Patents by Inventor Kurt Karl Christenson
Kurt Karl Christenson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 8859435Abstract: A method of removing materials, and preferably photoresist, from a substrate comprises dispensing a liquid sulfuric acid composition comprising sulfuric acid and/or its desiccating species and precursors and having a water/sulfuric acid molar ratio of no greater than 5:1 onto an material coated substrate in an amount effective to substantially uniformly coat the material coated substrate. The substrate is preferably heated to a temperature of at least about 90° C., either before, during or after dispensing of the liquid sulfuric acid composition. After the substrate is at a temperature of at least about 90° C., the liquid sulfuric acid composition is exposed to water vapor in an amount effective to increase the temperature of the liquid sulfuric acid composition above the temperature of the liquid sulfuric acid composition prior to exposure to the water vapor. The substrate is then preferably rinsed to remove the material.Type: GrantFiled: December 11, 2012Date of Patent: October 14, 2014Assignee: TEL FSI, Inc.Inventors: Kurt Karl Christenson, Ronald J. Hanestad, Patricia Ann Ruether, Thomas J. Wagener
-
Patent number: 8394228Abstract: A method of removing materials, and preferably photoresist, from a substrate comprises dispensing a liquid sulfuric acid composition comprising sulfuric acid and/or its desiccating species and precursors and having a water/sulfuric acid molar ratio of no greater than 5:1 onto an material coated substrate in an amount effective to substantially uniformly coat the material coated substrate. The substrate is preferably heated to a temperature of at least about 90° C., either before, during or after dispensing of the liquid sulfuric acid composition. After the substrate is at a temperature of at least about 90° C., the liquid sulfuric acid composition is exposed to water vapor in an amount effective to increase the temperature of the liquid sulfuric acid composition above the temperature of the liquid sulfuric acid composition prior to exposure to the water vapor. The substrate is then preferably rinsed to remove the material.Type: GrantFiled: September 8, 2009Date of Patent: March 12, 2013Assignee: TEL FSI, Inc.Inventors: Kurt Karl Christenson, Ronald J. Hanestad, Patricia Ann Ruether, Thomas J. Wagener
-
Patent number: 8104425Abstract: A method for electroless plating of a substrate is provided that comprises exposing an electroless plating reagent comprising a metal to be plated and at least one reducing agent to a solid phase Activation Material to form an activated electroless plating reagent prior to application of the electroless plating reagent to the substrate. The activated electroless plating reagent is applied to a substrate in the process chamber under conditions to cause the metal of the electroless plating reagent to deposit on the substrate. Systems and modules are also described.Type: GrantFiled: November 21, 2008Date of Patent: January 31, 2012Assignee: FSI International, Inc.Inventor: Kurt Karl Christenson
-
Publication number: 20100018951Abstract: A method of removing materials, and preferably photoresist, from a substrate comprises dispensing a liquid sulfuric acid composition comprising sulfuric acid and/or its desiccating species and precursors and having a water/sulfuric acid molar ratio of no greater than 5:1 onto an material coated substrate in an amount effective to substantially uniformly coat the material coated substrate. The substrate is preferably heated to a temperature of at least about 90° C., either before, during or after dispensing of the liquid sulfuric acid composition. After the substrate is at a temperature of at least about 90° C., the liquid sulfuric acid composition is exposed to water vapor in an amount effective to increase the temperature of the liquid sulfuric acid composition above the temperature of the liquid sulfuric acid composition prior to exposure to the water vapor. The substrate is then preferably rinsed to remove the material.Type: ApplicationFiled: September 8, 2009Publication date: January 28, 2010Applicant: FSI INTERNATIONAL MATERIAL FROM SUBSTRATESInventors: Kurt Karl Christenson, Ronald J. Hanestad, Patricia Ann Ruether, Thomas J. Wagener
-
Publication number: 20090304995Abstract: An initially hydrophobic surface comprising fluoropolymer is treated to provide the surface with hydrophilic properties. A hydrophobic surface comprising fluoropolymer is physically treated to impart a rough texture thereto, thereby providing the surface with hydrophilic properties. In an alternative method, a roughened surface is treated with a sulfur-based acid, thereby providing the surface with hydrophilic properties In yet another method, a non-roughened surface fluoropolymer surface is treated with a sulfur-based acid for a time sufficient for the surface to exhibit hydrophilic properties. Products made by these processes are also described.Type: ApplicationFiled: June 4, 2009Publication date: December 10, 2009Applicant: FSI INTERNATIONAL, INC.Inventor: Kurt Karl Christenson
-
Patent number: 7592264Abstract: A method of removing materials, and preferably photoresist, from a substrate comprises dispensing a liquid sulfuric acid composition comprising sulfuric acid and/or its desiccating species and precursors and having a water/sulfuric acid molar ratio of no greater than 5:1 onto an material coated substrate in an amount effective to substantially uniformly coat the material coated substrate. The substrate is preferably heated to a temperature of at least about 90° C., either before, during or after dispensing of the liquid sulfuric acid composition. After the substrate is at a temperature of at least about 90° C., the liquid sulfuric acid composition is exposed to water vapor in an amount effective to increase the temperature of the liquid sulfuric acid composition above the temperature of the liquid sulfuric acid composition prior to exposure to the water vapor. The substrate is then preferably rinsed to remove the material.Type: GrantFiled: November 22, 2006Date of Patent: September 22, 2009Assignee: FSI International, Inc.Inventors: Kurt Karl Christenson, Ronald J. Hanestad, Patricia Ann Ruether, Thomas J. Wagener
-
Publication number: 20090078195Abstract: A method for electroless plating of a substrate is provided that comprises exposing an electroless plating reagent comprising a metal to be plated and at least one reducing agent to a solid phase Activation Material to form an activated electroless plating reagent prior to application of the electroless plating reagent to the substrate. The activated electroless plating reagent is applied to a substrate in the process chamber under conditions to cause the metal of the electroless plating reagent to deposit on the substrate. Systems and modules are also described.Type: ApplicationFiled: November 21, 2008Publication date: March 26, 2009Inventor: Kurt Karl Christenson
-
Patent number: 7476616Abstract: A method for electroless plating of a substrate is provided that comprises exposing an electroless plating reagent comprising a metal to be plated and at least one reducing agent to a solid phase Activation Material to form an activated electroless plating reagent prior to application of the electroless plating reagent to the substrate. The activated electroless plating reagent is applied to a substrate in the process chamber under conditions to cause the metal of the electroless plating reagent to deposit on the substrate. Systems and modules are also described.Type: GrantFiled: December 13, 2005Date of Patent: January 13, 2009Assignee: FSI International, Inc.Inventor: Kurt Karl Christenson
-
Patent number: 7425505Abstract: The present invention provides improvements to the use of silyating agents in semiconductor processing. More particularly, the silyating agents may be provided in combination with a substantially non-flammable ether, so that the combination is substantially non-flammable. Additionally, the silyating agent may be utilized in vapor form, or applied in conjunction with the electromagnetic radiation. Each of these embodiments can enhance the usability of the silyating agent, i.e., by rendering the silyating agent more safe, more easily utilized in a variety of processing equipment and/or by enhancing the passivation efficacy/efficiency of the silyating agent.Type: GrantFiled: July 19, 2004Date of Patent: September 16, 2008Assignee: FSI International, Inc.Inventors: Philip G. Clark, Kurt Karl Christenson, Brent D. Schwab
-
Patent number: 7156927Abstract: A method is provided for treating an object. In this method, a treating chemical is introduced to a bath under conditions effective to at least partially envelop the object to be treated in eddy currents of the bath liquid, followed by introducing non-treating liquid into the bath under conditions effective to at least partially envelop the object to be treated in eddy currents of the bath liquid. An apparatus for carrying out this method is also provided. This method is particularly beneficial for objects used in precision manufacturing by treatment with solutions, such as semiconductor wafers or similar substrates.Type: GrantFiled: April 3, 2002Date of Patent: January 2, 2007Assignee: FSI International, Inc.Inventors: Kurt Karl Christenson, Nam Pyo Lee, Gary William Michalko, Christina Ann Rathman
-
Publication number: 20030188765Abstract: A method is provided for treating an object. In this method, a treating chemical is introduced to a bath under conditions effective to at least partially envelop the object to be treated in eddy currents of the bath liquid, followed by introducing non-treating liquid into the bath under conditions effective to at least partially envelop the object to be treated in eddy currents of the bath liquid. An apparatus for carrying out this method is also provided.Type: ApplicationFiled: April 3, 2002Publication date: October 9, 2003Inventors: Kurt Karl Christenson, Nam Pyo Lee, Gary William Michalko, Christina Ann Rathman