Abstract: A chip inductance is composed of a wound coil core (1) that is arranged erect on a system carrier (6). Perpendicularly residing clips (7) are located on the system carrier, whereby the coil core (1) is arranged within the space formed by the clips. The terminals are thereby located essentially outside the space existing between the end face planes of the coil core (1).

Abstract: An electronic component includes a solid core part having a perpendicular prismatic spatial shape and lateral surfaces, the core part having a recess in the form of a blind hole formed therein defining a winding space, and electrical contact layers disposed on at least some of the lateral surfaces of the core part.

Abstract: A method for bonding a lacquer insulated wire to a metallic support is disclosed. The method is carried out in two steps: First, the wire is exposed to ultrasonic energy so that the lacquer is broken up and the wire is deformed in a certain area and welded to the support. Then the entire area of deformation is enclosed with a thixotropic adhesive. In preferred embodiments, the method is used for bonding the winding wire of a HF-inductor coil with contact elements shaped as wires or lugs.

Abstract: An electronic component such as a chip inductor, in particular an air core coil, RF choke and transformer is disclosed having a solid core portion (1) of the ferromagnetic or electrically nonconducting material, with a winding space to be wound in one or more courses and recessed relative to parallel end faces (2, 2) of the core portion. The end faces (2, 2) have dovetail-shaped cutouts (3, 3) located within the outside portion of these end faces for receiving tab-like electric contact elements (5, 5). These electrical contacts may be glued or wedged into these cutouts and retained therein under the action of resilient properties of the cutout elements.