Patents by Inventor Kuo-Nan Ling
Kuo-Nan Ling has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230405973Abstract: A composite material structure, including an outer layer, an inner layer, and a middle layer, is provided. The outer layer includes a metallic material. The inner layer includes a fiber material and a resin material. The outer layer has a first thickness, the inner layer has a second thickness, and the first thickness is different from the second thickness. The middle layer includes an adhesive material and is disposed between the outer layer and the inner layer. Two opposite surfaces of the middle layer are respectively in direct contact with the outer layer and the inner layer. A manufacturing method of the composite material structure is also provided.Type: ApplicationFiled: May 23, 2023Publication date: December 21, 2023Applicant: COMPAL ELECTRONICS, INC.Inventors: Han-Ching Huang, Sheng-Hung Lee, Jung-Chin Wu, Kuo-Nan Ling, Chih-Wen Chiang, Chien-Chu Chen
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Patent number: 11794447Abstract: A composite material structure includes a first fiber layer, a second fiber layer, and a third fiber layer. The first fiber layer is composed of a first long fiber and a first resin material. The second fiber layer is composed of a second long fiber and a second resin material. The third fiber layer is disposed between the first fiber layer and the second fiber layer. The third fiber layer is composed of a short fiber and a third resin material. A length of the first long fiber and a length of the second long fiber are both greater than a length of the short fiber, and the length of the short fiber is less than or equal to 25 mm.Type: GrantFiled: April 18, 2022Date of Patent: October 24, 2023Assignee: COMPAL ELECTRONICS, INC.Inventors: Han-Ching Huang, Jung-Chin Wu, Kuo-Nan Ling, Sheng-Hung Lee
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Patent number: 11478966Abstract: A composite plate structure includes a composite plate and a resin component. The composite plate includes a first fiber layer, a second fiber layer and a core layer. The second fiber layer has a first region, wherein an area of the second fiber layer is smaller than an area of the first fiber layer. The core layer is disposed between the first fiber layer and the second fiber layer, wherein the core layer is exposed at the first region. The resin component is connected to the composite plate, wherein the resin component is combined with the core layer at the first region. In addition, a manufacturing method of the composite plate is also provided.Type: GrantFiled: December 23, 2019Date of Patent: October 25, 2022Assignee: COMPAL ELECTRONICS, INC.Inventors: Jung-Chin Wu, Po-An Lin, Sheng-Hung Lee, Han-Ching Huang, Kuo-Nan Ling
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Publication number: 20220332087Abstract: A composite material structure includes a first fiber layer, a second fiber layer, and a third fiber layer. The first fiber layer is composed of a first long fiber and a first resin material. The second fiber layer is composed of a second long fiber and a second resin material. The third fiber layer is disposed between the first fiber layer and the second fiber layer. The third fiber layer is composed of a short fiber and a third resin material. A length of the first long fiber and a length of the second long fiber are both greater than a length of the short fiber, and the length of the short fiber is less than or equal to 25 mm.Type: ApplicationFiled: April 18, 2022Publication date: October 20, 2022Applicant: COMPAL ELECTRONICS, INC.Inventors: Han-Ching Huang, Jung-Chin Wu, Kuo-Nan Ling, Sheng-Hung Lee
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Publication number: 20210031489Abstract: The present disclosure provides a composite material including a first thermoplastic adhesive layer made of a first thermoplastic resin, a second thermoplastic adhesive layer made of a second thermoplastic resin, and a core layer. The core layer has a first surface and a second surface, wherein the first surface is bonded to the first thermoplastic adhesive layer, and the second surface is bonded to the second thermoplastic adhesive layer. The core layer has a plurality of cavities, wherein each of the plurality of cavities has a pore diameter smaller than a thickness of the core layer. The first thermoplastic resin and the second thermoplastic resin are respectively adapted to be filled in a part of the plurality of cavities adjacent to the first surface of the core layer and a part of the plurality of cavities adjacent to the second surface of the core layer by heating.Type: ApplicationFiled: October 20, 2019Publication date: February 4, 2021Applicant: COMPAL ELECTRONICS, INC.Inventors: Han-Ching Huang, Jung-Chin Wu, Kuo-Nan Ling, Po-An Lin
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Publication number: 20200130243Abstract: A composite plate structure includes a composite plate and a resin component. The composite plate includes a first fiber layer, a second fiber layer and a core layer. The second fiber layer has a first region, wherein an area of the second fiber layer is smaller than an area of the first fiber layer. The core layer is disposed between the first fiber layer and the second fiber layer, wherein the core layer is exposed at the first region. The resin component is connected to the composite plate, wherein the resin component is combined with the core layer at the first region. In addition, a manufacturing method of the composite plate is also provided.Type: ApplicationFiled: December 23, 2019Publication date: April 30, 2020Applicant: COMPAL ELECTRONICS, INC.Inventors: Jung-Chin Wu, Po-An Lin, Sheng-Hung Lee, Han-Ching Huang, Kuo-Nan Ling
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Publication number: 20190025882Abstract: A casing including a plate member and a resin member is provided. The plate member has a bottom surface and includes a first surface layer, a second surface layer and a core layer. The first surface layer has a plurality of first through holes and disposed on at least one edge of the first surface layer. The first surface layer and the second surface layer are oppositely disposed on two sides of the core layer. The resin member covers edges and the bottom surface of the plate member and has an extension portion. The extension portion extends between the first surface layer and the second surface layer and adjacent to the core layer. The extension portion further extends to the plurality of first through holes. A manufacturing method of the casing is also provided.Type: ApplicationFiled: July 16, 2018Publication date: January 24, 2019Inventors: Han-Ching Huang, Po-An Lin, Jung-Chin Wu, Kuo-Nan Ling
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Publication number: 20180264873Abstract: A decorative film structure includes a foamed resin layer and a protective resin layer. The protective resin layer is disposed on the foamed resin layer and has a stereoscopic patterned surface relatively far from the foamed resin layer. A manufacturing method of the decorative film structure is also provided.Type: ApplicationFiled: March 14, 2018Publication date: September 20, 2018Applicant: COMPAL ELECTRONICS, INC.Inventors: Ju-Chen Chiu, Po-An Lin, Sheng-Hung Lee, Kuo-Nan Ling, Chih-Hua Liu
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Publication number: 20160052247Abstract: A manufacturing process for vacuum heat transfer printing is used for transfer printing a pattern of a film onto a main surface of a workpiece. The manufacturing process for vacuum heat transfer printing includes: disposing the workpiece and the film in a mold cavity, wherein the film is located above the main surface of the workpiece, and the main surface is divided into a plurality of blocks; heating the mold cavity; and providing different negative pressures into the mold cavity corresponding to each of the blocks, such that the film is vacuumed onto the blocks in sequence and the patterns are transfer printed onto the main surface of the workpiece in sequence. A jig for the manufacturing process for vacuum heat transfer printing is also provided.Type: ApplicationFiled: January 18, 2015Publication date: February 25, 2016Applicant: COMPAL ELECTRONICS, INC.Inventors: Wan-Li Chuang, Kuo-Nan Ling, Po-An Lin
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Publication number: 20150366088Abstract: A composite plate structure includes a composite plate and a resin component. The composite plate includes a first fiber layer, a second fiber layer and a core layer. The second fiber layer has a first region, wherein an area of the second fiber layer is smaller than an area of the first fiber layer. The core layer is disposed between the first fiber layer and the second fiber layer, wherein the core layer is exposed at the first region. The resin component is connected to the composite plate, wherein the resin component is combined with the core layer at the first region. In addition, a manufacturing method of the composite plate is also provided.Type: ApplicationFiled: May 18, 2015Publication date: December 17, 2015Applicant: COMPAL ELECTRONICS, INC.Inventors: Jung-Chin Wu, Po-An Lin, Sheng-Hung Lee, Han-Ching Huang, Kuo-Nan Ling
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Patent number: 9176533Abstract: A display device is provided, which includes a back cover and a display module. The back cover has a positioning slot. The display module includes a first frame, a panel module and at least hinge bracket. The first frame is fixed to the back cover. The panel module is fixed to the first frame. The hinge bracket is screwless-mounted to the first frame. One end of the hinge bracket is inserted into the positioning slot to fix the display module to the back cover. Besides, a method for assembling a display device is also provided.Type: GrantFiled: September 13, 2012Date of Patent: November 3, 2015Assignee: COMPAL ELECTRONICS, INC.Inventors: Pai-Feng Chen, Po-An Lin, Kuo-Nan Ling, Yung-Hui Chen
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Patent number: 8773606Abstract: A display module including an electronic component and a panel module is provided. The electronic component is installed inside the display module. The panel module includes a first side and a second side, and the first side includes a glass module having an electro-conductive material and a display region, wherein the glass module includes an electronic component projection area and the electronic component projection area does not contain the electro-conductive material to prevent affecting the performance of the electronic component. The electronic component projection area is an area where the electronic component is projected on the panel module along a normal direction of the display region. According to a design requirement of the product, the electronic component may be fixed to a frame combined with the panel module or located in the glass module.Type: GrantFiled: June 29, 2011Date of Patent: July 8, 2014Assignee: Compal Electronics, Inc.Inventors: Kuo-Nan Ling, Po-An Lin, Yung-Hui Chen
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Patent number: 8681502Abstract: A shell structure suitable for an electronic device is provided. The electronic device has a heat generating element. The shell structure includes a core layer, a first material layer, and a second material layer. The core layer includes a thermal insulating area and a thermal conducting area. The core layer has first and second surfaces opposite to each other. The first material layer is configured on the first surface. The second material layer is configured on the second surface. The thermal insulating area is aligned to the heat generating element, and the shell structure covers the heat generating element, such that heat generated by the heat generating element is transferred to the first material layer through the second material layer and the heat conducting area to perform heat dissipation, and a position of the first material layer aligned to the heat generating element is prevented from generating a heat point.Type: GrantFiled: December 21, 2011Date of Patent: March 25, 2014Assignee: Compal Electronics, Inc.Inventors: Jung-Chin Wu, Po-An Lin, Kuo-Nan Ling, Han-Ching Huang, Wan-Li Chuang
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Patent number: 8605430Abstract: A mobile electronic device includes a first body, a pivot mechanism and a second body. The pivot mechanism includes a rotating element and a supporting element. The rotating element is connected between the first body and the second body to facilitate rotating the second body relatively to the first body. The rotating element includes a guiding trench connected to the second body, and the second body is suitable for sliding relatively to the first body. The supporting element is pivoted to the rotating element or the second body. When the second body slides to drive the rotating element to a rotating position, the rotating element is rotated relatively to the first body to drive the second body for tilting from the first body, and the supporting element is suitable of rotating relatively to the rotating element or the second body to provide a supporting force to the second body.Type: GrantFiled: November 30, 2011Date of Patent: December 10, 2013Assignee: Compal Electronics, Inc.Inventors: Juo-Ti Chen, Po-An Lin, Kuo-Nan Ling, Yung-Hui Chen
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Patent number: 8574702Abstract: A shell structure includes a composite material layer and a second material layer is provided. The composite material layer includes a woven layer and a first material layer. The woven layer has a first surface and a second surface opposite to each other. The first material layer is located on the first surface and has a plurality of through-holes. The second material layer is disposed on the first material layer and has a plurality of extending-portions adapted to be combined with the woven layer and fix the second material layer and the composite material layer to each other. In addition, a manufacturing method for shell structure of electronic device is also provided.Type: GrantFiled: December 21, 2011Date of Patent: November 5, 2013Assignee: Compal Electronics, Inc.Inventors: Jung-Chin Wu, Po-An Lin, Kuo-Nan Ling, Han-Ching Huang, Chih-Wen Chiang, Chien-Min Chang
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Publication number: 20130270977Abstract: A display device and its assembly method are provided. The display device includes a panel module, a fixing frame and two hinge elements. The fixing frame is provided with two supports and two hinge brackets collectively assembled to be the fixing frame having a hollow portion therein, and each of the hinge brackets includes a placement surface and a hinge contact portion connected with one of the hinge elements. The panel module covers the hollow portion, and is secured on the fixing frame in which the panel module is supported by a placement surface.Type: ApplicationFiled: April 1, 2013Publication date: October 17, 2013Inventors: Juo-Ti CHEN, Po-An LIN, Kuo-Nan LING, Yung-Hui CHEN
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Patent number: 8537542Abstract: An electronic device including a first housing, a second housing and a pivot structure is provided. The pivot structure includes a pivot shaft, a sliding component and a supporting component. The pivot shaft is pivoted on the first housing. The sliding component is disposed on the second housing. One end of the sliding component sleeves the pivot shaft, such that the second housing rotates relative to the first housing. The supporting component has a first end and a second end. The first end is pivoted to the first housing. When the second housing rotates relative to the first housing, the supporting component provides a supporting force to the second housing.Type: GrantFiled: December 29, 2011Date of Patent: September 17, 2013Assignee: Compal Electronics, Inc.Inventors: Juo-Ti Chen, Yung-Hui Chen, Kuo-Nan Ling, Po-An Lin
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Publication number: 20130077227Abstract: A display device is provided, which includes a back cover and a display module. The back cover has a positioning slot. The display module includes a first frame, a panel module and at least hinge bracket. The first frame is fixed to the back cover. The panel module is fixed to the first frame. The hinge bracket is screwless-mounted to the first frame. One end of the hinge bracket is inserted into the positioning slot to fix the display module to the back cover. Besides, a method for assembling a display device is also provided.Type: ApplicationFiled: September 13, 2012Publication date: March 28, 2013Applicant: COMPAL ELECTRONICS, INC.Inventors: Pai-Feng Chen, Po-An Lin, Kuo-Nan Ling, Yung-Hui Chen
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Publication number: 20120321840Abstract: A three-dimensional workpiece including a first ductile plate, a second ductile plate and a core layer is provided. The core layer is located between the first ductile plate and the second ductile plate. The first ductile plate, the second ductile plate and the core layer are bound together and have a three-dimensional shape. The first ductile plate has a flat area and a curved area. The core layer has a core flat area and a core curved area. The core flat area is superposed with the plate flat area and the core curved area is superposed with the plate curved area.Type: ApplicationFiled: June 13, 2012Publication date: December 20, 2012Applicant: COMPAL ELECTRONICS, INC.Inventors: Jung-Chin Wu, Po-An Lin, Kuo-Nan Ling, Han-Ching Huang, Wan-Li Chuang
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Publication number: 20120170190Abstract: An electronic device including a first housing, a second housing and a pivot structure is provided. The pivot structure includes a pivot shaft, a sliding component and a supporting component. The pivot shaft is pivoted on the first housing. The sliding component is disposed on the second housing. One end of the sliding component sleeves the pivot shaft, such that the second housing rotates relative to the first housing. The supporting component has a first end and a second end. The first end is pivoted to the first housing. When the second housing rotates relative to the first housing, the supporting component provides a supporting force to the second housing.Type: ApplicationFiled: December 29, 2011Publication date: July 5, 2012Applicant: COMPAL ELECTRONICS, INC.Inventors: Juo-Ti Chen, Yung-Hui Chen, Kuo-Nan Ling, Po-An Lin