Patents by Inventor Kunihiro Inada

Kunihiro Inada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Antenna core and antenna
    Patent number: 8035569
    Abstract: An antenna core produced by shaping a soft magnetic metal powder with the use of a resin as a binder, wherein the soft magnetic metal powder is an amorphous soft magnetic metal powder or a nanocrystal-containing amorphous soft magnetic metal powder, of the general formula (1): (Fe1-x-yCoxNiy)100-a-b-cSiaBbMc (1), and wherein the resin as a binder is a thermosetting resin. In the formula, M is at least one element selected from the group consisting of Nb, Mo, Zr, W, Ta, Hf, Ti, V, Cr, Mn, Y, Pd, Ru, Ga, Ge, C, P, Al, Cu, Au, Ag, Sn and Sb. Each of x and y is an atomic ratio and each of a, b and c an atomic %, satisfying the relationships: 0?x?1.0, 0?y?0.5, 0?x+y?1.0, 0?a?24, 1?b?30, 0?c?30 and 2?a+b?30.
    Type: Grant
    Filed: August 9, 2007
    Date of Patent: October 11, 2011
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Nobuhiro Maruko, Kunihiro Inada, Takehiko Omi, Mitsunobu Yoshida, Hiroshi Watanabe
  • ANTENNA CORE AND ANTENNA
    Publication number: 20090267855
    Abstract: An antenna core produced by shaping a soft magnetic metal powder with the use of a resin as a binder, wherein the soft magnetic metal powder is an amorphous soft magnetic metal powder or a nanocrystal-containing amorphous soft magnetic metal powder, of the general formula (1): (Fe1-x-yCoxNiy)100-a-b-cSiaBbMc (1), and wherein the resin as a binder is a thermosetting resin. In the formula, M is at least one element selected from the group consisting of Nb, Mo, Zr, W, Ta, Hf, Ti, V, Cr, Mn, Y, Pd, Ru, Ga, Ge, C, P, Al, Cu, Au, Ag, Sn and Sb. Each of x and y is an atomic ratio and each of a, b and c an atomic %, satisfying the relationships: 0?x?1.0, 0?y?0.5, 0?x+y?1.0, 0?a?24, 1?b?30, 0?c?30 and 2?a+b?30.
    Type: Application
    Filed: August 9, 2007
    Publication date: October 29, 2009
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Nobuhiro Maruko, Kunihiro Inada, Takehiko Omi, Mitsunobu Yoshida, Hiroshi Watanabe
  • Circuit board and method of producing the same
    Patent number: 6764747
    Abstract: A circuit board comprising a resin molded article which includes a metal powder coated by an insulation film and a metal conductor which is formed by metal deposition over a circuit pattern drawn by laser beam irradiation on the surface of the resin molded article through electroless plating, and the method of producing the same.
    Type: Grant
    Filed: December 27, 2002
    Date of Patent: July 20, 2004
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Toshiya Urakawa, Youhei Suzuki, Kunihiro Inada, Yasuyuki Kawano
  • Circuit board and method of producing the same
    Publication number: 20030129371
    Abstract: A circuit board comprising a resin molded article which includes a metal powder coated by an insulation film and a metal conductor which is formed by metal deposition over a circuit pattern drawn by laser beam irradiation on the surface of the resin molded article through electroless plating, and the method of producing the same.
    Type: Application
    Filed: December 27, 2002
    Publication date: July 10, 2003
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Toshiya Urakawa, Youhei Suzuki, Kunihiro Inada, Yasuyuki Kawano