Patents by Inventor Kuo-Nan Ling

Kuo-Nan Ling has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230405973
    Abstract: A composite material structure, including an outer layer, an inner layer, and a middle layer, is provided. The outer layer includes a metallic material. The inner layer includes a fiber material and a resin material. The outer layer has a first thickness, the inner layer has a second thickness, and the first thickness is different from the second thickness. The middle layer includes an adhesive material and is disposed between the outer layer and the inner layer. Two opposite surfaces of the middle layer are respectively in direct contact with the outer layer and the inner layer. A manufacturing method of the composite material structure is also provided.
    Type: Application
    Filed: May 23, 2023
    Publication date: December 21, 2023
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Han-Ching Huang, Sheng-Hung Lee, Jung-Chin Wu, Kuo-Nan Ling, Chih-Wen Chiang, Chien-Chu Chen
  • Patent number: 11794447
    Abstract: A composite material structure includes a first fiber layer, a second fiber layer, and a third fiber layer. The first fiber layer is composed of a first long fiber and a first resin material. The second fiber layer is composed of a second long fiber and a second resin material. The third fiber layer is disposed between the first fiber layer and the second fiber layer. The third fiber layer is composed of a short fiber and a third resin material. A length of the first long fiber and a length of the second long fiber are both greater than a length of the short fiber, and the length of the short fiber is less than or equal to 25 mm.
    Type: Grant
    Filed: April 18, 2022
    Date of Patent: October 24, 2023
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Han-Ching Huang, Jung-Chin Wu, Kuo-Nan Ling, Sheng-Hung Lee
  • Patent number: 11478966
    Abstract: A composite plate structure includes a composite plate and a resin component. The composite plate includes a first fiber layer, a second fiber layer and a core layer. The second fiber layer has a first region, wherein an area of the second fiber layer is smaller than an area of the first fiber layer. The core layer is disposed between the first fiber layer and the second fiber layer, wherein the core layer is exposed at the first region. The resin component is connected to the composite plate, wherein the resin component is combined with the core layer at the first region. In addition, a manufacturing method of the composite plate is also provided.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: October 25, 2022
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Jung-Chin Wu, Po-An Lin, Sheng-Hung Lee, Han-Ching Huang, Kuo-Nan Ling
  • Publication number: 20220332087
    Abstract: A composite material structure includes a first fiber layer, a second fiber layer, and a third fiber layer. The first fiber layer is composed of a first long fiber and a first resin material. The second fiber layer is composed of a second long fiber and a second resin material. The third fiber layer is disposed between the first fiber layer and the second fiber layer. The third fiber layer is composed of a short fiber and a third resin material. A length of the first long fiber and a length of the second long fiber are both greater than a length of the short fiber, and the length of the short fiber is less than or equal to 25 mm.
    Type: Application
    Filed: April 18, 2022
    Publication date: October 20, 2022
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Han-Ching Huang, Jung-Chin Wu, Kuo-Nan Ling, Sheng-Hung Lee
  • Publication number: 20210031489
    Abstract: The present disclosure provides a composite material including a first thermoplastic adhesive layer made of a first thermoplastic resin, a second thermoplastic adhesive layer made of a second thermoplastic resin, and a core layer. The core layer has a first surface and a second surface, wherein the first surface is bonded to the first thermoplastic adhesive layer, and the second surface is bonded to the second thermoplastic adhesive layer. The core layer has a plurality of cavities, wherein each of the plurality of cavities has a pore diameter smaller than a thickness of the core layer. The first thermoplastic resin and the second thermoplastic resin are respectively adapted to be filled in a part of the plurality of cavities adjacent to the first surface of the core layer and a part of the plurality of cavities adjacent to the second surface of the core layer by heating.
    Type: Application
    Filed: October 20, 2019
    Publication date: February 4, 2021
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Han-Ching Huang, Jung-Chin Wu, Kuo-Nan Ling, Po-An Lin
  • Publication number: 20200130243
    Abstract: A composite plate structure includes a composite plate and a resin component. The composite plate includes a first fiber layer, a second fiber layer and a core layer. The second fiber layer has a first region, wherein an area of the second fiber layer is smaller than an area of the first fiber layer. The core layer is disposed between the first fiber layer and the second fiber layer, wherein the core layer is exposed at the first region. The resin component is connected to the composite plate, wherein the resin component is combined with the core layer at the first region. In addition, a manufacturing method of the composite plate is also provided.
    Type: Application
    Filed: December 23, 2019
    Publication date: April 30, 2020
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Jung-Chin Wu, Po-An Lin, Sheng-Hung Lee, Han-Ching Huang, Kuo-Nan Ling
  • Publication number: 20190025882
    Abstract: A casing including a plate member and a resin member is provided. The plate member has a bottom surface and includes a first surface layer, a second surface layer and a core layer. The first surface layer has a plurality of first through holes and disposed on at least one edge of the first surface layer. The first surface layer and the second surface layer are oppositely disposed on two sides of the core layer. The resin member covers edges and the bottom surface of the plate member and has an extension portion. The extension portion extends between the first surface layer and the second surface layer and adjacent to the core layer. The extension portion further extends to the plurality of first through holes. A manufacturing method of the casing is also provided.
    Type: Application
    Filed: July 16, 2018
    Publication date: January 24, 2019
    Inventors: Han-Ching Huang, Po-An Lin, Jung-Chin Wu, Kuo-Nan Ling
  • Publication number: 20180264873
    Abstract: A decorative film structure includes a foamed resin layer and a protective resin layer. The protective resin layer is disposed on the foamed resin layer and has a stereoscopic patterned surface relatively far from the foamed resin layer. A manufacturing method of the decorative film structure is also provided.
    Type: Application
    Filed: March 14, 2018
    Publication date: September 20, 2018
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Ju-Chen Chiu, Po-An Lin, Sheng-Hung Lee, Kuo-Nan Ling, Chih-Hua Liu
  • Publication number: 20160052247
    Abstract: A manufacturing process for vacuum heat transfer printing is used for transfer printing a pattern of a film onto a main surface of a workpiece. The manufacturing process for vacuum heat transfer printing includes: disposing the workpiece and the film in a mold cavity, wherein the film is located above the main surface of the workpiece, and the main surface is divided into a plurality of blocks; heating the mold cavity; and providing different negative pressures into the mold cavity corresponding to each of the blocks, such that the film is vacuumed onto the blocks in sequence and the patterns are transfer printed onto the main surface of the workpiece in sequence. A jig for the manufacturing process for vacuum heat transfer printing is also provided.
    Type: Application
    Filed: January 18, 2015
    Publication date: February 25, 2016
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Wan-Li Chuang, Kuo-Nan Ling, Po-An Lin
  • Publication number: 20150366088
    Abstract: A composite plate structure includes a composite plate and a resin component. The composite plate includes a first fiber layer, a second fiber layer and a core layer. The second fiber layer has a first region, wherein an area of the second fiber layer is smaller than an area of the first fiber layer. The core layer is disposed between the first fiber layer and the second fiber layer, wherein the core layer is exposed at the first region. The resin component is connected to the composite plate, wherein the resin component is combined with the core layer at the first region. In addition, a manufacturing method of the composite plate is also provided.
    Type: Application
    Filed: May 18, 2015
    Publication date: December 17, 2015
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Jung-Chin Wu, Po-An Lin, Sheng-Hung Lee, Han-Ching Huang, Kuo-Nan Ling
  • Patent number: 9176533
    Abstract: A display device is provided, which includes a back cover and a display module. The back cover has a positioning slot. The display module includes a first frame, a panel module and at least hinge bracket. The first frame is fixed to the back cover. The panel module is fixed to the first frame. The hinge bracket is screwless-mounted to the first frame. One end of the hinge bracket is inserted into the positioning slot to fix the display module to the back cover. Besides, a method for assembling a display device is also provided.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: November 3, 2015
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Pai-Feng Chen, Po-An Lin, Kuo-Nan Ling, Yung-Hui Chen
  • Patent number: 8773606
    Abstract: A display module including an electronic component and a panel module is provided. The electronic component is installed inside the display module. The panel module includes a first side and a second side, and the first side includes a glass module having an electro-conductive material and a display region, wherein the glass module includes an electronic component projection area and the electronic component projection area does not contain the electro-conductive material to prevent affecting the performance of the electronic component. The electronic component projection area is an area where the electronic component is projected on the panel module along a normal direction of the display region. According to a design requirement of the product, the electronic component may be fixed to a frame combined with the panel module or located in the glass module.
    Type: Grant
    Filed: June 29, 2011
    Date of Patent: July 8, 2014
    Assignee: Compal Electronics, Inc.
    Inventors: Kuo-Nan Ling, Po-An Lin, Yung-Hui Chen
  • Patent number: 8681502
    Abstract: A shell structure suitable for an electronic device is provided. The electronic device has a heat generating element. The shell structure includes a core layer, a first material layer, and a second material layer. The core layer includes a thermal insulating area and a thermal conducting area. The core layer has first and second surfaces opposite to each other. The first material layer is configured on the first surface. The second material layer is configured on the second surface. The thermal insulating area is aligned to the heat generating element, and the shell structure covers the heat generating element, such that heat generated by the heat generating element is transferred to the first material layer through the second material layer and the heat conducting area to perform heat dissipation, and a position of the first material layer aligned to the heat generating element is prevented from generating a heat point.
    Type: Grant
    Filed: December 21, 2011
    Date of Patent: March 25, 2014
    Assignee: Compal Electronics, Inc.
    Inventors: Jung-Chin Wu, Po-An Lin, Kuo-Nan Ling, Han-Ching Huang, Wan-Li Chuang
  • Patent number: 8605430
    Abstract: A mobile electronic device includes a first body, a pivot mechanism and a second body. The pivot mechanism includes a rotating element and a supporting element. The rotating element is connected between the first body and the second body to facilitate rotating the second body relatively to the first body. The rotating element includes a guiding trench connected to the second body, and the second body is suitable for sliding relatively to the first body. The supporting element is pivoted to the rotating element or the second body. When the second body slides to drive the rotating element to a rotating position, the rotating element is rotated relatively to the first body to drive the second body for tilting from the first body, and the supporting element is suitable of rotating relatively to the rotating element or the second body to provide a supporting force to the second body.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: December 10, 2013
    Assignee: Compal Electronics, Inc.
    Inventors: Juo-Ti Chen, Po-An Lin, Kuo-Nan Ling, Yung-Hui Chen
  • Patent number: 8574702
    Abstract: A shell structure includes a composite material layer and a second material layer is provided. The composite material layer includes a woven layer and a first material layer. The woven layer has a first surface and a second surface opposite to each other. The first material layer is located on the first surface and has a plurality of through-holes. The second material layer is disposed on the first material layer and has a plurality of extending-portions adapted to be combined with the woven layer and fix the second material layer and the composite material layer to each other. In addition, a manufacturing method for shell structure of electronic device is also provided.
    Type: Grant
    Filed: December 21, 2011
    Date of Patent: November 5, 2013
    Assignee: Compal Electronics, Inc.
    Inventors: Jung-Chin Wu, Po-An Lin, Kuo-Nan Ling, Han-Ching Huang, Chih-Wen Chiang, Chien-Min Chang
  • Publication number: 20130270977
    Abstract: A display device and its assembly method are provided. The display device includes a panel module, a fixing frame and two hinge elements. The fixing frame is provided with two supports and two hinge brackets collectively assembled to be the fixing frame having a hollow portion therein, and each of the hinge brackets includes a placement surface and a hinge contact portion connected with one of the hinge elements. The panel module covers the hollow portion, and is secured on the fixing frame in which the panel module is supported by a placement surface.
    Type: Application
    Filed: April 1, 2013
    Publication date: October 17, 2013
    Inventors: Juo-Ti CHEN, Po-An LIN, Kuo-Nan LING, Yung-Hui CHEN
  • Patent number: 8537542
    Abstract: An electronic device including a first housing, a second housing and a pivot structure is provided. The pivot structure includes a pivot shaft, a sliding component and a supporting component. The pivot shaft is pivoted on the first housing. The sliding component is disposed on the second housing. One end of the sliding component sleeves the pivot shaft, such that the second housing rotates relative to the first housing. The supporting component has a first end and a second end. The first end is pivoted to the first housing. When the second housing rotates relative to the first housing, the supporting component provides a supporting force to the second housing.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: September 17, 2013
    Assignee: Compal Electronics, Inc.
    Inventors: Juo-Ti Chen, Yung-Hui Chen, Kuo-Nan Ling, Po-An Lin
  • Publication number: 20130077227
    Abstract: A display device is provided, which includes a back cover and a display module. The back cover has a positioning slot. The display module includes a first frame, a panel module and at least hinge bracket. The first frame is fixed to the back cover. The panel module is fixed to the first frame. The hinge bracket is screwless-mounted to the first frame. One end of the hinge bracket is inserted into the positioning slot to fix the display module to the back cover. Besides, a method for assembling a display device is also provided.
    Type: Application
    Filed: September 13, 2012
    Publication date: March 28, 2013
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Pai-Feng Chen, Po-An Lin, Kuo-Nan Ling, Yung-Hui Chen
  • Publication number: 20120321840
    Abstract: A three-dimensional workpiece including a first ductile plate, a second ductile plate and a core layer is provided. The core layer is located between the first ductile plate and the second ductile plate. The first ductile plate, the second ductile plate and the core layer are bound together and have a three-dimensional shape. The first ductile plate has a flat area and a curved area. The core layer has a core flat area and a core curved area. The core flat area is superposed with the plate flat area and the core curved area is superposed with the plate curved area.
    Type: Application
    Filed: June 13, 2012
    Publication date: December 20, 2012
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Jung-Chin Wu, Po-An Lin, Kuo-Nan Ling, Han-Ching Huang, Wan-Li Chuang
  • Publication number: 20120170190
    Abstract: An electronic device including a first housing, a second housing and a pivot structure is provided. The pivot structure includes a pivot shaft, a sliding component and a supporting component. The pivot shaft is pivoted on the first housing. The sliding component is disposed on the second housing. One end of the sliding component sleeves the pivot shaft, such that the second housing rotates relative to the first housing. The supporting component has a first end and a second end. The first end is pivoted to the first housing. When the second housing rotates relative to the first housing, the supporting component provides a supporting force to the second housing.
    Type: Application
    Filed: December 29, 2011
    Publication date: July 5, 2012
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Juo-Ti Chen, Yung-Hui Chen, Kuo-Nan Ling, Po-An Lin