern of an electrode layer on a ceramic plate or a green sheet of a large diameter, forming a ceramic coating precursor layer on a part of the electrode precursor layer and then firing the resulting precursor. In this process, it is preferable to form the ceramic coating layer so as to cover the electrode layer on a predetermined cutting line of the firing product. According to the element-mounting substrate in which a part of the electrode layer is covered with a ceramic, a failure in mounting an element attributable to the thickness of the ceramic coating layer can be prevented when the element is mounted.

Abstract: An element-mounting substrate includes a ceramic substrate, an electrode layer formed on the substrate and a ceramic coating layer which is formed on a part of the electrode layer and has a thickness of 5 to 50 ?m. A process for producing the element-mounting substrate includes the steps of forming an electrode precursor layer in the shape of a pattern of an electrode layer on a ceramic plate or a green sheet of a large diameter, forming a ceramic coating precursor layer on a part of the electrode precursor layer and then firing the resulting precursor. In this process, it is preferable to form the ceramic coating layer so as to cover the electrode layer on a predetermined cutting line of the firing product. According to the element-mounting substrate in which a part of the electrode layer is covered with a ceramic, a failure in mounting an element attributable to the thickness of the ceramic coating layer can be prevented when the element is mounted.

Abstract: The process for producing a metallized ceramic substrate of the present invention comprises a step (A) of preparing a raw material substrate comprising a ceramic substrate which may have on its surface a conductive layer or a conductor paste layer, a step (B) of preparing a metallized ceramic substrate precursor, said step (B) comprising a step of forming a ceramic paste layer on the raw material substrate and a step of forming a conductive paste layer on the ceramic paste layer, and a step (C) of firing the metallized ceramic substrate precursor obtained in the previous step. In the step (B), formation of a ceramic paste layer and formation of a conductive paste layer may be alternately repeated plural times. According to the present invention, running or spreading of the conductive paste is prevented, and a metallized ceramic substrate which has a high degree of freedom of wiring design and high reliability and has a fine metallization pattern can be produced.