Abstract: A semiconductor die includes a semiconductor substrate, an interconnect structure, and a conductive bump. The interconnect structure is disposed on and electrically connected to the semiconductor substrate. The interconnect structure includes stacked interconnect layers. Each of the stacked interconnect layers includes a dielectric layer and an interconnect wiring embedded in the dielectric layer. The interconnect wiring of a first interconnect layer among the stacked interconnect layers further includes a first via and second vias. The first via electrically connected to the interconnect wiring. The second vias connected to the interconnect wiring, and the first via and the second vias are located on a same level height. The conductive bump is disposed on the interconnect structure. The conductive bump includes a base portion and a protruding portion connected to the base portion, and the base portion is between the protruding portion and the first via.

Abstract: Methods and semiconductor devices are provided. A method includes determining a location of a polyimide opening (PIO) corresponding to an under-bump metallization (UBM) feature in a die. The die includes a substrate and an interconnect structure over the substrate. The method also includes determining a location of a stacked via structure in the interconnect structure based on the location of the PIO. The method further includes forming, in the interconnect structure, the stacked via structure comprising at most three stacked contact vias at the location of the PIO.

Abstract: A device includes standard cells in a layout of an integrated circuit. The standard cells include a first standard cell and a second standard cell disposed next to each other. The first standard cell is configured to operate as an electrostatic discharge (ESD) protection circuit and includes a first gate and a second gate. The first gate includes a first gate finger and a second gate finger that are arranged over a first active region, for forming a first transistor and a second transistor, respectively. The second gate is separate from the first gate. The second gate includes a third gate finger and a fourth gate finger that are arranged over a second active region, for forming a third transistor and a fourth transistor, respectively. The first transistor and the second transistor are connected in parallel, and the third transistor and the fourth transistor are connected in parallel.

Abstract: The present invention discloses an uninterrupted power bank, mainly comprising: a first switch, a rectifier, a first power converter, a second switch, a battery unit, a second power converter, a third power converter, a third switch, a fourth switch, and output ports. During a normal supply of a mains supply, an AC power provided by the mains supply is transmitted from the uninterrupted power bank to a back-end power supply device. In the meantime, the AC power is simultaneously converted to a DC power and then stored in the battery unit. When the mains supply is suddenly interrupted, the DC power stored in the battery unit is released and subsequently converted to a 390 VDC power for being supplied to the power supply device. Therefore, this uninterrupted power bank is able to largely reduce the power loss because of supplying DC power to back-end power supply device.

Abstract: An uninterruptible power supply (UPS) includes a rectifier, a buck converter, a solar energy module, a boost converter, a controller, and a power distribution unit (PDU). The solar energy module receives solar energy and converts the solar energy to a first DC voltage. The controller compares the first DC voltage with a preset voltage, and outputs a control signal to turn the boost converter on or off. When the boost converter is turned off, the rectifier receives an AC voltage from the AC power source and converts this to a rectified DC voltage which is output to the buck converter. When the boost converter is turned on, the boost converter converts the first DC voltage to a second DC voltage. The buck converter converts the rectified DC voltage or the first DC voltage to a working DC voltage and outputs to a power supply unit through the PDU.

Abstract: An alternate current rectifier circuit which includes a first diode, a second diode, a first transistor, a second transistor, a third transistor, and a fourth transistor is power saving. The first diode is connected to the first transistor and the fourth transistor; the second diode is connected to the second transistor and the third transistor. During a positive half cycle of the alternate current, the first transistor and the fourth transistor are switched on and the alternate current flows through the first diode, the first transistor, and the fourth transistor; during a negative half cycle of the alternate current, the second transistor and the third transistor are switched on and the alternate current flows through the second diode, the second transistor, and the third transistor.

Abstract: A multi power supply system includes a power supply, a power source, a control unit, a first conversion unit, and first and second switch elements. The control unit provides a timing signal indicative of a duty cycle to the first conversion unit. The first conversion unit provides an output voltage according to the duty cycle and an output voltage of the power source, so the multi power supply determines whether the first switch unit or the second switch unit is turned on according to the output voltage of the first conversion unit. Thus, the power supply and the power source can alternately supply power for the multi power supply system.

Abstract: An uninterruptible power supply (UPS) includes a rectifier, a buck converter, a solar energy module, a boost converter, a controller, and a power distribution unit (PDU). The solar energy module receives solar energy and converts the solar energy to a first DC voltage. The controller compares the first DC voltage with a preset voltage, and outputs a control signal to turn the boost converter on or off. When the boost converter is turned off, the rectifier receives an AC voltage from the AC power source and converts this to a rectified DC voltage which is output to the buck converter. When the boost converter is turned on, the boost converter converts the first DC voltage to a second DC voltage. The buck converter converts the rectified DC voltage or the first DC voltage to a working DC voltage and outputs to a power supply unit through the PDU.

Abstract: A power supply circuit includes an alternating current to direct current (AC/DC) converter, an uninterruptible power supply (UPS), a protection circuit, and a power supply unit (PSU). The AC/DC converter converts AC power from the UPS to DC power and transmits the DC power to the PSU through the protection circuit. The protection circuit includes a first resistor, a first switch, a first capacitor, and a microprocessor. At the initial time when the UPS first supplies power to the UPS, the microprocessor turns off the first switch; after a preset time has elapsed, the microprocessor turns on the first switch.

Abstract: An alternate current rectifier circuit which includes a first diode, a second diode, a first transistor, a second transistor, a third transistor, and a fourth transistor is power saving. The first diode is connected to the first transistor and the fourth transistor; the second diode is connected to the second transistor and the third transistor. During a positive half cycle of the alternate current, the first transistor and the fourth transistor are switched on and the alternate current flows through the first diode, the first transistor, and the fourth transistor; during a negative half cycle of the alternate current, the second transistor and the third transistor are switched on and the alternate current flows through the second diode, the second transistor, and the third transistor.

Abstract: A power system for a container data center includes an interruptible power supply, a power supply unit and a storage capacitor. The uninterruptible power supply rectifies the inputted AC voltage to a DC voltage output. The power supply unit converts the DC output voltage to a suitable voltage for a load. The storage capacitor is connected between the input terminal of power supply unit and the ground, and placed outside of the power supply unit.

Abstract: A method of integrally forming shoe with multiple material employs a set of molds which include a lower mold, a middle mold and an upper mold. The lower and middle mold have respectively a lower cavity and a middle cavity. The method includes the steps of: blending, melting and injecting, secondary injecting, positioning and pouring. The contact surface of the outsole will be melted slightly when a coupling agent is injected thereby to bond the TPU and outsole made from rubber. A vamp may be placed over the middle mold to receive the PU for forming a midsole thereby to enable the vamp, midsole and lower sole formed integrally.

Abstract: A method of integrally forming shoe with multiple material employs a set of molds which include a lower mold, a middle mold and an upper mold. The lower and middle mold have respectively a lower cavity and a middle cavity. The method comprising the steps of: blending, melting and injecting, secondary injecting, positioning and pouring. The contact surface of the outsole will be melted slightly when a coupling agent is injected thereby to bond the TPU and outsole made from rubber. A vamp may be placed over the middle mold to receive the PU for forming a midsole thereby to enable the vamp, midsole and lower sole formed integrally.

Abstract: A process for producing static-free synthetic rubber includes mixing acrylonitrile-butadiene, Anti-static agent, Activated zinc oxide, Zinc stearate, HI-sil (EPDM), Plasticizer, and Stearic Acid prior to a kneading process at 140 degrees Celsius for 8 to 12 minutes. (DCP) Peroxides and Blowing agents are added to the kneeing mixture two minutes before the end of the kneeding process. After the kneeding process, the resultant mixture is fed through rollers to form a sheet of the synthetic rubber. The sheet is then cut into appropriately-sized pieces and put into a mold, where the pieces are subjected to high pressure and a temperature of 160 degrees Celsius. The pieces are then left to cool, and then be used for articles such as static-free footwear.

Abstract: A lamp-shade structure for a decorative lamp having an inner and an outer lamp-shade. The inner lamp-shade includes an upper annular member, a lower annular member and a flexible material stretched therebetween, while the outer lamp-shade is composed of a number of frame members which are abutted one upon another at their sides to assume a polygonal shade around the inner lamp-shade. The upper and lower annular members are respectively provided with a plurality of loop-shaped lugs equidistantly located along their outer circumferences and extending away from their centers, and the frame members each have replaceably mounted thereon a decorative piece. A connecting element is detachably provided between each lug and each frame member thereby to form a dual lamp-shade construction.