Abstract: A powder coating composition useful for fixation of rotor and stator windings is disclosed, which includes100 parts by weight of an epoxy resin;5-35 parts by weight of an acid anhydride;2-30 parts by weight of a phenol resin;0.05-5 parts by weight of a curing accelerator; and130-270 parts by weight of an inorganic filler consisting of 99.7-87.0% by weight of a first filler component having an average particle size of 0.5-100 .mu.m and 0.3-13.0% by weight of a second filler component having an average particle size of 0.1 .mu.m or less.

Abstract: A powder coating composition is disclosed which includes a particulate material containing an epoxy resin and a curing agent, and fine powder of a charge controlling agent such as an acrylic resin, silica or a mixture thereof. The charge controlling agent is deposited on surfaces of the particles of the particulate material.

Abstract: A thermosetting resin composition useful for slot insulation purposes is disclosed, which includes:a liquid epoxy resin;a curing agent including an acid anhydride;a maleimide resin in an amount of 3-50 parts by weight per 100 parts by weight of the liquid epoxy resin; andfinely divided wollastonite in an amount of 50-400 parts by weight per 100 parts by weight of the liquid epoxy resin.

Abstract: A powder coating composition is disclosed which includes a particulate material containing an epoxy resin and a curing agent, and fine powder of a charge controlling agent such as an acrylic resin, silica or a mixture thereof. The charge controlling agent is deposited on surfaces of the particles of the particulate material. Additionally, a powder coating composition is disclosed in which two different charge controlling agents are used and are separately deposited on different particles of epoxy resin consisting particulate material.

Abstract: A penetrable, epoxy resin composition is disclosed which comprises: a liquid, epoxy resin mixture containing a glycidyl ether of bisphenol having an epoxy equivalent of 158-270 and a flexible epoxy resin; a curing agent capable of reacting with the epoxy resin mixture when heated to a curing temperature; an inert organic solvent which does not react with the epoxy resin mixture, which is capable of dissolving the curing agent and which has a boiling point lower than the curing temperature; and an inorganic filler having an average particle size of 0.1-5 .mu.m.

Abstract: A thermosetting powder composition is disclosed which comprises:a functional thermoplastic resin capable of reacting with a cyanate group and a molecular weight of at least 10,000;a polyfunctional cyanate compound; anda viscosity controlling agent which is a compound having at least one functional group capable of reacting with the functional thermoplastic resin and/or the polyfunctional cyanate compound and a molecular weight of less than 10,000. The composition is useful as a powder coating composition or a raw material for the formation of molded articles.

Abstract: An epoxy resin bonding composition containing two different epoxy resin as a liquid admixture, a curing agent and a polyamide powder is disclosed. The bonding composition may be used, for example, to bond a ferrite magnetic to a motor yoke. One of the epoxy resins is an unmodified glycidyl ether of bisphenol A, bisphenol F or bisphenol AD. The other epoxy resin is an urethane-modified or glycol-modified glycidyl ether of bisphenol A, bisphenol F or bisphenol AD. The polyamide powder has an average particle size of 150 .mu.m or less and a melting of at least 170.degree. C. and is present in an amount 1-50 parts by weight per 100 parts by weight of liquid epoxy resin admixture.

Abstract: A penetrable, epoxy resin composition is disclosed which comprises: a liquid, epoxy resin mixture containing a glycidyl ether of bisphenol having an epoxy equivalent of 158-270 and a flexible epoxy resin which is a glycidyl ether of a bisphenol modified with a glycol or a urethane; a curing agent capable of reacting with the epoxy resin mixture when heated to a curing temperature; an inert organic solvent which does not react with the epoxy resin mixture, which is capable of dissolving the curing agent and which has a boiling point lower than the curing temperature; and an inorganic filler having an average particle size of 0.1-5 .mu.m.

Abstract: A bent metal body with a resin coating is fabricated by first applying a powder coating composition to a metal body to form a hardenable resin layer, then bending the metal body bearing the resin layer, and then hardening the hardenable resin layer to form the resin coating.

Abstract: An epoxy resin composition suitable for use as a casting resin for the potting of an ignition coil is disclosed which comprises:(A) a mixture containing(a.sub.1) a liquid, Bisphenol-type epoxy resin, and(a.sub.2) an inorganic filler,(a.sub.3) a polyether polyol; and(B) a liquid curing agent including(b.sub.1) an acid anhydride, and(b.sub.2) an imidazole compound.

Abstract: A powder coating composition suitable for slot insulation is disclosed which includes an epoxy resin containing at least 60% by weight of a mixture of a first glycidyl ether of bisphenol A having a number average molecular weight of 2500-8000 with a second glycidyl ether of bisphenol A having a number average molecular weight of 350-1700, the mixture having a number average molecular weight of 1600-4600, a carboxyl group-terminated polyester resin in an amount of 5-100 parts by weight per 100 parts by weight of the epoxy resin, a curing agent, and an inorganic filler in an amount of 10-80% by weight.

Abstract: A balancing putty for use in balancing rotation of a rotary part including:(a) an epoxy resin;(b) a curing agent capable of curing the epoxy resin when heated at a temperature of 60.degree. C. or more,(c) a first, finely divided inorganic filler having a specific gravity of 4.0 g/cm.sup.3 or more; and(d) a second, finely divided inorganic filler having a specific gravity of less than 4.0 g/cm.sup.3, the balancing putty having a density of at least 2.0 g/cm.sup.3 and a consistency of 1-12 mm in terms of penetration.

Abstract: A liquid, epoxy resin composition suitable for use in fixation of a stator coil or a rotor coil is disclosed, which comprises (A) a mixture containing (a.sub.1) a Bisphenol A epoxy resin and (a.sub.2) an alicyclic epoxy resin; and (B) a curing agent including (b.sub.1) an acid anhydride, and (b.sub.2) a phenol compound of the general formula: ##STR1## wherein R.sup.1 and R.sup.2 represent independently from each other a lower alkyl, R.sup.3 represents a lower alkylene and n is an integer of 1-5, the amount of the phenol compound (b.sub.2) being in the range of 2-8% based on the weight of the mixture (A).