Patents by Inventor Kurt Bovensiepen

Kurt Bovensiepen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for producing an absorber material
    Patent number: 6426380
    Abstract: A method is described for producing an improved addition-crosslinked silicone rubber which is used as a damping material in hermetically sealed housings having a semiconductor.
    Type: Grant
    Filed: July 24, 2000
    Date of Patent: July 30, 2002
    Assignee: Robert Bosch GmbH
    Inventors: Kurt Bovensiepen, Mathias Pieper, Detlef Spachmann
  • Multilayer circuit board having at least one core substrate arranged therein
    Patent number: 6222740
    Abstract: A multilayer circuit board includes multiple conductor path planes arranged one above another and separated by insulating material layers. The multilayer circuit board includes at least one electronic component (in particular an LCCC) placed on one of the two outer sides of the multilayer circuit board. The multilayer circuit board includes at least one core substrate arranged in the multilayer circuit board between the outer insulating material layers. The core substrate largely adapts the thermal expansion properties of the multilayer circuit board, at least in the coverage area of the electronic component, to the thermal expansion properties of the component. In order to achieve a reduction in the weight of the multilayer circuit board, an inner layer portion, equipped with a recess, is provided between the two outer insulating material layers.
    Type: Grant
    Filed: December 11, 1998
    Date of Patent: April 24, 2001
    Assignee: Robert Bosch GmbH
    Inventors: Kurt Bovensiepen, Helmut Ulmer, Gerhard Messarosch