Patents by Inventor Kunikazu Takemura

Kunikazu Takemura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin-molded semiconductor device, method for manufacturing the same, and leadframe
    Patent number: 6338984
    Abstract: A resin-molded semiconductor device includes: signal leads; a die pad with a central portion elevated above a peripheral portion thereof; support leads, each including a raised portion higher in level than the other portions; and DB paste for use in die bonding. All of these members are encapsulated within a resin encapsulant. The lower part of each of these signal leads protrudes downward out of the resin encapsulant and functions as an external electrode. Each of the support leads is provided with two bent portions to cushion the deforming force. By forming a half-blanked portion in the die pad, the central portion is elevated above the peripheral portion, thus preventing the semiconductor chip from being hampered by the support leads. Accordingly, the size of the semiconductor chip mounted can be selected from a broader range and the humidity resistance of the device can also be improved.
    Type: Grant
    Filed: January 30, 2001
    Date of Patent: January 15, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masanori Minamio, Kunikazu Takemura, Yuichiro Yamada, Fumito Ito, Takahiro Matsuo
  • Resin-molded semicondutor device, method for manufacturing the same, and leadframe
    Publication number: 20010007780
    Abstract: A resin-molded semiconductor device includes: signal leads; a die pad with a central portion elevated above a peripheral portion thereof; support leads, each including a raised portion higher in level than the other portions; and DB paste for use in die bonding. All of these members are encapsulated within a resin encapsulant. The lower part of each of these signal leads protrudes downward out of the resin encapsulant and functions as an external electrode. Each of the support leads is provided with two bent portions to cushion the deforming force. By forming a half-blanked portion in the die pad, the central portion is elevated above the peripheral portion, thus preventing the semiconductor chip from being hampered by the support leads. Accordingly, the size of the semiconductor chip mounted can be selected from a broader range and the humidity resistance of the device can also be improved.
    Type: Application
    Filed: January 30, 2001
    Publication date: July 12, 2001
    Inventors: Masanori Minamio, Kunikazu Takemura, Yuichiro Yamada, Fumito Ito, Takahiro Matsuo
  • Leadframe for use in manufacturing a resin-molded semiconductor device
    Patent number: 6208020
    Abstract: A resin-molded semiconductor device includes: signal leads; a die pad with a central portion elevated above a peripheral portion thereof; support leads, each including a raised portion higher in level than the other portions; and DB paste for use in die bonding. All of these members are encapsulated within a resin encapsulant. The lower part of each of these signal leads protrudes downward out of the resin encapsulant and functions as an external electrode. Each of the support leads is provided with two bent portions to cushion the deforming force. By forming a half-blanked portion in the die pad, the central portion is elevated above the peripheral portion, thus preventing the semiconductor chip from being hampered by the support leads. Accordingly, the size of the semiconductor chip mounted can be selected from a broader range and the humidity resistance of the device can also be improved.
    Type: Grant
    Filed: November 3, 1999
    Date of Patent: March 27, 2001
    Assignee: Matsushita Electronics Corporation
    Inventors: Masanori Minamio, Kunikazu Takemura, Yuichiro Yamada, Fumito Ito, Takahiro Matsuo