Abstract: According to one embodiment, there is provided a printed circuit board, including a frame ground portion in which conductor patterns are formed around a board-fixation hole, and a plurality of through-holes formed around the board-fixation hole in the frame ground portion.

Abstract: According to one embodiment, there is provided a printed circuit board includes a printed wiring board having a component mounting surface, a semiconductor package which is mounted on the component mounting surface of the printed wiring board by solder bonding using solder balls, and reinforcement portions which locally reinforce portions of the solder bonding of the semiconductor package at a plurality of locations on the component mounting surface of the printed wiring board, the reinforcement portions being formed of a resin material having parts entering the solder balls of the portions of the solder bonding.

Abstract: According to one embodiment, there is provided a printed circuit board, including a frame ground portion in which conductor patterns are formed around a board-fixation hole, and a plurality of through-holes formed around the board-fixation hole in the frame ground portion.

Abstract: A circuit board module includes: a printed wiring board that is provided with a plurality of solder bonding pads; a semiconductor package that is provided with a plurality of solder bonding portions on a back face thereof to be mounted on the printed wiring board by soldering the solder bonding portions onto the respective solder bonding pads on the printed wiring board; a plurality of reinforcement pads that are provided on the printed wiring board at positions along peripheral edges of the semiconductor package, each of the reinforcement pads having a solder coated layer formed thereon; and a plurality of reinforcing adhesive agents that are disposed on each of the reinforcement pads to adhere the semiconductor package to the reinforcement pads.

Abstract: According to one embodiment, there is provided a printed circuit board includes a printed wiring board having a component mounting surface, a semiconductor package which is mounted on the component mounting surface of the printed wiring board by solder bonding using solder balls, and reinforcement portions which locally reinforce portions of the solder bonding of the semiconductor package at a plurality of locations on the component mounting surface of the printed wiring board, the reinforcement portions being formed of a resin material having parts entering the solder balls of the portions of the solder bonding.

Abstract: According to one embodiment, there is provided a printed circuit board which comprises a printed wiring board, a semiconductor package having a number of solder bonding members arranged on its back side and mounted on the printed wiring board by the solder bonding members being soldered to the wiring board, and reinforcing members which are formed of a reinforcing material having a solder flux function and locally reinforce the solder bonding members in a number of places on the semiconductor package mounting portion of the printed wiring board.

Abstract: According to one embodiment, a printed circuit board includes a printed wiring board including a through hole part, an electronic component including a component body and a lead member inserted into the through hole part to be electrically connected thereto, a metal member disposed around and separated from the through hole part, and a solder resist disposed at least around the metal member, at least a part of the component body being mounted on the solder resist

Abstract: A module substrate includes an insulating substrate, a circuit pattern formed on at least a main surface of the insulating substrate, a protection film formed on the main surface of the insulating substrate including the circuit patter such as to expose a mount region of the circuit pattern, an active element part mounted on the mount region of the circuit pattern, a fluororesin film formed on the protection film at least in a vicinity of the mount region of the active element part, and an underfill filled between the active element part and the mount region of the circuit pattern.

Abstract: According to one embodiment, a printed circuit board includes a printed wiring board, a semiconductor package, an adhesive and a stepped portion. The printed wiring board has a plurality of pads. The semiconductor package has a plurality of connection terminals corresponding to the pads and is mounted on the printed wiring board by soldering the connection terminals to the pads. The adhesive is filled between an outer peripheral portion of the semiconductor package and the printed wiring board and fixes the semiconductor package to the printed wiring board. The stepped portion divides an area between the semiconductor package and the printed wiring board into a first region, to which a solder for bonding the connection terminal and the pad is supplied, and a second region in which the adhesive is filled.

Abstract: According to one embodiment, a semiconductor device includes an interposer board having a rectangular shape, a semiconductor chip provided on a front surface of the interposer board, projecting electrodes provided in a area on a back surface of the interpose board and electrically connected to the semiconductor chip, and auxiliary pins provided in corners of the back surface of the interposer board which corners are located outside the area, the auxiliary pins having a melting point of at least 250° C.

Abstract: A module substrate includes an insulating substrate, a circuit pattern formed on at least a main surface of the insulating substrate, a protection film formed on the main surface of the insulating substrate including the circuit patter such as to expose a mount region of the circuit pattern, an active element part mounted on the mount region of the circuit pattern, a fluororesin film formed on the protection film at least in a vicinity of the mount region of the active element part, and an underfill filled between the active element part and the mount region of the circuit pattern.

Abstract: Soldering of a first electrode and first circuit component, soldering of a second electrode and second circuit component, and hardening of an encapsulating resin are simultaneously performed by using the encapsulating resin which having a hardening accelerating temperature higher than a preheating temperature and equal to or lower than a main heating temperature.