Abstract: A tray for accommodating electronic components with edge portions and contacts includes a main portion for forming the tray, and a plurality of accommodation cavities formed in the tray for accommodating a plurality of electronic components therein. Each accommodation cavity includes partition walls for surrounding the electronic components, support steps extending horizontally inwardly from lower ends of the partition walls to form a first space therein and to support the edge portions of the electronic component, and descending walls extending downwardly from the support steps to define the first space. Each partition wall has a lower portion with a first inclination for a mold removing operation, and each descending wall has a second inclination greater than that of the first inclination to be able to contact and support an edge of the electronic component when falling from the edge portion.

Abstract: A carrier for transporting electronic components is provided for enhancing the reliability in parts transportation by preventing an electronic components from being damaged during the transportation.