Abstract: A luminous keyboard includes a light guide layer, a light source, a reflecting layer, a circuit layer, a key fixing plate, mechanical keys, and microstructures. The light guide layer has a first surface, a second surface, and a light incident surface. The light source generates a light beam to the light guide layer through the light incident surface. The reflecting layer is disposed beside the first surface of the light guide layer. The circuit layer formed on the second surface of the light guide layer has multiple switches. The key fixing plate is fixed to the second surface of the light guide layer. The mechanical keys are connected to the key fixing plate, corresponding to the switches, and are pressed to trigger the corresponding switches. The microstructures disposed on the light guide layer surround the switches, and guide the light beam from the light guide layer to the mechanical keys.

Abstract: An amplifier includes: a first operational signal path arranged to generate a first pre-output signal according to an input signal under a first operating mode of the amplifier; a second operational signal path arranged to generate a second pre-output signal according to the input signal under a second operating mode of the amplifier; and an output stage, coupled to the first operational signal path and the second operational signal path, for outputting a first output signal according to the first pre-output signal under the first operating mode and outputting a second output signal according to the second pre-output signal under the second operating mode, wherein the first operational signal path and the second operational signal path are arranged to share at least one common circuit element for generating the first pre-output signal and the second pre-output signal under the first operating mode and the second operating mode, respectively.

Abstract: A power line communication device and a power control method thereof are provided. The power line communication device, coupled to a power line in a power line communication system, includes a transmitter, a power coupler, a signal detector and a controller. The transmitter is configured to produce a transmit signal. The power coupler, coupled to the transmitter, is configured to couple the transmit signal to the power line. The signal detector, coupled between the transmitter and the power coupler, is configured to detect the transmit signal. The controller, coupled to the transmitter and the signal detector, is configured to adapt a dynamic range of the transmitter based on the detected transmit signal without conducting a channel sounding procedure.

Abstract: A luminous keyboard includes a light guide layer, a light source, a reflecting layer, a circuit layer, a key fixing plate, mechanical keys, and microstructures. The light guide layer has a first surface, a second surface, and a light incident surface. The light source generates a light beam to the light guide layer through the light incident surface. The reflecting layer is disposed beside the first surface of the light guide layer. The circuit layer formed on the second surface of the light guide layer has multiple switches. The key fixing plate is fixed to the second surface of the light guide layer. The mechanical keys are connected to the key fixing plate, corresponding to the switches, and are pressed to trigger the corresponding switches. The microstructures disposed on the light guide layer surround the switches, and guide the light beam from the light guide layer to the mechanical keys.

Abstract: A power line communication device and a power control method thereof are provided. The power line communication device, coupled to a power line in a power line communication system, includes a transmitter, a power coupler, a signal detector and a controller. The transmitter is configured to produce a transmit signal. The power coupler, coupled to the transmitter, is configured to couple the transmit signal to the power line. The signal detector, coupled between the transmitter and the power coupler, is configured to detect the transmit signal. The controller, coupled to the transmitter and the signal detector, is configured to adapt a dynamic range of the transmitter based on the detected transmit signal without conducting a channel sounding procedure.

Abstract: An amplifying circuit is provided and includes a signal processor, an edge detector, and a calibration controller. The signal processor transforms amplitude information of a first and second input signals into time domain to provide first and second output signals respectively. The edge detector detects a polarity of a voltage offset from a timing relationship of the first and second output signals. The calibration controller compensates the voltage offset according to a change of the detected polarity.

Abstract: An amplifying circuit is provided and includes a signal processor, an edge detector, and a calibration controller. The signal processor transforms amplitude information of a first and second input signals into time domain to provide first and second output signals respectively. The edge detector detects a polarity of a voltage offset from a timing relationship of the first and second output signals. The calibration controller compensates the voltage offset according to a change of the detected polarity.

Abstract: A sigma-delta modulator includes an adder, a filter, a quantizer, and a clock rate controller. The adder receives an input signal and an output signal to generate a summation signal. The filter is coupled to the adder and filters the summation signal to generate a filtered signal. The quantizer is coupled to the filter as well as the adder and quantizes the filtered signal to generate the output signal according to a first clock signal. The clock rate controller is coupled to the quantizer and generates the first clock signal, wherein a frequency of the first clock signal is variable.

Abstract: An amplifier includes a sigma-delta modulating circuit, a power stage circuit, two feedback components, an error suppressing circuit, and a selecting circuit. The sigma-delta modulating circuit generates two input voltages according to two input signals or one single-ended signal. The power stage circuit provides two output voltages according to the two input voltages or an error adjusting voltage. The two feedback components are respectively coupled to two output terminals of the power stage circuit and two input terminals of the sigma-delta modulating circuits. The error suppressing circuit is used for providing the error adjusting voltage according to the two input voltages. The selecting circuit selects outputs depending on whether the two input voltages corresponding to different logic levels or an identical logic level for adjusting the power stage circuit to suppress a mismatch error between the two feedback components.

Abstract: A method and a tool for manufacturing heat radiators are used to assemble a plurality of radiating fins to a heat transferring base. The method includes the steps of putting the radiating fins on the heat transferring base, putting blades between the radiating fins from at least one side of the heat transferring base, and pressing the blades to deform the heat transferring base to make the heat transferring base tightly fitted with the radiating fins. The tool includes a group of cutters and a pressing part. The cutter has blades having edges and pressing portions opposite to the edges. When the radiating fins are connected to the heat transferring base, the cutter may move between the radiating fins in a direction parallel to the heat transferring base. The pressing part is used for pressing the pressing portion to make the edges deform the heat transferring base, which forces the heat transferring base to be tightly fitted with the radiating fins.

Abstract: An amplifier includes a sigma-delta modulating circuit, a power stage circuit, two feedback components, an error suppressing circuit, and a selecting circuit. The sigma-delta modulating circuit generates two input voltages according to two input signals or one single-ended signal. The power stage circuit provides two output voltages according to the two input voltages or an error adjusting voltage. The two feedback components are respectively coupled to two output terminals of the power stage circuit and two input terminals of the sigma-delta modulating circuits. The error suppressing circuit is used for providing the error adjusting voltage according to the two input voltages. The selecting circuit selects outputs depending on whether the two input voltages corresponding to different logic levels or an identical logic level for adjusting the power stage circuit to suppress a mismatch error between the two feedback components.

Abstract: A sigma-delta modulator includes an adder, a filter, a quantizer, and a clock rate controller. The adder receives an input signal and an output signal to generate a summation signal. The filter is coupled to the adder and filters the summation signal to generate a filtered signal. The quantizer is coupled to the filter as well as the adder and quantizes the filtered signal to generate the output signal according to a first clock signal. The clock rate controller is coupled to the quantizer and generates the first clock signal, wherein a frequency of the first clock signal is variable.

Abstract: In a heat-conducting module and a method for manufacturing the same, the heat-conducting module includes a heat-conducting base and a heat pipe. The surface of the heat-conducting base is formed with a groove. Both sides of the groove protrude upwards to form two side walls respectively. Both of the side walls are provided with hooks respectively that are engaged with each other. The heat pipe is accommodated in the groove of the heat-conducting base and is thus covered and sandwiched by the two side walls. Via this arrangement, the connection between the heat pipe and the heat-conducting base can be firm and steady. In this way, the tight contact between the heat pipe and the heat-conducting base can be increased and the heat-conducting efficiency of the heat-conducting module can be enhanced.

Abstract: In a heat sink and the manufacturing method thereof, the heat sink includes heat dissipation fins and heat pipes, and the heat dissipation fins have through holes for the heat pipes to pass through. The heat dissipating fins also have a notch formed at the peripheral of the through hole and communicating with the through hole, and openings formed at two sides of the notch, respectively. According to the manufacturing method, after the heat pipe is assembled with the heat dissipating fin, press strips pass through the openings and are pressed inwardly to reduce the notch to make the notch and the heat pipe plastically deformed. Finally the press strips are removed.

Abstract: An illumination device having an unidirectional heat-dissipating route, includes a heat sink and a LED light module. The heat sink includes a heat plate, a heat pipe and a heat-dissipating body. The heat pipe has a heat absorbing portion and a heat dissipating portion with a horizontal position different to that of the heat absorbing portion. The heat absorbing portion is connected to the heat plate, and a plurality of grooves is formed in the heat pipe to be communicated with the heat absorbing portion and the heat dissipating portion. The heat absorbing portion is lower than the heat dissipating portion. The heat-dissipating body is connected to the heat dissipating portion. The LED light module is connected to the heat plate. Thus the LEDs are protected and prevented from being destroyed by the heat, and the working life thereof is increased greatly.

Abstract: A wafer supporter includes a base and a plurality of rods vertically fixed on the base. Each rod includes holders to support a wafer. Each of the holders has a downwardly slanted top surface relative to the corresponding rod for a pre-determined angle so that the wafer lies on the top surface on its rim.

Abstract: A heat dissipating module includes thermal conductive pipes and a thermal fin module. The thermal fin module made by pressing and stacking is mounted on the thermal conductive pipes. Next, a jig is set on a top surface of the thermal fin module, and a force compresses the thermal fin module, so as to reduce a distance between two fins of the thermal fin module. Then, a fixing plate is set above the thermal fin module on the thermal conductive pipes, and the jig is removed. Finally, the fixing plate is fixed on the thermal fin module, and the thermal fin module is securely fixed with the thermal conductive pipes. Therefore, the assembled heat dissipating module could not be loosed and deformed during delivery and the engaging contact between the fins and the thermal conductive pipes are enhanced, so to increase the heat dissipating effect of the heat dissipating module.

Abstract: A heat dissipating device includes thermal conductive pipes and a plurality of thermal fin modules. Each thermal fin module made by pressing and stacking is mounted on the thermal conductive pipes. A retainer is located between each two thermal fin modules to compress the thermal fin module, so that a distance between two fins of the thermal fin module is reduced. Finally, a fixing plate is set above the last thermal fin module on the thermal conductive pipes to fix the thermal fin modules securely engaged with the thermal conductive pipes. Therefore, the assembled heat dissipating module could not be loosed and deformed during delivery and the engaging contact between the fins and the thermal conductive pipes are enhanced, so to increase the heat dissipating effect of the heat dissipating module.

Abstract: A heat sink and a method for manufacturing the same. The heat sink is used to contact on a heat-generating source of an electronic device. The heat sink comprises a heat-conducting member and at least one heat pipe. With the bottom edge of a heat-absorbing end of the heat pipe contacting with the surface of the heat-generating source, and with the tight connection between the heat pipe and the heat-conducting member, the heat-conducting rate and the heat-dissipating performance of the heat sink can be greatly increase.

Abstract: A heat dissipating module includes thermal conductive pipes and a thermal fin module. The thermal fin module made by pressing and stacking is mounted on the thermal conductive pipes. Next, a jig is set on a top surface of the thermal fin module, and a force compresses the thermal fin module, so as to reduce a distance between two fins of the thermal fin module. Then, a fixing plate is set above the thermal fin module on the thermal conductive pipes, and the jig is removed. Finally, the fixing plate is fixed on the thermal fin module, and the thermal fin module is securely fixed with the thermal conductive pipes. Therefore, the assembled heat dissipating module could not be loosed and deformed during delivery and the engaging contact between the fins and the thermal conductive pipes are enhanced, so to increase the heat dissipating effect of the heat dissipating module.