Patents by Inventor Kuno Mayer

Kuno Mayer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Texturing and cleaning agent for the surface treatment of wafers and use thereof
    Patent number: 8900472
    Abstract: A liquid agent for the surface treatment of monocrystalline wafers, which contains an alkaline etching agent and also at least one low-volatile organic compound. Systems of this type can be used both for the cleaning, damage etch and texturing of wafer surfaces in a single etching step and exclusively for the texturing of silicon wafers with different surface quality, whether it now be wire-sawn wafers with high surface damage or chemically polished surfaces with minimum damage density.
    Type: Grant
    Filed: June 2, 2010
    Date of Patent: December 2, 2014
    Assignee: Fraunhofer-Gesellschaft zur Föerderung der angewandten Forschung E.V.
    Inventors: Kuno Mayer, Mark Schumann, Daniel Kray, Teresa Orellana Peres, Jochen Rentsch, Martin Zimmer, Elias Kirchgässner, Eva Zimmer, Daniel Biro, Arpad Mihai Rostas, Filip Granek
  • Method for the precision processing of substrates
    Patent number: 8586402
    Abstract: The invention relates to a method for the precision processing of substrates, in particular for the microstructuring of thin layers, local dopant introduction and also local application of a metal nucleation layer in which a liquid-assisted laser, i.e. laser irradiation of a substrate which is covered in the regions to be processed by a suitable reactive liquid, is implemented.
    Type: Grant
    Filed: March 6, 2008
    Date of Patent: November 19, 2013
    Assignees: Fraunhofer-Gesellschaft zur föderung der angewandten Forschung e.V., Albert-Ludwigs-Universität Freiburg
    Inventors: Kuno Mayer, Monica Aleman, Daniel Kray, Stefan Glunz, Ansgar Mette, Ralf Preu, Andreas Grohe
  • Solar cells with back side contacting and also method for production thereof
    Publication number: 20120138138
    Abstract: A method for producing solar cells with back side contacting, which is based on a microstructuring of a wafer provided with a dielectric layer and a doping of the microstructured regions on the back side and also an emitter diffusion on the front side. Subsequently, the deposition of a metal-containing nucleation layer and also a galvanic reinforcement of the contactings on the back side is effected. Solar cells which can be produced in accordance with the foregoing method.
    Type: Application
    Filed: February 22, 2010
    Publication date: June 7, 2012
    Applicant: Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
    Inventors: Filip Granek, Daniel Kray, Kuno Mayer, Monica Aleman, Sybille Hopman
  • FRONT-AND-BACK CONTACT SOLAR CELLS, AND METHOD FOR THE PRODUCTION THEREOF
    Publication number: 20120055541
    Abstract: The invention relates to a method for the production of solar cells which are contacted on both sides, which method is based on micro structuring of a wafer provided with a dielectric layer and doping of the microstructured regions. Subsequently, deposition of a metal-containing nucleation layer and also a galvanic reinforcement of the contactings is effected. The invention relates likewise to solar cells which can be produced in this way.
    Type: Application
    Filed: August 30, 2011
    Publication date: March 8, 2012
    Applicant: FRAUNHOFER-GESELLSCHAFT zur Forderung der angewandten Forschung e.V.
    Inventors: Filip Granek, Daniel Kray, Kuno Mayer, Monica Aleman, Sybille Maria Hopman
  • DEVICE AND METHOD FOR SIMULTANEOUSLY MICROSTRUCTURING AND DOPING SEMICONDUCTOR SUBSTRATES
    Publication number: 20120058588
    Abstract: The invention relates to a device and a method for simultaneous microstructuring and doping of semiconductor substrates with boron, in which the semiconductor substrate is treated with a laser beam coupled into a liquid jet, the liquid jet comprising at least one boron compound. The method according to the invention is used in the field of solar cell technology and also in other fields of semiconductor technology in which a locally delimited boron doping is important.
    Type: Application
    Filed: September 1, 2011
    Publication date: March 8, 2012
    Applicant: FRAUNHOFER-GESELLSCHAFT zur Forderung der angewandten Forschung e.V.
    Inventors: Kuno Mayer, Ingo Krossing, Carsten Knapp, Filip Granek, Matthias Mesec, Andreas Rodofili
  • Texturing and cleaning agent for the surface treatment of wafers and use thereof
    Publication number: 20110092074
    Abstract: A liquid agent for the surface treatment of monocrystalline wafers, which contains an alkaline etching agent and also at least one low-volatile organic compound. Systems of this type can be used both for the cleaning, damage etch and texturing of wafer surfaces in a single etching step and exclusively for the texturing of silicon wafers with different surface quality, whether it now be wire-sawn wafers with high surface damage or chemically polished surfaces with minimum damage density.
    Type: Application
    Filed: June 2, 2010
    Publication date: April 21, 2011
    Applicant: Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
    Inventors: Kuno Mayer, Mark Schumann, Daniel Kray, Teresa Orellana Peres, Jochen Rentsch, Martin Zimmer, Elias Kirchgässner, Eva Zimmer, Daniel Biro, Arpad Mihai Rostas, Filip Granek
  • Process and Device for The Precision-Processing Of Substrates by Means of a Laser Coupled Into a Liquid Stream, And Use of Same
    Publication number: 20100213166
    Abstract: The invention relates to a method for precision processing of substrates in which a liquid jet which is directed towards a substrate surface and contains a processing reagent is guided over the regions of the substrate to be processed, a laser beam being coupled into the liquid jet. Likewise, a device which is suitable for implementation of the method is described. The method is used for different process steps in the production of solar cells.
    Type: Application
    Filed: January 25, 2007
    Publication date: August 26, 2010
    Applicants: FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V., ALBERT-LUDWIGS-UNIVERSITAT FREIBURG
    Inventors: Daniel Kray, Ansgar Mette, Daniel Biro, Kuno Mayer, Sybille Hopman, Stefan Reber
  • METHOD FOR THE PRECISION PROCESSING OF SUBSTRATES
    Publication number: 20100144079
    Abstract: The invention relates to a method for the precision processing of substrates, in particular for the microstructuring of thin layers, local dopant introduction and also local application of a metal nucleation layer in which a liquid-assisted laser, i.e. laser irradiation of a substrate which is covered in the regions to be processed by a suitable reactive liquid, is implemented.
    Type: Application
    Filed: March 6, 2008
    Publication date: June 10, 2010
    Applicants: Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung e.V., ALBERT-LUDWIGS-UNIVERSITÄT FREIBURG
    Inventors: Kuno Mayer, Monica Aleman, Daniel Kray, Stefan Glunz, Ansgar Mette, Ralf Preu, Andreas Grohe
  • Method for Microstructuring Solid Surfaces
    Publication number: 20090212020
    Abstract: The invention relates to a method for microstructuring solid surfaces by chemical or electrochemical etching, in which the solid surface is treated with an etching fluid with formation of intermediate products which are insoluble or low-soluble in the etching fluid. By additional use of a particle stream, these intermediate products can be removed in a simple manner. Associated herewith is the advantage that low damage microstructuring of solid bodies is made possible.
    Type: Application
    Filed: March 9, 2006
    Publication date: August 27, 2009
    Applicant: FRA UNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWAN
    Inventors: Kuno Mayer, Daniel Kray, Sybille Hopman, Bernd O. Kolbesen
  • LIQUID JET-GUIDED ETCHING METHOD FOR REMOVING MATERIAL FROM SOLIDS AND ALSO USE THEREOF
    Publication number: 20090145880
    Abstract: The present invention relates to a method for removing material from solids by liquid jet-guided etching. The method according to the invention is used in particular for cutting, microstructuring, doping of wafers or also the metallisation thereof.
    Type: Application
    Filed: December 30, 2008
    Publication date: June 11, 2009
    Inventors: Kuno Mayer, Bernd O. Kolbesen
  • METHOD FOR REMOVING MATERIAL FROM SOLIDS AND USE THEREOF
    Publication number: 20090084760
    Abstract: The invention relates to a method for material removal on solid bodies, in particular for microstructuring and cutting, by means of liquid jet-guided laser etching, the removed material just as the non-reacted etching components being recycled to a high degree. In this way, silicon with high purity can be recovered either in a polycrystalline manner or be deposited epitaxially on other substrates in the same process chain.
    Type: Application
    Filed: January 25, 2007
    Publication date: April 2, 2009
    Applicants: FRAUNHOFER-SESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG E.V., JOHANN WOLFGANG GOETHE-UNIVERSITAT FRANKFURT AM MAIN
    Inventors: Kuno Mayer, Daniel Kray, Bernd O. Kolbesen, Sybille Hopman