Patents by Inventor Kunihiro Komiya
Kunihiro Komiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240136241Abstract: The semiconductor device has the CSP structure and may include a plurality of electrode pads formed on a semiconductor integrated circuit in order to input/output signals from/to exterior; solder bumps for making external lead electrodes; and rewiring. The solder bumps may be arranged in two rows along the periphery of the semiconductor device. The electrode pads may be arranged inside the outermost solder bumps so as to be interposed between the two rows of solder bumps. Each trace of the rewiring may be extended from an electrode pad and may be connected to any one of the outermost solder bumps or any one of the inner solder bumps.Type: ApplicationFiled: December 28, 2023Publication date: April 25, 2024Inventor: Kunihiro KOMIYA
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Patent number: 11901251Abstract: The semiconductor device has the CSP structure and may include a plurality of electrode pads formed on a semiconductor integrated circuit in order to input/output signals from/to exterior; solder bumps for making external lead electrodes; and rewiring. The solder bumps may be arranged in two rows along the periphery of the semiconductor device. The electrode pads may be arranged inside the outermost solder bumps so as to be interposed between the two rows of solder bumps. Each trace of the rewiring may be extended from an electrode pad and may be connected to any one of the outermost solder bumps or any one of the inner solder bumps.Type: GrantFiled: June 30, 2022Date of Patent: February 13, 2024Assignee: ROHM CO., LTDInventor: Kunihiro Komiya
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Publication number: 20220336305Abstract: The semiconductor device has the CSP structure and may include a plurality of electrode pads formed on a semiconductor integrated circuit in order to input/output signals from/to exterior; solder bumps for making external lead electrodes; and rewiring. The solder bumps may be arranged in two rows along the periphery of the semiconductor device. The electrode pads may be arranged inside the outermost solder bumps so as to be interposed between the two rows of solder bumps. Each trace of the rewiring may be extended from an electrode pad and may be connected to any one of the outermost solder bumps or any one of the inner solder bumps.Type: ApplicationFiled: June 30, 2022Publication date: October 20, 2022Inventor: Kunihiro KOMIYA
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Patent number: 11410900Abstract: The semiconductor device has the CSP structure, and may include a plurality of electrode pads formed on a semiconductor integrated circuit in order to input/output signals from/to exterior; solder bumps for making external lead electrodes; and rewiring. The solder bumps may be arranged in two rows along the periphery of the semiconductor device. The electrode pads may be arranged inside the outermost solder bumps so as to be interposed between the two rows of solder bumps. Each trace of the rewiring may be extended from an electrode pad, and may be connected to any one of the outermost solder bumps or any one of the inner solder bumps.Type: GrantFiled: April 22, 2020Date of Patent: August 9, 2022Assignee: ROHM CO., LTD.Inventor: Kunihiro Komiya
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Publication number: 20200251394Abstract: The semiconductor device has the CSP structure, and may include a plurality of electrode pads formed on a semiconductor integrated circuit in order to input/output signals from/to exterior; solder bumps for making external lead electrodes; and rewiring. The solder bumps may be arranged in two rows along the periphery of the semiconductor device. The electrode pads may be arranged inside the outermost solder bumps so as to be interposed between the two rows of solder bumps. Each trace of the rewiring may be extended from an electrode pad, and may be connected to any one of the outermost solder bumps or any one of the inner solder bumps.Type: ApplicationFiled: April 22, 2020Publication date: August 6, 2020Inventor: Kunihiro KOMIYA
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Patent number: 10665518Abstract: The semiconductor device has the CSP structure, and may include a plurality of electrode pads formed on a semiconductor integrated circuit in order to input/output signals from/to exterior; solder bumps for making external lead electrodes; and rewiring. The solder bumps may be arranged in two rows along the periphery of the semiconductor device. The electrode pads may be arranged inside the outermost solder bumps so as to be interposed between the two rows of solder bumps. Each trace of the rewiring may be extended from an electrode pad, and may be connected to any one of the outermost solder bumps or any one of the inner solder bumps.Type: GrantFiled: October 16, 2018Date of Patent: May 26, 2020Assignee: ROHM CO., LTD.Inventor: Kunihiro Komiya
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Publication number: 20190051572Abstract: The semiconductor device has the CSP structure, and may include a plurality of electrode pads formed on a semiconductor integrated circuit in order to input/output signals from/to exterior; solder bumps for making external lead electrodes; and rewiring. The solder bumps may be arranged in two rows along the periphery of the semiconductor device. The electrode pads may be arranged inside the outermost solder bumps so as to be interposed between the two rows of solder bumps. Each trace of the rewiring may be extended from an electrode pad, and may be connected to any one of the outermost solder bumps or any one of the inner solder bumps.Type: ApplicationFiled: October 16, 2018Publication date: February 14, 2019Inventor: Kunihiro KOMIYA
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Patent number: 10134653Abstract: The semiconductor device has the CSP structure, and may include a plurality of electrode pads formed on a semiconductor integrated circuit in order to input/output signals from/to exterior; solder bumps for making external lead electrodes; and rewiring. The solder bumps may be arranged in two rows along the periphery of the semiconductor device. The electrode pads may be arranged inside the outermost solder bumps so as to be interposed between the two rows of solder bumps. Each trace of the rewiring may be extended from an electrode pad, and may be connected to any one of the outermost solder bumps or any one of the inner solder bumps.Type: GrantFiled: May 31, 2017Date of Patent: November 20, 2018Assignee: ROHM CO., LTD.Inventor: Kunihiro Komiya
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Patent number: 10134250Abstract: A sensor system includes: a radio transmitting device transmitting a predetermined radio signal regularly; a sensor detecting opening/closing or locking/unlocking of a partition mechanism installed in a door of a building or a site; and an information processing device. The information processing device includes: a radio receiving part receiving the predetermined radio signal and result of detection of the sensor; a decision part deciding whether or not a person exists in the building or the site, based on the radio signal; a determination part determining the decision on existence of the person every trigger timing being a timing defined based on the result of the detection of the sensor; an information generation part generating information related to the behavior of the person based on the decision on existence of the person determined at the trigger timing; and an information output part outputting the information generated by the information generation part.Type: GrantFiled: October 21, 2016Date of Patent: November 20, 2018Assignee: Rohm Co., Ltd.Inventors: Takeya Shigezumi, Kunihiro Komiya, Kenta Konishi
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Publication number: 20170263520Abstract: The semiconductor device has the CSP structure, and may include a plurality of electrode pads formed on a semiconductor integrated circuit in order to input/output signals from/to exterior; solder bumps for making external lead electrodes; and rewiring. The solder bumps may be arranged in two rows along the periphery of the semiconductor device. The electrode pads may be arranged inside the outermost solder bumps so as to be interposed between the two rows of solder bumps. Each trace of the rewiring may be extended from an electrode pad, and may be connected to any one of the outermost solder bumps or any one of the inner solder bumps.Type: ApplicationFiled: May 31, 2017Publication date: September 14, 2017Inventor: Kunihiro KOMIYA
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Patent number: 9691678Abstract: The semiconductor device has the CSP structure, and may include a plurality of electrode pads formed on a semiconductor integrated circuit in order to input/output signals from/to exterior; solder bumps for making external lead electrodes; and rewiring. The solder bumps may be arranged in two rows along the periphery of the semiconductor device. The electrode pads may be arranged inside the outermost solder bumps so as to be interposed between the two rows of solder bumps. Each trace of the rewiring may be extended from an electrode pad, and may be connected to any one of the outermost solder bumps or any one of the inner solder bumps.Type: GrantFiled: June 9, 2016Date of Patent: June 27, 2017Assignee: ROHM CO., LTD.Inventor: Kunihiro Komiya
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Publication number: 20170154849Abstract: A semiconductor device including a multiplicity of large current power elements with each power element divided into a multiplicity of divisional elements and arranged such that the power elements belonging to different power elements are arranged in a repetitive sequential order. The IC chip of the semiconductor device is formed to have output wires extending from the respective divisional elements connected to corresponding output pads without crossing other output wires. Arranged on the IC chip are output bumps in association with the respective output pads. A rewiring layer is provided having output coupling wires for connecting together the bumps that belong to the same power element and connecting them further to an external output electrode.Type: ApplicationFiled: February 10, 2017Publication date: June 1, 2017Applicant: ROHM CO., LTD.Inventor: KUNIHIRO KOMIYA
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Publication number: 20170116829Abstract: A sensor system includes: a radio transmitting device transmitting a predetermined radio signal regularly; a sensor detecting opening/closing or locking/unlocking of a partition mechanism installed in a door of a building or a site; and an information processing device. The information processing device includes: a radio receiving part receiving the predetermined radio signal and result of detection of the sensor; a decision part deciding whether or not a person exists in the building or the site, based on the radio signal; a determination part determining the decision on existence of the person every trigger timing being a timing defined based on the result of the detection of the sensor; an information generation part generating information related to the behavior of the person based on the decision on existence of the person determined at the trigger timing; and an information output part outputting the information generated by the information generation part.Type: ApplicationFiled: October 21, 2016Publication date: April 27, 2017Inventors: Takeya SHIGEZUMI, Kunihiro KOMIYA, Kenta KONISHI
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Patent number: 9607945Abstract: A semiconductor device including a multiplicity of large current power elements with each power element divided into a multiplicity of divisional elements and arranged such that the power elements belonging to different power elements are arranged in a repetitive sequential order. The IC chip of the semiconductor device is formed to have output wires extending from the respective divisional elements connected to corresponding output pads without crossing other output wires. Arranged on the IC chip are output bumps in association with the respective output pads. A rewiring layer is provided having output coupling wires for connecting together the bumps that belong to the same power element and connecting them further to an external output electrode.Type: GrantFiled: August 7, 2015Date of Patent: March 28, 2017Assignee: ROHM CO., LTD.Inventor: Kunihiro Komiya
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Publication number: 20160293510Abstract: The semiconductor device has the CSP structure, and may include a plurality of electrode pads formed on a semiconductor integrated circuit in order to input/output signals from/to exterior; solder bumps for making external lead electrodes; and rewiring. The solder bumps may be arranged in two rows along the periphery of the semiconductor device. The electrode pads may be arranged inside the outermost solder bumps so as to be interposed between the two rows of solder bumps. Each trace of the rewiring may be extended from an electrode pad, and may be connected to any one of the outermost solder bumps or any one of the inner solder bumps.Type: ApplicationFiled: June 9, 2016Publication date: October 6, 2016Inventor: Kunihiro KOMIYA
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Patent number: 9391033Abstract: The semiconductor device has the CSP structure, and may include a plurality of electrode pads formed on a semiconductor integrated circuit in order to input/output signals from/to exterior; solder bumps for making external lead electrodes; and rewiring. The solder bumps may be arranged in two rows along the periphery of the semiconductor device. The electrode pads may be arranged inside the outermost solder bumps so as to be interposed between the two rows of solder bumps. Each trace of the rewiring may be extended from an electrode pad, and may be connected to any one of the outermost solder bumps or any one of the inner solder bumps.Type: GrantFiled: March 16, 2015Date of Patent: July 12, 2016Assignee: ROHM CO., LTD.Inventor: Kunihiro Komiya
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Publication number: 20160146856Abstract: A current sensor has a measurement unit for measuring the current flowing through an electrical wire using electromagnetic induction caused by the magnetic flux around the electrical wire, a wireless transmission unit for wirelessly transmitting measurement results, a power generation unit for generating power using the same electromagnetic induction caused by the magnetic flux around the electrical wire, and a battery that is charged by the power generation unit and supplies power to the measurement unit and the wireless transmission unit. A sudden change in the current flowing through the electrical wire causes measurement to be carried out. The timing at which transmission is carried out is controlled according to the size of the current flowing through the electrical wire. When the measurement unit is measuring, power generation by the power generation unit is stopped. Measurement results obtained during insufficient charging are stored and sent after charge is secured.Type: ApplicationFiled: June 11, 2014Publication date: May 26, 2016Applicant: ROHM Co., Ltd.Inventors: Kunihiro Komiya, Masahide Tanaka
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Publication number: 20160071798Abstract: A semiconductor device including a multiplicity of large current power elements with each power element divided into a multiplicity of divisional elements and arranged such that the power elements belonging to different power elements are arranged in a repetitive sequential order. The IC chip of the semiconductor device is formed to have output wires extending from the respective divisional elements connected to corresponding output pads without crossing other output wires. Arranged on the IC chip are output bumps in association with the respective output pads. A rewiring layer is provided having output coupling wires for connecting together the bumps that belong to the same power element and connecting them further to an external output electrode.Type: ApplicationFiled: August 7, 2015Publication date: March 10, 2016Applicant: ROHM CO., LTD.Inventor: Kunihiro KOMIYA
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Publication number: 20150200170Abstract: The semiconductor device has the CSP structure, and may include a plurality of electrode pads formed on a semiconductor integrated circuit in order to input/output signals from/to exterior; solder bumps for making external lead electrodes; and rewiring. The solder bumps may be arranged in two rows along the periphery of the semiconductor device. The electrode pads may be arranged inside the outermost solder bumps so as to be interposed between the two rows of solder bumps. Each trace of the rewiring may be extended from an electrode pad, and may be connected to any one of the outermost solder bumps or any one of the inner solder bumps.Type: ApplicationFiled: March 16, 2015Publication date: July 16, 2015Inventor: Kunihiro KOMIYA
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Patent number: 9006885Abstract: The semiconductor device has the CSP structure, and may include a plurality of electrode pads formed on a semiconductor integrated circuit in order to input/output signals from/to exterior; solder bumps for making external lead electrodes; and rewiring. The solder bumps may be arranged in two rows along the periphery of the semiconductor device. The electrode pads may be arranged inside the outermost solder bumps so as to be interposed between the two rows of solder bumps. Each trace of the rewiring may be extended from an electrode pad, and may be connected to any one of the outermost solder bumps or any one of the inner solder bumps.Type: GrantFiled: January 7, 2014Date of Patent: April 14, 2015Assignee: Rohm Co., Ltd.Inventor: Kunihiro Komiya