Abstract: An electronic package assembly is provided. The electronic package assembly includes a package substrate having a first surface and a second surface opposite thereto. A plurality of conductive pads is disposed on the first surface. A chip is mounted onto the first surface of the package substrate. A circuit board is mounted onto the second surface of the package substrate, and includes an electrical connector. A plurality of electrical contact components is electrically connected to the electrical connector and is in contact with the plurality of conductive pads.

Abstract: An electronic package assembly is provided. The electronic package assembly includes a package substrate having a first surface and a second surface opposite thereto. A plurality of conductive pads is disposed on the first surface. A chip is mounted onto the first surface of the package substrate. A circuit board is mounted onto the second surface of the package substrate, and includes an electrical connector. A plurality of electrical contact components is electrically connected to the electrical connector and is in contact with the plurality of conductive pads.

Abstract: A thermal dissipating module comprises a heat pipe with a first end and a second end, a first joint component connected to the first end, a second joint component connected to the second end, a first thermal conductive plate, and a second thermal conductive plate. It also can be used in an electronic apparatus with a thermal dissipating module.

Abstract: A thermal dissipating module comprises a heat pipe with a first end and a second end, a first joint component connected to the first end, a second joint component connected to the second end, a first thermal conductive plate, and a second thermal conductive plate. It also can be used in an electronic apparatus with a thermal dissipating module.

Abstract: A heat dissipating module suitable for being disposed between a first fixed heat spreader and a second fixed heat spreader is provided. The heat dissipating module includes a first heat pipe, a second heat pipe, and a thermal conductive block. One end of the first heat pipe is connected with the first heat spreader. One end of the second heat pipe is connected with the second heat spreader. The thermal conductive block connects the other end of the first heat pipe with the other end of the second heat pipe.

Abstract: A heat-dissipating device has multiple conduction paths, and is especially adapted to a package with MPMs (Multiple Packaging Modules). The package is mounted on one side of a PCB. The heat-dissipating device has a first heat-dissipating unit, a second heat-dissipating unit, and a thermal bridge unit. The first heat-dissipating unit is contacted with a first heat source of the package element. The second heat-dissipating unit penetrates through the PCB and contacts with a second heat source of the package element. The thermal bridge unit penetrates through the PCB and connects the first heat-dissipating unit and the second heat-dissipating unit.

Abstract: A process for fabricating a heat sink with high-density parallel fins is provided. The process includes steps of providing a metal block including a first base and a second base, the first base being rectangular-solid shaped, the second base being rhombus-shaped and disposed over the first base wherein the second base includes a first edge surface and a second edge surface inclined at a specific angle, cutting the second base from a position on the top surface of the second base and parallel with the first edge surface until the first base is reached, thereby forming an inclined sheet, adjusting the inclined sheet to be normal to the top surface of the first base, thereby forming a fin, and repeating the cutting step and the adjusting step to produce the heat sink with high-density parallel fins.

Abstract: A process for fabricating a heat sink with high-density parallel fins is provided. The process includes steps of providing a metal base including a first base and a second base, the first base being rectangular-solid shaped, the second base being rhombus-shaped and disposed over the first base wherein the second base includes a first edge surface and a second edge surface inclined at a specific angle, cutting the second base from a position on the top surface of the second base and parallel with the first edge surface until the first base is reached, thereby forming an inclined sheet, adjusting the inclined sheet to be normal to the top surface of the first base, thereby forming a fin, and repeating the cutting step and the adjusting step to produce the heat sink with high-density parallel fins.