Abstract: A terminal frame used to manufacture electronic devices, the terminal frame having a metal strip and a plurality of stick-like metal terminals. The metal terminals are joined to the metal strip by resistance welding. A manufacturing system of such terminal frames includes a device used for resistance welding, where the device has an electrode which holds each terminal at a portion near a joint portion, and a current is supplied to the terminal through the electrode.

Abstract: A composite electronic component including a resonator element and a capacitor element fixed together by adhesive material. The capacitor element is longer than the resonator element, so that side steps are defined on both end portions of the elements. First and second lead terminals are connected by solder with first and second capacitor electrodes located on a front surface of the capacitor element and with resonator electrodes located on side surfaces of the resonator element exposed at the side steps. A third lead terminal is connected by solder with a third capacitor electrode located on a rear surface of the capacitor element. Therefore, the thin and miniature composite electronic component adapted for a Colpitts oscillation circuit is obtained at a low cost.

Abstract: In this apparatus, a ceramic green sheet which may be formed with internal electrodes for forming laminated ceramic capacitors, is first punched out by a punch. After this punching operation, the punched-out ceramic green sheet held by the punch is conveyed to a transfer head by the punch and then conveyed to a stacking block by the transfer head. With these steps repeated, a plurality of punched-out ceramic green sheets are stacked on the stacking block. Each time a punched-out ceramic green sheet is stacked on the stacking block, a hot iron is applied to the uppermost one of the punched-out ceramic green sheets so as to pressure-weld it to the underlying punched-out ceramic green sheet.

Abstract: In this method and apparatus, a ceramic green sheet, which may be formed with internal electrodes for forming laminated ceramic capacitors, is first punched out by a punch. After this punching operation, the ceramic green sheet held by the punch is conveyed to a transfer head by the punch and then conveyed to a stacking block by the transfer head. With these steps repeated, a plurality of ceramic green sheets are stacked on the stacking block. Each time a ceramic green sheet is stacked on the stacking block, a hot iron is applied to the uppermost one of the ceramic green sheets so as to pressure-weld it to the underlying ceramic green sheet.

Abstract: An electronic component with lead terminals, includes an electronic component element, electrodes respectively formed on opposite end faces of the electronic component element, and lead terminals respectively connected to the electrodes for electrical conduction, and each of the lead terminals having a large width portion formed at one end of its small width tip portion, and the large width portions of the lead terminals being conductively connected to the electrodes of the electronic component element. The disclosure is also directed to a method of manufacturing such electronic component.

Abstract: There are disclosed a method and apparatus for forming a sinuous lead wire (30) used for efficiently obtaining U-shaped lead wires (5) which serve as a lead wire material for a ceramic capacitor (1) having two terminal lead wires (3, 4). For forming such sinuous lead wire, first and second pin series (23, 24, 70, 71) are used which comprise respective pluralities of pins (21, 22, 63, 64) arranged with an equal pitch and which are arranged in two rows shifted by a half pitch from each other. Each pin series is moved in such a manner that each pin in one series enters between two adjacent pins in the other series. As a result of such pin movement, a material lead wire disposed between the first and second pin series is sinuously deformed.