Abstract: A computing device obtains an image depicting an image of a user's face. The computing device identifies facial features in the user's face in the image and extracts characteristics of the facial features in the user's face in the image. The computing device predicts a skin tone of the user's face depicted in the image and generates a face chart based on the facial feature characteristics. The computing device adjusts a color of a facial region in the face chart according to the predicted skin tone and obtains lighting characteristics of the image of the user's face. The computing device adjusts one or more colors in the face chart based on the lighting characteristics of the image of the user's face.

Abstract: A computing device obtains an image depicting an image of a user's face. The computing device identifies one or more regions in the image depicting skin of the user and generates a skin mask. A skin tone of the user's face is predicted and the skin mask is populated according to the predicted skin tone. The computing device defines feature points corresponding to facial features on the user's face and extracts pre-defined facial patterns matching facial features depicted in the image. The extracted pre-defined facial patterns are inserted into the skin mask based on the feature points and a hair mask identifying one or more regions depicting hair of the user is generated. The computing device extracts a hair region depicted in the image of the user based on the hair mask and inserts the hair region on top of the skin mask to generate a face chart.

Abstract: Devices and method for forming a switch including a heater layer including a first heater pad, a second heater pad, and a heater line connecting the first heater pad and the second heater pad, a phase change material (PCM) layer positioned in a same vertical plane as the heater line, and a floating spreader layer including a first portion positioned in the same vertical plane as the heater line and the PCM layer, in which the first portion has a first width that is less than or equal to a distance between proximate sidewalls of the first heater pad and the second heater pad.

Abstract: A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. The conductive ring-like structure surrounds a central region of the chip. The chip package structure includes a first solder structure over the conductive ring-like structure. The first solder structure and the conductive ring-like structure are made of different materials.

Abstract: Some implementations described herein include systems and techniques for fabricating a wafer-on-wafer product using a filled lateral gap between beveled regions of wafers included in a stacked-wafer assembly and along a perimeter region of the stacked-wafer assembly. The systems and techniques include a deposition tool having an electrode with a protrusion that enhances an electromagnetic field along the perimeter region of the stacked-wafer assembly during a deposition operation performed by the deposition tool. Relative to an electromagnetic field generated by a deposition tool not including the electrode with the protrusion, the enhanced electromagnetic field improves the deposition operation so that a supporting fill material may be sufficiently deposited.

Abstract: A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.

Abstract: A package structure having a solder mask layer with a low dielectric constant includes a substrate, a conductive structure on the substrate, and a solder mask layer on the substrate. The solder mask layer includes bubbles and a solder mask material, wherein the bubbles are disposed within the solder mask layer and the solder mask material covers the bubbles.

Abstract: A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.

Abstract: A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.

Abstract: A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.

Abstract: A polyimide polymer, polyimide film and polyimide laminate plate including the same are provided. The polyimide polymer includes Formula (I), Formula (II) and Formula (III). In Formula (I), Formula (II) and Formula (III), A is an aromatic group with fluorine, B, B?, and B? are aromatic groups different from one another. B/(B+B?+B?), B?/(B+B?+B?), and B?/(B+B?+B?) are larger than 0. The polyimide film includes a film layer which includes the above polyimide polymer. The film layer optionally includes colorants or inorganic nanoparticles. Therefore, the thermal resistance and the transparency of the polyimide film are improved, and a polyimide film with high thermal resistance and different colors is available. The polyimide solution can also be applied on metal film to form polyimide laminate plate.

Abstract: A polyimide polymer, polyimide film and polyimide laminate plate including the same are provided. The polyimide polymer includes Formula (I), Formula (II) and Formula (III). In Formula (I), Formula (II) and Formula (III), A is an aromatic group with fluorine, B, B?, and B? are aromatic groups different from one another. B/(B+B?+B?), B?/(B+B?+B?), and B?/(B+B?+B?) are larger than 0. The polyimide film includes a film layer which includes the above polyimide polymer. The film layer optionally includes colorants or inorganic nanoparticles. Therefore, the thermal resistance and the transparency of the polyimide film are improved, and a polyimide film with high thermal resistance and different colors is available. The polyimide solution can also be applied on metal film to form polyimide laminate plate.

Abstract: A manufacturing method of multilayer flexible circuit structure including the following steps is provided. Two first flexible substrates are correspondingly bonded on two sides of a release film, and two conductive materials are correspondingly formed on the two first flexible substrates. The two conductive materials are patterned to form two first inner-layer circuits. Two outer build-up structures are bonded on the two corresponding first flexible substrates. The release film is removed, so as to separate the two first flexible substrates. An outer-layer circuit is formed on each of the first flexible substrates and the corresponding outer build-up structure, wherein the outer-layer circuit is connected to the corresponding first inner-layer circuit, and each of the first flexible substrates, the corresponding first inner-layer circuit, the outer build-up structure and the outer-layer circuit correspondingly form a multilayer flexible circuit structure.

Abstract: A polyimide film comprising a polyimide and a lithium iron phosphate and a polyimide laminate thereof are disclosed. The weight percentage of the lithium iron phosphate is between 1 wt % and 49 wt %, and the weight percentage of the lithium iron phosphate is based on the total weight of the polyimide film. The polyimide laminate comprises a substrate and a polyimide film. The polyimide film covers the substrate.

Abstract: A polyimide film comprising a polyimide and a lithium iron phosphate and a polyimide laminate thereof are disclosed. The weight percentage of the lithium iron phosphate is between 1 wt % and 49 wt %, and the weight percentage of the lithium iron phosphate is based on the total weight of the polyimide film. The polyimide laminate comprises a substrate and a polyimide film. The polyimide film covers the substrate.

Abstract: Disclosed is an ordered microelectronic fabrication sequence in which color filters are formed by conformal deposition directly onto a photodetector array of a CCD, CID, or CMOS imaging device to create a concave-up pixel surface, and, overlayed with a high transmittance planarizing film of specified index of refraction and physical properties which optimize light collection to the photodiode without additional conventional microlenses. The optically flat top surface serves to encapsulate and protect the imager from chemical and thermal cleaning treatment damage, minimizes topographical underlayer variations which would aberrate or cause reflection losses of images formed on non-planar surfaces, and, obviates residual particle inclusions induced during dicing and packaging. A CCD imager is formed by photolithographically patterning a planar-array of photodiodes on a semiconductor substrate. The photodiode array is provided with metal photoshields, passivated, and, color filters are formed thereon.

Abstract: A handle mechanism is adapted to a projector having a case. The handle mechanism has a frame, a rod, a grip, a positioning element, and an elastic element. The frame is connected to the case and has a through hole. The rod penetrates through the through hole and is capable of moving relatively to the frame. The rod has a first end, a second end, an anchor portion at the first end thereof, a first positioning portion, and a second positioning portion. The grip is connected to the second end of the rod, wherein the anchor portions limit a movement range of the grip relative to the rods and the frame. The positioning element is located between the frame and the rod. The elastic element is located between the frame and the positioning element, and forces the positioning element to physically interfere with the first or the second positioning portion.

Abstract: The present invention relates to a polyimide based flexible copper clad laminate for manufacturing a flexible printed circuit board. The polyimide based flexible copper clad laminate comprises, in order, a copper foil, a thermoset polyimide layer, a thermoplastic polyimide layer, a thermoset polyimide layer, and a copper foil. The present invention also relates to a method for producing the polyimide copper foil laminate. First, a structure of copper foil coated with thermoset polyimide is formed. Then, the thermoset polyimide layers of two of the structures are adhered to each other by thermoplastic polyimide. Finally, after compressing and curing, the polyimide based flexible copper clad laminate according to the present invention is produced.