Patents by Inventor Kurt Douglas Roberts
Kurt Douglas Roberts has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11259368Abstract: A thin-film heating device includes a base layer, a bus bar layer and an electrode layer. The base layer includes a polymeric resistive layer, including conductive filler, in contact with a polymeric dielectric layer. The polymeric resistive layer has a sheet resistance in a range of from about 0.5 ohm/square to about 2 Megaohm/square. The bus bar layer is adhered to the polymeric dielectric layer of the base layer. The bus bar layer includes a first patterned conductive material. The electrode layer includes a second patterned conductive material and is electrically connected to the bus bar layer.Type: GrantFiled: July 21, 2017Date of Patent: February 22, 2022Assignee: DUPONT ELECTRONICS, INC.Inventors: Kurt Douglas Roberts, Jonathan A. Weldon
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Publication number: 20180027612Abstract: A thin-film heating device includes a base layer, a bus bar layer and an electrode layer. The base layer includes a polymeric resistive layer, including conductive filler, in contact with a polymeric dielectric layer. The polymeric resistive layer has a sheet resistance in a range of from about 0.5 ohm/square to about 2 Megaohm/square. The bus bar layer is adhered to the polymeric dielectric layer of the base layer. The bus bar layer includes a first patterned conductive material. The electrode layer includes a second patterned conductive material and is electrically connected to the bus bar layer.Type: ApplicationFiled: July 21, 2017Publication date: January 25, 2018Inventors: KURT DOUGLAS ROBERTS, JONATHAN A. WELDON
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Publication number: 20160183328Abstract: The present invention relates to the design, construction and manufacture of a novel electrical high temperature heater having a polymer thick film conductor paste with which to form an electrode on resistive film.Type: ApplicationFiled: December 17, 2015Publication date: June 23, 2016Inventors: JOHN GRAEME PEPIN, JOHN DONALD SUMMERS, SEIGI SUH, KURT DOUGLAS ROBERTS, DANNY E GLENN
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Publication number: 20150108530Abstract: A flexible layered structure is disclosed having a flexible top conductive layer, a flexible bottom heat sink layer and a flexible dielectric middle layer. The combination has a longitudinal axis and a plurality of defined positions spaced along the longitudinal axis. The defined positions can be used for aligning a circuit and/or for the placement of LED lights. The flexible layered structure can be easily bent to form a LED substrate for shining light in more than one direction while efficiently removing heat arising from the LEDs.Type: ApplicationFiled: October 23, 2013Publication date: April 23, 2015Applicant: E I DU PONT DE NEMOURS AND COMPANYInventor: KURT DOUGLAS ROBERTS
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Publication number: 20150016122Abstract: A flexible layered structure is disclosed having a flexible top conductive layer, a flexible bottom heat sink layer and a flexible dielectric middle layer. The combination has a longitudinal axis and a plurality of defined positions spaced along the longitudinal axis. The defined positions can be used for aligning a circuit and/or for the placement of LED lights. The flexible layered structure can be easily bent to form a LED substrate for shining light in more than one direction while efficiently removing heat arising from the LEDs.Type: ApplicationFiled: September 30, 2014Publication date: January 15, 2015Inventor: KURT DOUGLAS ROBERTS
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Patent number: 8860048Abstract: A flexible layered structure is disclosed having a flexible top conductive layer, a flexible bottom heat sink layer and a flexible dielectric middle layer. The combination has a longitudinal axis and a plurality of defined positions spaced along the longitudinal axis. The defined positions can be used for aligning a circuit and/or for the placement of LED lights. The flexible layered structure can be easily bent to form a LED substrate for shining light in more than one direction while efficiently removing heat arising from the LEDs.Type: GrantFiled: October 22, 2013Date of Patent: October 14, 2014Assignee: E. I. du Pont de Nemours and CompanyInventor: Kurt Douglas Roberts
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Publication number: 20140056002Abstract: A flexible layered structure is disclosed having a flexible top conductive layer, a flexible bottom heat sink layer and a flexible dielectric middle layer. The combination has a longitudinal axis and a plurality of defined positions spaced along the longitudinal axis. The defined positions can be used for aligning a circuit and/or for the placement of LED lights. The flexible layered structure can be easily bent to form a LED substrate for shining light in more than one direction while efficiently removing heat arising from the LEDs.Type: ApplicationFiled: October 22, 2013Publication date: February 27, 2014Applicant: E I DU PONT NEMOURS AND COMPANYInventor: Kurt Douglas Roberts
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Patent number: 8637880Abstract: A flexible layered structure is disclosed having a flexible top conductive layer, a flexible bottom heat sink layer and a flexible dielectric middle layer. The combination has a longitudinal axis and a plurality of defined positions spaced along the longitudinal axis. The defined positions can be used for aligning a circuit and/or for the placement of LED lights. The flexible layered structure can be easily bent to form a LED substrate for shining light in more than one direction while efficiently removing heat arising from the LEDs.Type: GrantFiled: December 15, 2011Date of Patent: January 28, 2014Assignee: E.I. du Pont de Nemours and CompanyInventor: Kurt Douglas Roberts
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Patent number: 8629464Abstract: A flexible layered structure is disclosed having a flexible top conductive layer, a flexible bottom heat sink layer and a flexible dielectric middle layer. The combination has a longitudinal axis and a plurality of defined positions spaced along the longitudinal axis. The defined positions can be used for aligning a circuit and/or for the placement of LED lights. The flexible layered structure can be easily bent to form a LED substrate for shining light in more than one direction while efficiently removing heat arising from the LEDs.Type: GrantFiled: December 15, 2011Date of Patent: January 14, 2014Assignee: E. I. du Pont de Nemours and CompanyInventor: Kurt Douglas Roberts
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Publication number: 20130194814Abstract: A bent layered structure is disclosed having a top conductive layer and a dielectric layer. The dielectric layer is a polyimide derived from at least 70 mole percent aromatic dianhydride based upon total dianhydride content of the polyimide and at least 70 mole percent aromatic diamine based upon total diamine content of the polyimide. The bent layered structure has a radius of at least 2 mm and a bend angle of at least 45 degrees at least once along a longitudinal or at least once parallel to the longitudinal axis or both and maintains a 150 to 350 V/micron breakdown voltage.Type: ApplicationFiled: January 31, 2012Publication date: August 1, 2013Applicant: E.I. DU PONT DE NEMOURS AND COMPANYInventors: Deborah R. Gravely, Michael J. Green, Kurt Douglas Roberts, Richard A. Wessel
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Publication number: 20130193452Abstract: A light emitting diode system is disclosed having a bent layered structure conformed to a least a portion of a self-supporting three dimensional heat sink and maintains a breakdown voltage from 150 to 350 V/micron. The bent layered structure has an electrical circuit, a dielectric layer and at least one LED package, LED chip on board or mixtures thereof attached to the electrical circuit. The dielectric layer is a polyimide derived from at least 70 mole percent aromatic dianhydride based upon total dianhydride content of the polyimide and at least 70 mole percent aromatic diamine based upon total diamine content of the polyimide.Type: ApplicationFiled: January 31, 2012Publication date: August 1, 2013Applicant: E.I. DU PONT DE NEMOURS AND COMPANYInventors: Deborah R. Gravely, Michael J. Green, Kurt Douglas Roberts, Richard A. Wessel
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Publication number: 20120235173Abstract: A flexible layered structure is disclosed having a flexible top conductive layer, a flexible bottom heat sink layer and a flexible dielectric middle layer. The combination has a longitudinal axis and a plurality of defined positions spaced along the longitudinal axis. The defined positions can be used for aligning a circuit and/or for the placement of LED lights. The flexible layered structure can be easily bent to form a LED substrate for shining light in more than one direction while efficiently removing heat arising from the LEDs.Type: ApplicationFiled: December 15, 2011Publication date: September 20, 2012Applicant: E. I. DU PONT DE NEMOURS AND COMPANYInventor: KURT DOUGLAS ROBERTS
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Publication number: 20120235172Abstract: A flexible layered structure is disclosed having a flexible top conductive layer, a flexible bottom heat sink layer and a flexible dielectric middle layer. The combination has a longitudinal axis and a plurality of defined positions spaced along the longitudinal axis. The defined positions can be used for aligning a circuit and/or for the placement of LED lights. The flexible layered structure can be easily bent to form a LED substrate for shining light in more than one direction while efficiently removing heat arising from the LEDs.Type: ApplicationFiled: December 15, 2011Publication date: September 20, 2012Applicant: E. I. DU PONT DE NEMOURS AND COMPANYInventor: KURT DOUGLAS ROBERTS
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Publication number: 20120238045Abstract: A flexible layered structure is disclosed having a flexible top conductive layer, a flexible bottom heat sink layer and a flexible dielectric middle layer. The combination has a longitudinal axis and a plurality of defined positions spaced along the longitudinal axis. The defined positions can be used for aligning a circuit and/or for the placement of LED lights. The flexible layered structure can be easily bent to form a LED substrate for shining light in more than one direction while efficiently removing heat arising from the LEDs.Type: ApplicationFiled: December 15, 2011Publication date: September 20, 2012Applicant: E. I. DU PONT DE NEMOURS AND COMPANYInventor: KURT DOUGLAS ROBERTS
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Publication number: 20070284731Abstract: The mounting structure of a power device is simplified so as to reduce cost while achieving improvements in heat dissipation and reliability. A power module 100 is comprised of a metal wiring board 13, a power device 11 disposed on an upper surface of the metal wiring board 13 via a solder layer 12, a metal heat dissipating plate 15 disposed on a lower surface of the metal wiring board 13, and a heat sink 19 disposed on a lower surface of the metal heat dissipating plate 15. A resin-based insulating layer 14 is disposed between any desired two of the aforementioned layers.Type: ApplicationFiled: March 15, 2007Publication date: December 13, 2007Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, E.I. DU PONT DE NEMOURS AND COMPANYInventors: Takashi Atsumi, Junzo Ukai, Kenji Eto, Kenji Nakamura, Sezto Daiza, Paul Arthur Meloni, Attignal N. Sreeram, Kurt Douglas Roberts, David Leroy Sutton
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Patent number: D685932Type: GrantFiled: January 31, 2012Date of Patent: July 9, 2013Assignee: E. I. du Pont de Nemours and CompanyInventors: Deborah R. Gravely, Kurt Douglas Roberts
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Patent number: D687980Type: GrantFiled: January 31, 2012Date of Patent: August 13, 2013Assignee: E. I. du Pont de Nemours and CompanyInventors: Deborah R. Gravely, Kurt Douglas Roberts