Patents by Inventor Kuo-Fang Ting

Kuo-Fang Ting has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11948939
    Abstract: An integrated circuit (IC) with active and dummy device cell arrays and a method of fabricating the same are discloses. The IC includes a substrate, an active device cell, and a dummy device cell. The active device cell includes an array of source/drain (S/D) regions of a first conductivity type disposed on or within the substrate and an array of gate structures with a first gate fill material disposed on the substrate. The dummy device cell includes a first array of S/D regions of the first conductivity type disposed on or within the substrate, a second array of S/D regions of a second conductivity type disposed on or within the substrate, and an array of dual gate structures disposed on the substrate. Each of the dual gate structures includes the first gate fill material and a second gate fill material that is different from the first gate fill material.
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: April 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd
    Inventors: Kai-Chi Wu, Ching-Hung Kao, Meng-I Kang, Kuo-Fang Ting
  • Publication number: 20230387111
    Abstract: An integrated circuit (IC) with active and dummy device cell arrays and a method of fabricating the same are discloses. The IC includes a substrate, an active device cell, and a dummy device cell. The active device cell includes an array of source/drain (S/D) regions of a first conductivity type disposed on or within the substrate and an array of gate structures with a first gate fill material disposed on the substrate. The dummy device cell includes a first array of S/D regions of the first conductivity type disposed on or within the substrate, a second array of S/D regions of a second conductivity type disposed on or within the substrate, and an array of dual gate structures disposed on the substrate. Each of the dual gate structures includes the first gate fill material and a second gate fill material that is different from the first gate fill material.
    Type: Application
    Filed: August 9, 2023
    Publication date: November 30, 2023
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Kai-Chi WU, Ching-Hung Kao, Meng-I Kang, Kuo-Fang Ting
  • Publication number: 20230063388
    Abstract: A semiconductor arrangement is provided and includes a gate electrode. The gate electrode includes a first portion over a first interface between an active region and an isolation structure and a second portion over the active region. The first portion has a first material composition. The second portion has a second material composition different than the first material composition.
    Type: Application
    Filed: August 27, 2021
    Publication date: March 2, 2023
    Inventors: Anhow CHENG, Kuo FANG-TING
  • Publication number: 20220223589
    Abstract: An integrated circuit (IC) with active and dummy device cell arrays and a method of fabricating the same are discloses. The IC includes a substrate, an active device cell, and a dummy device cell. The active device cell includes an array of source/drain (S/D) regions of a first conductivity type disposed on or within the substrate and an array of gate structures with a first gate fill material disposed on the substrate. The dummy device cell includes a first array of S/D regions of the first conductivity type disposed on or within the substrate, a second array of S/D regions of a second conductivity type disposed on or within the substrate, and an array of dual gate structures disposed on the substrate. Each of the dual gate structures includes the first gate fill material and a second gate fill material that is different from the first gate fill material.
    Type: Application
    Filed: May 13, 2021
    Publication date: July 14, 2022
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Kai-Chi WU, Ching-Hung Kao, Mang-I Kang, Kuo-Fang Ting