Patents by Inventor Kunio Oka

Kunio Oka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for producing reinforcing SiC fiber for SiC composite material
    Patent number: 7125514
    Abstract: A mixed polymer liquid is prepared by mixing a polycarbosilane-dissolved organic solvent with poly(methylsilane) and moderated to viscosity of 5–20 Pa·s by heat-treatment to promote partial cross-linking reaction. The mixed-polymer is then melt-spun to fiber at 250–350° C. The fiber is cured by treatment at 100–200° C. in an oxidizing atmosphere, and baked at 1000° C. or higher. Due to thermosetting action of poly(methylsilane), the mixed polymer liquid is continuously melt-spun without breakage, and SiC fiber produced in this way is useful for reinforcement of SiC composite excellent in toughness, strength and heat-resistance.
    Type: Grant
    Filed: November 13, 2001
    Date of Patent: October 24, 2006
    Assignee: Japan Science and Technology Corporation
    Inventors: Kiyohito Okamura, Masaki Narisawa, Masaki Nishioka, Takaaki Dohmaru, Kunio Oka, Yutai Katoh, Akira Kohyama
  • Process for producing reinforcing sic fiber for sic composite material
    Publication number: 20040013876
    Abstract: A mixed polymer liquid is prepared by mixing a polycarbosilane-dissolved organic solvent with poly(methylsilane) and moderated to viscosity of 5-20 Pa.s by heat-treatment to promote partial cross-linking reaction. The mixed-polymer is then melt-spun to fiber at 250-350° C. The fiber is cured by treatment at 100-200° C. in an oxidizing atmosphere, and baked at 1000° C. or higher. Due to thermosetting action of poly(methylsilane), the mixed polymer liquid is continuously melt-spun without breakage, and SiC fiber produced in this way is useful for reinforcement of SiC composite excellent in toughness, strength and heat-resistance.
    Type: Application
    Filed: May 16, 2003
    Publication date: January 22, 2004
    Inventors: Kiyohito Okamura, Masaki Narisawa, Masaki Nishioka, Takaaki Dohmaru, Kunio Oka, Yutai Katoh, Akira Kohyama
  • Hydrosilylation of fullerenes
    Patent number: 5386048
    Abstract: The invention provides silicon substituted fullerene compounds. The compounds can form polymers or wrapped fullerenes. The compounds may be made by reacting an organo-silicon compound with a fullerene in the presence of a catalyst by a hydrosilylation reaction.
    Type: Grant
    Filed: November 24, 1993
    Date of Patent: January 31, 1995
    Assignee: Wisconsin Alumni Research Foundation
    Inventors: Robert C. West, Kunio Oka