Patents by Inventor Kunio Kishimoto
Kunio Kishimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8230891Abstract: A highly reliable and productive manufacturing method of boards and a manufacturing apparatus are provided. The manufacturing apparatus includes heater-punches (4a) and (4b) disposed above and under pressuring holes (24) provided on positioning stage (6) which positions and laminates board materials. The apparatus also includes a supplying and discharging means of a mold-releasing sheet, and the means is formed of supply reel (22), take-up reel (23), and guide rolls (25a) and (25b). The sheet is supplied and discharged passing between heater-punches (4a) placed above pressuring holes (24) and heater-punches (4b) placed under pressuring holes (24).Type: GrantFiled: May 26, 2009Date of Patent: July 31, 2012Assignee: Panasonic CorporationInventors: Kunio Kishimoto, Toshiaki Takenaka, Yukihiro Hiraishi
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Patent number: 8211494Abstract: A mask film, where squeegee cleaning part has been formed at a predetermined position, and another mask film are attached to both sides of a substrate. A through-hole is formed by using a laser, and conductive paste is filled into the through-hole by using a squeezing method. As discussed above, a paste-residue can be prevented on the through-hole, so that a circuit board having high quality of connection can be obtained.Type: GrantFiled: December 15, 2004Date of Patent: July 3, 2012Assignee: Panasonic CorporationInventors: Toshiaki Takenaka, Toshikazu Kondou, Yukihiro Hiraishi, Kunio Kishimoto
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Patent number: 8069557Abstract: In a method of manufacturing a circuit forming board, a first sheet having a first direction is transferred in a second direction, so that the first direction of the first sheet is parallel to the second direction. Films are stuck onto both surfaces of the first sheet while transferring the first sheet in a third direction orthogonal to the first direction of the first sheet. This method allows a connecting member, such as conductive paste, to electrically couple between layers of the circuit forming board.Type: GrantFiled: May 14, 2004Date of Patent: December 6, 2011Assignee: Panasonic CorporationInventors: Toshihiro Nishii, Yoshihiro Kawakita, Kunio Kishimoto
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Publication number: 20090229762Abstract: A highly reliable and productive manufacturing method of boards and a manufacturing apparatus are provided. The manufacturing apparatus includes heater-punches (4a) and (4b) disposed above and under pressuring holes (24) provided on positioning stage (6) which positions and laminates board materials. The apparatus also includes a supplying and discharging means of a mold-releasing sheet, and the means is formed of supply reel (22), take-up reel (23), and guide rolls (25a) and (25b). The sheet is supplied and discharged passing between heater-punches (4a) placed above pressuring holes (24) and heater-punches (4b) placed under pressuring holes (24).Type: ApplicationFiled: May 26, 2009Publication date: September 17, 2009Inventors: Kunio Kishimoto, Toshiaki Takenaka, Yukihiro Hiraishi
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Patent number: 7143772Abstract: It is possible to obtain a clean high-quality circuit board by removing affected material and foreign matter produced when a hole is formed. A manufacturing method of the circuit board includes (a) preparing a film-coated board material by bonding a film material as a mask to a board material, (b) forming a hole in the film-coated board material by applying a laser beam thereto, and (c) selectively removing the unnecessary material sticking to the film-coated board material from the film-coated board material by supersonic cleaning without peeling the film material off the board material. Unnecessary material such as foreign matter is produced when the hole is formed, and the unnecessary material sticks to the board material. After removal of such unnecessary material, a conductive material is disposed in the hole, using the film material as a mask, and the film material is later removed from the board material.Type: GrantFiled: December 12, 2003Date of Patent: December 5, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kunio Kishimoto, Toshihiro Nishii, Toshiaki Takenaka, Shinji Nakamura, Akihiro Miura
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Patent number: 7066344Abstract: A mask film includes a base material, a parting layer and a non-parting portion placed on the base material. Accordingly, an optimum adhesion strength of the mask film and a prepreg sheet can be maintained, and peeling between the mask film and prepreg sheet can be prevented. Further, by preventing the fusing adhesion between the mask film and prepreg sheet due to heat generated when forming penetration holes, a circuit board having an excellent quality is obtained.Type: GrantFiled: January 9, 2003Date of Patent: June 27, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Toshiaki Takenaka, Toshikazu Kondo, Kunio Kishimoto, Shinji Nakamura, Fumio Echigo
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Publication number: 20060115583Abstract: A mask film, where squeegee cleaning part has been formed at a predetermined position, and another mask film are attached to both sides of a substrate. A through-hole formed by using a laser, and conductive paste is filled into the through-hole by using a squeezing method. As discussed above, a paste-residue can be prevented on the through-hole, so that a circuit board having high quality of connection can be obtained.Type: ApplicationFiled: December 15, 2004Publication date: June 1, 2006Inventors: Toshiaki Takenaka, Toshikazu Kondou, Yukihiro Hiraishi, Kunio Kishimoto
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Patent number: 6993836Abstract: A circuit board having stable connection resistance can be obtained. The multi-layer circuit board includes the steps of making through-holes in a incompressible substrate having films on either side thereof via a bonding layer; filling conductive paste into the through-holes; removing the films from the substrate; laminating metallic foils to either side of the substrate and heating same under pressures to harden the bonding layer, bonding the metallic foils to the substrate and electrically connecting the sides of the substrate to each other; and forming a circuit pattern by machining the metallic foils.Type: GrantFiled: August 27, 2003Date of Patent: February 7, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Toshiaki Takenaka, Toshihiro Nishii, Shigeru Yamane, Shinji Nakamura, Hideaki Komoda, Kunio Kishimoto
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Publication number: 20050198818Abstract: In a method of manufacturing a circuit forming board, a first sheet having a first direction is transferred in a second direction, so that the first direction of the first sheet is parallel to the second direction. Films are stuck onto both surfaces of the first sheet while transferring the first sheet in a third direction orthogonal to the first direction of the first sheet. This method allows connecting member, such as conductive paste, to electrically coupling between layers of the circuit forming board.Type: ApplicationFiled: May 14, 2004Publication date: September 15, 2005Inventors: Toshihiro Nishii, Yoshihiro Kawakita, Kunio Kishimoto
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Patent number: 6893530Abstract: A method and system of cleaning to remove cutting dust and the like generated and adhering to a board material (1a) during drilling for electrical connection, and drying the board material, in a process of manufacturing a circuit board for small electronic equipment and the like. A large amount of board materials can be treated without receiving thermal damage by performing the steps of: placing sheets of the board material that have absorbed moisture resulting from cleaning, like a stack in a vacuum chamber (11); and drying the board material by repeating evacuation and pressurization under predetermined conditions while heating the board material.Type: GrantFiled: February 8, 2002Date of Patent: May 17, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kunio Kishimoto, Toshihiro Nishii, Toshiaki Takenaka, Shinji Nakamura, Akihiro Miura
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Patent number: 6820331Abstract: It is possible to obtain a clean high-quality circuit board by removing affected material and foreign matter produced when a hole is formed. A manufacturing method of the circuit board includes (a) preparing a film-coated board material by bonding a film material as a mask to a board material, (b) forming a hole in the film-coated board material by applying a laser beam thereto, and (c) selectively removing the unnecessary material sticking to the film-coated board material from the film-coated board material by supersonic cleaning without peeling the film material off the board material. Unnecessary material such as foreign matter is produced when the hole is formed, and the unnecessary material sticks to the board material. After removal of such unnecessary material, a conductive material is disposed in the hole, using the film material as a mask, and the film material is later removed from the board material.Type: GrantFiled: December 15, 2000Date of Patent: November 23, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kunio Kishimoto, Toshihiro Nishii, Toshiaki Takenaka, Shinji Nakamura, Akihiro Miura
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Publication number: 20040126516Abstract: It is possible to obtain a clean high-quality circuit board by removing affected material and foreign matter produced when a hole is formed. A manufacturing method of the circuit board includes (a) preparing a film-coated board material by bonding a film material as a mask to a board material, (b) forming a hole in the film-coated board material by applying a laser beam thereto, and (c) selectively removing the unnecessary material sticking to the film-coated board material from the film-coated board material by supersonic cleaning without peeling the film material off the board material. Unnecessary material such as foreign matter is produced when the hole is formed, and the unnecessary material sticks to the board material. After removal of such unnecessary material, a conductive material is disposed in the hole, using the film material as a mask, and the film material is later removed from the board material.Type: ApplicationFiled: December 12, 2003Publication date: July 1, 2004Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Kunio Kishimoto, Toshihiro Nishii, Toshiaki Takenaka, Shinji Nakamura, Akihiro Miura
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Patent number: 6700071Abstract: A circuit board having stable connection resistance can be obtained . The multi-layer circuit board includes the steps of making through-holes in a incompressible substrate having films on either side thereof via a bonding layer; filling conductive paste into the through-holes; removing the films from the substrate; laminating metallic foils to either side of the substrate and heating same under pressures to harden the bonding layer, bonding the metallic foils to the substrate and electrically connecting the sides of the substrate to each other; and forming a circuit pattern by machining the metallic foils.Type: GrantFiled: August 14, 2001Date of Patent: March 2, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Toshiaki Takenaka, Toshihiro Nishii, Shigeru Yamane, Shinji Nakamura, Hideaki Komoda, Kunio Kishimoto
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Publication number: 20040035604Abstract: A circuit board having stable connection resistance can be obtained. The multi-layer circuit board includes the steps of making through-holes in a incompressible substrate having films on either side thereof via a bonding layer; filling conductive paste into the through-holes; removing the films from the substrate; laminating metallic foils to either side of the substrate and heating same under pressures to harden the bonding layer, bonding the metallic foils to the substrate and electrically connecting the sides of the substrate to each other; and forming a circuit pattern by machining the metallic foils.Type: ApplicationFiled: August 27, 2003Publication date: February 26, 2004Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Toshiaki Takenaka, Toshihiro Nishii, Shigeru Yamane, Shinji Nakamura, Hideaki Komoda, Kunio Kishimoto
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Patent number: 6694612Abstract: A mask film includes a base material, a parting layer and a non-parting portion placed on the base material. Accordingly, an optimum adhesion strength of the mask film and a prepreg sheet can be maintained, and peeling between the mask film and prepreg sheet can be prevented. Further, by preventing the fusing adhesion between the mask film and prepreg sheet due to heat generated when forming penetration holes, a circuit board having an excellent quality is obtained.Type: GrantFiled: May 18, 2000Date of Patent: February 24, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Toshiaki Takenaka, Toshikazu Kondo, Kunio Kishimoto, Shinji Nakamura, Fumio Echigo
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Publication number: 20030153197Abstract: A mask film includes a base material, a parting layer and a non-parting portion placed on the base material. Accordingly, an optimum adhesion strength of the mask film and a prepreg sheet can be maintained, and peeling between the mask film and prepreg sheet can be prevented. Further, by preventing the fusing adhesion between the mask film and prepreg sheet due to heat generated when forming penetration holes, a circuit board having an excellent quality is obtained.Type: ApplicationFiled: January 9, 2003Publication date: August 14, 2003Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Toshiaki Takenaka, Toshikazu Kondo, Kunio Kishimoto, Shinji Nakamura, Fumio Echigo
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Patent number: 6528733Abstract: An inner layer circuit board with a convex inner layer circuit pattern having a predetermined thickness, a prepreg sheet having conductive material disposed in a plurality of through-holes and metallic foil are laminated to a substrate, and the laminated board is heated under pressures. After that, a laminated circuit pattern is formed by machining the metallic foil. In such multi-layer circuit board, a smoothing layer is disposed on a concave portion where no inner layer circuit pattern of the inner layer circuit board is formed. In this way, the conductive materials disposed in a plurality of through-holes are uniformly compressed. As a result, the connection resistance between the inner circuit pattern and the laminated circuit pattern becomes stabilized.Type: GrantFiled: July 12, 2001Date of Patent: March 4, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Toshiaki Takenaka, Toshihiro Nishii, Shigeru Yamane, Shinji Nakamura, Hideaki Komoda, Kunio Kishimoto
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Publication number: 20020189856Abstract: A circuit board having stable connection resistance can be obtained . The multi-layer circuit board includes the steps of making through-holes in a incompressible substrate having films on either side thereof via a bonding layer; filling conductive paste into the through-holes; removing the films from the substrate; laminating metallic foils to either side of the substrate and heating same under pressures to harden the bonding layer, bonding the metallic foils to the substrate and electrically connecting the sides of the substrate to each other; and forming a circuit pattern by machining the metallic foils.Type: ApplicationFiled: August 14, 2001Publication date: December 19, 2002Inventors: Toshiaki Takenaka, Toshihiro Nishii, Shigeru Yamane, Shinji Nakamura, Hideaki Komoda, Kunio Kishimoto
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Publication number: 20020173109Abstract: A method and system of cleaning to remove cutting dust and the like generated and adhering to a board material (1a) during drilling for electrical connection, and drying the board material, in a process of manufacturing a circuit board for small electronic equipment and the like. A large amount of board materials can be treated without receiving thermal damage by performing the steps of: placing sheets of the board material that have absorbed moisture resulting from cleaning, like a stack in a vacuum chamber (11); and drying the board material by repeating evacuation and pressurization under predetermined conditions while heating the board material.Type: ApplicationFiled: February 8, 2002Publication date: November 21, 2002Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Kunio Kishimoto, Toshihiro Nishii, Toshiaki Takenaka, Shinji Nakamura, Akihiro Miura
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Publication number: 20020020548Abstract: An inner layer circuit board with a convex inner layer circuit pattern having a predetermined thickness, a prepreg sheet having conductive material disposed in a plurality of through-holes and metallic foil are laminated to a substrate, and the laminated board is heated under pressures. After that, a laminated circuit pattern is formed by machining the metallic foil. In such multi-layer circuit board, a smoothing layer is disposed on a concave portion where no inner layer circuit pattern of the inner layer circuit board is formed. In this way, the conductive materials disposed in a plurality of through-holes are uniformly compressed. As a result, the connection resistance between the inner circuit pattern and the laminated circuit pattern becomes stabilized.Type: ApplicationFiled: July 12, 2001Publication date: February 21, 2002Inventors: Toshiaki Takenaka, Toshihiro Nishii, Shigeru Yamane, Shinji Nakamura, Hideaki Komoda, Kunio Kishimoto