Patents by Inventor Kunpeng JING

Kunpeng JING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11303784
    Abstract: An action camera includes an external housing and a main chip disposed inside the external housing. The action camera also includes a heat dissipation assembly configured to dissipate heat from at least one heat generating component of the action camera. The at least one heat generating component includes the main chip. The heat dissipation assembly includes a heat tube and a first heat dissipation panel. An evaporation end and a condensation end of the heat tube are both in thermal contact with the first heat dissipation panel. The condensation end of the heat tube is disposed farther away from the main chip relative to the evaporation end of the heat tube. The first heat dissipation panel is configured to be in thermal contact with the main chip and the external housing.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: April 12, 2022
    Assignee: SZ DJI TECHNOLOGY CO., LTD.
    Inventors: Shengjia Guo, Guisheng Nong, Kunpeng Jing
  • Publication number: 20210162294
    Abstract: A gimbal system, a mobile platform and a battle system are disclosed. The gimbal system is used for a shooting battle. The gimbal system includes a gimbal and a battle information interactive device, the battle information interactive device 2 is arranged on an outer side surface of the gimbal to send and receive battle information and/or output special effects based on the battle information. The present disclosure may fulfill various interactive functions during a battle and achieve fun. An outer side of the battle information interactive device is not shielded, so that information sending and receiving and/or special effect outputting may be conveniently achieved from and/or by the outside.
    Type: Application
    Filed: February 10, 2021
    Publication date: June 3, 2021
    Applicant: SZ DJI TECHNOLOGY CO., LTD.
    Inventors: Bowen LI, Bin ZHUANG, Kunpeng JING, Huai HUANG
  • Publication number: 20200344395
    Abstract: An action camera includes an external housing and a main chip disposed inside the external housing. The action camera also includes a heat dissipation assembly configured to dissipate heat from at least one heat generating component of the action camera. The at least one heat generating component includes the main chip. The heat dissipation assembly includes a heat tube and a first heat dissipation panel. An evaporation end and a condensation end of the heat tube are both in thermal contact with the first heat dissipation panel. The condensation end of the heat tube is disposed farther away from the main chip relative to the evaporation end of the heat tube. The first heat dissipation panel is configured to be in thermal contact with the main chip and the external housing.
    Type: Application
    Filed: June 11, 2020
    Publication date: October 29, 2020
    Applicant: SZ DJI TECHNOLOGY CO., LTD
    Inventors: Shengjia GUO, Guisheng NONG, Kunpeng JING
  • Patent number: 10701249
    Abstract: An action camera includes an external housing and a main chip disposed inside the external housing. The action camera also includes a heat dissipation assembly configured to dissipate heat from at least one heat generating component of the action camera. The at least one heat generating component includes the main chip. The heat dissipation assembly includes a heat tube and a first heat dissipation panel. An evaporation end and a condensation end of the heat tube are both in thermal contact with the first heat dissipation panel. The condensation end of the heat tube is disposed farther away from the main chip relative to the evaporation end of the heat tube. The first heat dissipation panel is configured to be in thermal contact with the main chip and the external housing.
    Type: Grant
    Filed: August 14, 2019
    Date of Patent: June 30, 2020
    Assignee: SZ DJI TECHNOLOGY CO., LTD.
    Inventors: Shengjia Guo, Guisheng Nong, Kunpeng Jing
  • Publication number: 20200045835
    Abstract: A housing assembly for a remote control device includes a housing. The housing includes an opening. A first snap-fit mechanism is provided on an inner wall of the opening. The housing assembly also includes a cover assembly including a second snap-fit mechanism. The second snap-fit mechanism is configured to snap-fit with the first snap-fit mechanism to cause the cover assembly to cover the opening of the housing. At least one of the first snap-fit mechanism or the second snap-fit mechanism is an elastic snap-fit mechanism. When under an external force, at least one of the first snap-fit mechanism or the second snap-fit mechanism elastically deforms to release a snap-fit state to cause the cover assembly to separate from the housing.
    Type: Application
    Filed: October 8, 2019
    Publication date: February 6, 2020
    Inventor: Kunpeng JING
  • Patent number: D955471
    Type: Grant
    Filed: September 22, 2020
    Date of Patent: June 21, 2022
    Assignee: SHENZHEN MINGDA TECHNOLOGY CO., LTD.
    Inventors: Kunpeng Jing, Huiping Huang