Patents by Inventor Kunlun Bai

Kunlun Bai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11966156
    Abstract: A system for mask design repair may develop a simulation-based model of a layer thickness after one or more process steps for fabricating features on a sample, develop a transformed model of the fabrication process that emulates the simulation-based model and has a faster evaluation speed than the simulation-based model, and where the inputs to the transformed model include the input mask design, and where the outputs of the transformed model include one or more output parameters associated with fabrication of the input mask design as well as one or more sensitivity metrics describing sensitivities of the one or more output parameters to variations of the input mask design. The system may further receive a candidate mask design and generate a repaired mask design based on the transformed model and the candidate mask design.
    Type: Grant
    Filed: August 8, 2023
    Date of Patent: April 23, 2024
    Assignee: KLA Corporation
    Inventors: Pradeep Vukkadala, Guy Parsey, Kunlun Bai, Xiaohan Li, Anatoly Burov, Cao Zhang, John S. Graves, John Biafore
  • Patent number: 11939950
    Abstract: A modular blade connection structure includes a first module, a second module and a structural adhesive module. The first module is provided on an end face thereof with a bonding flange extending into the second module; a gap between the butting surfaces of the first module and the second module is injected with a structural adhesive, which is extruded and cured to form a structural adhesive module; and the thickness of the first module at the starting end of the bonding flange extends towards the inner surface to form a first reinforcement, and the structural adhesive module extends inside the second module in a direction away from the bonding flange to form a second reinforcement. The present disclosure facilitates the control the bonding quality of the double-sided overlapping of the modular blade by means of the bonding flange and the improvement of the fatigue resistance at the assembling position.
    Type: Grant
    Filed: July 24, 2023
    Date of Patent: March 26, 2024
    Assignee: NEWTECH GROUP CO., LTD.
    Inventors: Kunlun Tan, Yelin Liu, Lei Cao, Jian Zhang, Gaoyu Bai, Shuang Lin
  • Publication number: 20240061327
    Abstract: A system for mask design repair may develop a simulation-based model of a layer thickness after one or more process steps for fabricating features on a sample, develop a transformed model of the fabrication process that emulates the simulation-based model and has a faster evaluation speed than the simulation-based model, and where the inputs to the transformed model include the input mask design, and where the outputs of the transformed model include one or more output parameters associated with fabrication of the input mask design as well as one or more sensitivity metrics describing sensitivities of the one or more output parameters to variations of the input mask design. The system may further receive a candidate mask design and generate a repaired mask design based on the transformed model and the candidate mask design.
    Type: Application
    Filed: August 8, 2023
    Publication date: February 22, 2024
    Inventors: Pradeep Vukkadala, Guy Parsey, Kunlun Bai, Xiaohan Li, Anatoly Burov, Cao Zhang, John S. Graves, John Biafore
  • Publication number: 20240036969
    Abstract: The present disclosure relates to a method, and apparatus for detecting an application freezing problem, and a device and a storage medium. The method comprises: detecting time consumed for a Runloop in a first thread of an application executing a task; when it is detected that the consumed time reaches a preset threshold value, at least acquiring a call stack of the first thread and the current first execution state of the Runloop, and writing the call stack into a preset file; detecting an execution state of the Runloop after the time consumed for the task reaches the preset threshold value; and if the Runloop does not enter a second execution state after the first execution state before the application is closed, sending the preset file to a remote server. By means of the solution provided in the embodiments of the present disclosure, an application freezing problem can be identified and detected.
    Type: Application
    Filed: November 29, 2021
    Publication date: February 1, 2024
    Inventors: Yadong FENG, Kunlun BAI
  • Publication number: 20220129775
    Abstract: A mask pattern for a semiconductor device can be used as an input to determine a photoresist thickness probability distribution using a machine learning module. For example, the machine learning module can determine a probability map of Z-height. This can be used to determine stochastic variation in photoresist thickness for a semiconductor device. The Z-height may be calculated at a coordinate in the X-direction and Y-direction.
    Type: Application
    Filed: June 2, 2021
    Publication date: April 28, 2022
    Inventors: Anatoly Burov, Guy Parsey, Kunlun Bai, Pradeep Vukkadala, Cao Zhang, John S. Graves, Xiaohan Li, Craig Higgins