Patents by Inventor Kunizou Sahara

Kunizou Sahara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4630095
    Abstract: A packaged semiconductor device structure includes a semiconductor chip with an organic material covering thereon. The semiconductor chip is placed in a package and hermetically sealed with a low melting point glass. The organic covering serve to suppress undesirable influence on the semiconductor chip by .alpha.-rays which may be radiated from the package, and a getter material is placed in the package for decreasing undesirable gases in the package which may be emitted by the organic covering during the sealing process.
    Type: Grant
    Filed: June 29, 1984
    Date of Patent: December 16, 1986
    Assignee: VLSI Technology Research Association
    Inventors: Kanji Otsuka, Kunizou Sahara, Masao Sekibata, Kazumichi Mitsusada, Katsumi Ogiue