Abstract: A method includes forming a first conductive feature over a semiconductor substrate, forming an ILD layer over the first conductive feature, patterning the ILD layer to form a trench, and forming a conductive layer over the patterned ILD layer to fill the trench. The method further includes polishing the conductive layer to form a via contact configured to interconnect the first conductive feature with a second conductive feature, where polishing the conductive layer exposes a top surface of the ILD layer, polishing the exposed top surface of the ILD layer, such that a top portion of the via contact protrudes from the exposed top surface of the ILD layer, and forming the second conductive feature over the via contact, such that the top portion of the via contact extends into the second conductive feature.

Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.

Abstract: An imaging lens assembly includes a first optical element and a low-reflection layer. The first optical element has a central opening, and includes a first surface, a second surface and a first outer diameter surface. The first outer diameter surface is connected to the first surface and the second surface. The low-reflection layer is located on at least one of the first surface and the second surface, and includes a carbon black layer, a nano-microstructure and a coating layer. The nano-microstructure is directly contacted with and connected to the carbon black layer, and the nano-microstructure is farther from the first optical element than the carbon black layer from the first optical element. The coating layer is directly contacted with and connected to the nano-microstructure, and the coating layer is farther from the first optical element than the nano-microstructure from the first optical element.

Abstract: An imaging lens assembly includes a first optical element and a low-reflection layer. The first optical element has a central opening, and includes a first surface, a second surface and a first outer diameter surface. The first outer diameter surface is connected to the first surface and the second surface. The low-reflection layer is located on at least one of the first surface and the second surface, and includes a carbon black layer, a nano-microstructure and a coating layer. The nano-microstructure is directly contacted with and connected to the carbon black layer, and the nano-microstructure is farther from the first optical element than the carbon black layer from the first optical element. The coating layer is directly contacted with and connected to the nano-microstructure, and the coating layer is farther from the first optical element than the nano-microstructure from the first optical element.

Abstract: A method of fabricating a semiconductor structure includes the following steps. A semiconductor wafer is provided. A plurality of first surface mount components and a plurality of second surface mount components are bonded onto the semiconductor wafer, wherein a first portion of each of the second surface mount components is overhanging a periphery of the semiconductor wafer. A first barrier structure is formed in between the second surface mount components and the semiconductor wafer. An underfill structure is formed under a second portion of each of the second surface mount components, wherein the first barrier structure blocks the spreading of the underfill structure from the second portion to the first portion.

Abstract: The present disclosure provides a thin film including a first thermoplastic polyolefin (TPO) elastomer which is anhydride-grafted. The present disclosure further provides a method for manufacturing the thin film, a laminated material and a method for adhesion.

Abstract: This disclosure relates to a surgical tool configured for holding an implant includes an inner rod and a sleeve. The inner rod includes a rod portion and a holding portion. The holding portion is located at one end of the rod portion and has a first accommodation space configured for accommodating at least part of the implant. The sleeve includes a sleeving portion and a retaining portion. The sleeving portion is slidably sleeved on the rod portion of the inner rod. The retaining portion is located at one end of the sleeving portion and selectively presses against the holding portion. The inner rod further includes at least one fin portion protruded from the holding portion and located in the first accommodation space for being inserted into at least one slot of the implant.

Abstract: A waist-twisting machine includes a main base, a rotating unit, an auxiliary base, and a hull unit. The main base has a first post, a fixing base, a power source, a gear unit and two press members. The rotating unit has a disc and a hoop deposited movably in the disc, which is rotated at its original location by two press members rotated by the gear unit driven by the power source. The hoop is moved by the disc in a circle of non-axial center with the disc, provided with numerous massage rollers in its inner surface so that a user entering the hoop may receive twisting action together with massage action synchronously, obtaining the effect of waist twisting and slimming at the same time.

Abstract: A waist-twisting machine includes a main base, a rotating unit, an auxiliary base, and a hull unit. The main base has a first post, a fixing base, a power source, a gear unit and two press members. The rotating unit has a disc and a hoop deposited movably in the disc, which is rotated at its original location by two press members rotated by the gear unit driven by the power source. The hoop is moved by the disc in a circle of non-axial center with the disc, provided with numerous massage rollers in its inner surface so that a user entering the hoop may receive twisting action together with massage action synchronously, obtaining the effect of waist twisting and slimming at the same time.

Abstract: A waist-twisting machine includes a post, a fixing base, a moving mechanism, a hoop body and a hull. The fixing base is movably combined with the post to move up and down, and the moving mechanism is deposited in the fixing base, consisting of a power source to rotate a gear unit, which then rotates two rotating arms connected with an interacting arm to make a horizontal movement in a circle as a hula hoop does. The hoop body is connected with the interactive arm to be moved in the same track as the interactive arm, with numerous massage rollers fixed on an inner surface of the hoop body. Then a user standing in the hoop body can be compelled to move together with the hoop body, with the waist thus twisted and massaged at the same time.

Abstract: A metal racket includes a shock removing member, a frame and a handle. The shock removing member has a fitting hole for a lower end of the frame having two shaft rods to fit through and into a hollow interior of the handle and fixed therein by rivets passing through rivet holes of the handle, the shock removing member and the shaft rods. Thus a shock reducing hollow space is formed between the lower end of the shock removing member and the lower end of the handle, When the racket receives shock in hitting a ball, the shock is firstly buffered by the shock removing member and then reduced by the shock reducing hollow space again.