Patents by Inventor Kurt Langen

Kurt Langen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device and process for liquid treatment of wafer-shaped articles
    Patent number: 7726323
    Abstract: A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, near the edge, in which the liquid is applied to a first surface, flows essentially radially to the outside to the peripheral-side edge of the wafer-shaped article and around this edge onto the second surface, the liquid wetting a defined section near the edge on the second surface and thereupon being removed from the wafer-shaped article.
    Type: Grant
    Filed: September 10, 2007
    Date of Patent: June 1, 2010
    Assignee: Lam Research AG
    Inventor: Kurt Langen
  • DEVICE AND PROCESS FOR LIQUID TREATMENT OF WAFER-SHAPED ARTICLES
    Publication number: 20080066865
    Abstract: A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, near the edge, in which the liquid is applied to a first surface, flows essentially radially to the outside to the peripheral-side edge of the wafer-shaped article and around this edge onto the second surface, the liquid wetting a defined section near the edge on the second surface and thereupon being removed from the wafer-shaped article.
    Type: Application
    Filed: September 10, 2007
    Publication date: March 20, 2008
    Applicant: SEZ AG
    Inventor: Kurt Langen
  • Device and process for liquid treatment of wafer-shaped articles
    Patent number: 7267129
    Abstract: A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, near the edge, in which the liquid is applied to a first surface, flows essentially radially to the outside to the peripheral-side edge of the wafer-shaped article and around this edge onto the second surface, the liquid wetting a defined section near the edge on the second surface and thereupon being removed from the wafer-shaped article.
    Type: Grant
    Filed: March 6, 2006
    Date of Patent: September 11, 2007
    Assignee: SEZ AG
    Inventor: Kurt Langen
  • Device and process for liquid treatment of wafer-shaped articles
    Publication number: 20060144429
    Abstract: A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, near the edge, in which the liquid is applied to a first surface, flows essentially radially to the outside to the peripheral-side edge of the wafer-shaped article and around this edge onto the second surface, the liquid wetting a defined section near the edge on the second surface and thereupon being removed from the wafer-shaped article.
    Type: Application
    Filed: March 6, 2006
    Publication date: July 6, 2006
    Applicant: SEZ AG
    Inventor: Kurt Langen
  • Device and process for liquid treatment of wafer-shaped articles
    Patent number: 7007702
    Abstract: A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, near the edge, in which the liquid is applied to a first surface, flows essentially radially to the outside to the peripheral-side edge of the wafer-shaped article and around this edge onto the second surface, the liquid wetting a defined section near the edge on the second surface and thereupon being removed from the wafer-shaped article.
    Type: Grant
    Filed: August 4, 2003
    Date of Patent: March 7, 2006
    Assignee: Sez AG
    Inventor: Kurt Langen
  • Device and process for liquid treatment of wafer-shaped articles
    Patent number: 6858092
    Abstract: A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, near the edge, in which the liquid is applied to a first surface, flows essentially radially to the outside to the peripheral-side edge of the wafer-shaped article and around this edge onto the second surface, the liquid wetting a defined section near the edge on the second surface and thereupon being removed from the wafer-shaped article.
    Type: Grant
    Filed: June 10, 2002
    Date of Patent: February 22, 2005
    Assignee: Sez AG
    Inventor: Kurt Langen
  • Device and process for liquid treatment of wafer-shaped articles
    Publication number: 20040020427
    Abstract: A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, near the edge, in which the liquid is applied to a first surface, flows essentially radially to the outside to the peripheral-side edge of the wafer-shaped article and around this edge onto the second surface, the liquid wetting a defined section near the edge on the second surface and thereupon being removed from the wafer-shaped article.
    Type: Application
    Filed: August 4, 2003
    Publication date: February 5, 2004
    Applicant: SEZ AG
    Inventor: Kurt Langen
  • Device and process for liquid treatment of wafer-shaped articles
    Publication number: 20020148489
    Abstract: A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, near the edge, in which the liquid is applied to a first surface, flows essentially radially to the outside to the peripheral-side edge of the wafer-shaped article and around this edge onto the second surface, the liquid wetting a defined section near the edge on the second surface and thereupon being removed from the wafer-shaped article.
    Type: Application
    Filed: June 10, 2002
    Publication date: October 17, 2002
    Applicant: SEZ SEMICONDUCTOR-EQUIPMENT ZUBEHOR FUR DIE HALBLE
    Inventor: Kurt Langen
  • Device and process for liquid treatment of wafer-shaped articles
    Patent number: 6435200
    Abstract: The invention relates to a process for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, near the edge, in which the liquid is applied to a first surface, flows essentially radially to the outside to the peripheral-side edge of the wafer-shaped article and around this edge onto the second surface, the liquid wetting a defined section near the edge on the second surface and thereupon being removed from the wafer-shaped article. Furthermore the invention relates to a device for executing this process.
    Type: Grant
    Filed: April 24, 2000
    Date of Patent: August 20, 2002
    Assignee: Sez Semiconductor-Equipment Zubehor fur die Halbleiterfertigung AG
    Inventor: Kurt Langen
  • Device for an etch treatment of a disk-like object
    Patent number: 6328846
    Abstract: The invention concerns a device for an etch treatment of a disk-like object, in particular a wafer, having a means for receiving the disk-like object without contact and at least two guiding elements disposed normally to the means and limiting the position of the disk-like object at its periphery.
    Type: Grant
    Filed: January 18, 2000
    Date of Patent: December 11, 2001
    Assignee: SEZ Semiconductor-Equipment Zubehör für die Halbleiterfertigung AG
    Inventors: Kurt Langen, Philip Engesser