Abstract: Provided is a film-forming method based on an LB method by which a uniform alignment film using a helical polyacetylene can be obtained. The method based on the LB method includes: developing a helical polyacetylene onto a liquid surface; and transferring a monolayer film of the helical polyacetylene formed on the liquid surface onto a substrate to form a film, in which a compressibility P represented by the following formula (1) at a time of the film formation is 1×10?2 m/mN or less: P=(1/(dH/dS))×(1/S) (1), where H represents a surface pressure (mN/m) of the monolayer film of the helical polyacetylene, and S represents an area (m2) of the monolayer film of the helical polyacetylene developed onto the liquid surface.

Abstract: A helical-polyacetylene whose main chain has a helical structure includes a carbon double bond constituting the main chain and a side chain composed of an aromatic five- or six-membered ring that binds to one carbon atom of the carbon double bond. In the atoms constituting the five- or six-membered ring, two atoms binding to the atom that directly binds to the carbon atom of the main chain bind only any of five or six atoms constituting the five- or six-membered ring, and in the atoms constituting the five- or six-membered ring, at least one atom located most distant from the atom that directly binds to the carbon atom of the main chain is carbon.

Abstract: Provided is a film-forming method based on an LB method by which a uniform alignment film using a helical polyacetylene can be obtained. The method based on the LB method includes: developing a helical polyacetylene onto a liquid surface; and transferring a monolayer film of the helical polyacetylene formed on the liquid surface onto a substrate to form a film, in which a compressibility P represented by the following formula (1) at a time of the film formation is 1×10?2 m/mN or less: P=(1/(dH/dS))×(1/S) (1), where H represents a surface pressure (mN/m) of the monolayer film of the helical polyacetylene, and S represents an area (m2) of the monolayer film of the helical polyacetylene developed onto the liquid surface.

Abstract: A method of searching for clustering faults is employed for semiconductor device manufacturing. The method enters data on faults present in a search target, calculates a frequency distribution of the faults in unit cells divided from the search target, approximates the frequency distribution by overlaying at least two discrete distribution functions, and searches for clustering faults according to weights of the discrete distribution functions on the frequency distribution.

Abstract: An equipment for detecting faults in semiconductor integrated circuits includes a fault input unit to input fault information for the integrated circuits formed on a semiconductor wafer, a superimposing unit to superimpose the fault information with repeating units within the surface of the semiconductor wafer, and a first characteristic factor calculation unit to calculate a first characteristic factor showing a degree to which faults are repeated every repeating unit.

Abstract: A method of searching for clustering faults is employed for semiconductor device manufacturing. The method enters data on faults present in a search target, calculates a frequency distribution of the faults in unit cells divided from the search target, approximates the frequency distribution by overlaying at least two discrete distribution functions, and searches for clustering faults according to weights of the discrete distribution functions on the frequency distribution.

Abstract: A method of searching for clustering faults is employed for semiconductor device manufacturing, The method enters data on faults present in a search target, calculates a frequency distribution of the faults in unit cells divided from the search target, approximates the frequency distribution by overlaying at least two discrete distribution functions, and searches for clustering faults according to weights of the discrete distribution functions on the frequency distribution.

Abstract: An electronic commerce for semiconductor products comprises a network, a client terminal, a connection server, a virtual production line, and a real production line. The real production line actually manufactures semiconductor products. The virtual production line provides a computer with substantially the same functions as the real production line and computes an optimal lot progress. The connection server connects the virtual production line to the client terminal via the network. When a condition is entered from the client terminal, the connection server transfers this condition to the virtual production line. Simulation is performed realtime for determining whether a product flows in the virtual production line under the transferred condition. The connection server transfers a simulation result to the client terminal. Based on the simulation result, a electronic commerce is conducted.

Abstract: An electronic commerce for semiconductor products comprises a network, a client terminal, a connection server, a virtual production line, and a real production line. The real production line actually manufactures semiconductor products. The virtual production line provides a computer with substantially the same functions as the real production line and computes an optimal lot progress. The connection server connects the virtual production line to the client terminal via the network. When a condition is entered from the client terminal, the connection server transfers this condition to the virtual production line. Simulation is performed realtime for determining whether a product flows in the virtual production line under the transferred condition. The connection server transfers a simulation result to the client terminal. Based on the simulation result, a electronic commerce is conducted.

Abstract: An equipment for detecting faults in semiconductor integrated circuits includes a fault input unit to input fault information for the integrated circuits formed on a semiconductor wafer, a superimposing unit to superimpose the fault information with repeating units within the surface of the semiconductor wafer, and a first characteristic factor calculation unit to calculate a first characteristic factor showing a degree to which faults are repeated every repeating unit.

Abstract: A method of searching for clustering faults is employed for semiconductor device manufacturing, The method enters data on faults present in a search target, calculates a frequency distribution of the faults in unit cells divided from the search target, approximates the frequency distribution by overlaying at least two discrete distribution functions, and searches for clustering faults according to weights of the discrete distribution functions on the frequency distribution.

Abstract: An electronic commerce for semiconductor products comprises a network, a client terminal, a connection server, a virtual production line, and a real production line. The real production line actually manufactures semiconductor products. The virtual production line provides a computer with substantially the same functions as the real production line and computes an optimal lot progress. The connection server connects the virtual production line to the client terminal via the network. When a condition is entered from the client terminal, the connection server transfers this condition to the virtual production line. Simulation is performed realtime for determining whether a product flows in the virtual production line under the transferred condition. The connection server transfers a simulation result to the client terminal. Based on the simulation result, a electronic commerce is conducted.