Patents by Inventor Kurt W. Vetter
Kurt W. Vetter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6048098Abstract: A tamper-resistant envelope is disclosed which includes first and second panels joined to one another to define opposed side edges and a bottom edge. The envelope has an opening opposite the bottom edge for providing access thereunto. A first adhesive seal is disposed on one of the first and second panels adjacent the opening for sealingly adhering to the other of the two panels. The first adhesive seal is formed of an adhesive material having adherent properties which are resistant to release at temperatures substantially below room temperature. A second adhesive seal is disposed on one of the first and second panels for sealingly adhering to the other of the two panels. The second adhesive seal is formed of an adhesive material having adherent properties which are different from those of the adhesive material from which the first adhesive seal is formed.Type: GrantFiled: June 6, 1995Date of Patent: April 11, 2000Assignee: Uniflex, Inc.Inventor: Kurt W. Vetter
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Patent number: 5974769Abstract: A turret assembly for use in a container manufacturing apparatus which comprises a rotatable hub, at least one arm extending radially from the rotatable hub and having a medium reception portion thereon for transferring and inserting at least one medium to a location between a first and second portion of container material.Type: GrantFiled: August 1, 1997Date of Patent: November 2, 1999Assignee: Uniflex, Inc.Inventor: Kurt W. Vetter
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Patent number: 5788377Abstract: A tamper-resistant envelope is disclosed which includes first and second panels joined to one another to define opposed side edges and a bottom edge of the envelope. Each of the panels have an upper edge which together define an opening opposite the bottom edge of the envelope for providing access into the envelope. The upper edge of the second panel extends beyond the upper edge of the first panel to define a panel extension. A layer of adhesive sealant material is disposed on an interior surface of the first panel adjacent the upper edge thereof for sealingly adhering to an interior surface of the second panel. The sealant material has adherent properties which are resistant to release at temperatures substantially below room temperature. The envelope also includes an adhesive sealing strip having a lower portion mounted to an exterior surface of the first panel and an upper portion positioned to sealingly adhere to the panel extension of the second panel.Type: GrantFiled: December 26, 1996Date of Patent: August 4, 1998Assignee: Uniflex, Inc.Inventor: Kurt W. Vetter
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Patent number: 5641318Abstract: A method for forming a tamper-resistant envelope formed of a thermoplastic resin comprises two opposing panels having respective bottom and side wall edges bonded together to form a pocket therebetween. The top of the pocket is open for inserting an item into the pocket. Each panel has an edge portion adjacent the opening. A bead of pressure-sensitive adhesive is applied adjacent the edge portions, and the bead is heat-seal bonded to the thermoplastic edge portion. The edge portions can be brought together to bring the adhesive beads into contact to close the opening. By heat-seal bonding the adhesive beads to the thermoplastic edge portions, the pressure-sensitive adhesive is less susceptible to being opened by supercooling.Type: GrantFiled: April 28, 1995Date of Patent: June 24, 1997Assignee: Uniflex, Inc.Inventor: Kurt W. Vetter
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Patent number: 5584580Abstract: A tamper-resistance envelope formed of a thermoplastic resin comprises two opposing panels having respective bottom and side wall edges bonded together to form a pocket therebetween. The top of the pocket is open for inserting an item into the pocket. Each panel has an edge portion adjacent the opening. A bead of pressure-sensitive adhesive is applied along each of the edge portions, and the adhesive bead is heat-seal bonded to the thermoplastic edge portion. The edge portions are brought together to bring the adhesive beads into contact to close the opening. By heat-seal bonding the adhesive beads directly to the thermoplastic edge portions, the pressure sensitive adhesive is resistant to being open by supercooling.Type: GrantFiled: February 24, 1994Date of Patent: December 17, 1996Assignee: Uniflex, Inc.Inventor: Kurt W. Vetter
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Patent number: 5045040Abstract: A closure seal and method for envelopes having front and back panels joined along bottom and side edges and in which a release liner strip delimits overlying marginal edges along the top of the panels. The liner strip initially covers a pressure sensitive adhesive band in the top marginal edge of one of the panels and extends through the side edge junctures of the panels to enable removal of the liner strip and securement of the top margins by the pressure sensitive adhesive band. Registered lines of perforations are formed across the top portion of both panels below the bottom edge of the release liner strip to define a tear line for opening the evelope after it has been sealed in embodiments not intended for liquid contents. The lines of perforations are omitted in an liquid containing envelope embodiment wherein the adhesive band joins with fused side edges of the envelope.Type: GrantFiled: March 28, 1990Date of Patent: September 3, 1991Assignee: Uniflex, Inc.Inventor: Kurt W. Vetter
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Patent number: 4932791Abstract: A closure seal and method for envelopes having front and back panels joined along bottom and side edges and in which a release liner strip delimits overlying marginal edges along the top of the panels. The liner strip initially covers a pressure sensitive adhesive band in the top marginal edge of one of the panels and extends through the side edge junctures of the panels to enable removal of the liner strip and securement of the top margins by the pressure sensitive adhesive band. Registered lines of perforations are formed across the top portion of both panels below the bottom edge of the release liner strip to define a tear line for opening the envelope after it has been sealed in embodiments not intended for liquid contents. The lines of perforations are omitted in a liquid containing envelope embodiment wherein the adhesive band joins with fused side edges of the envelope.Type: GrantFiled: May 11, 1989Date of Patent: June 12, 1990Assignee: Uniflex, Inc.Inventor: Kurt W. Vetter