Abstract: A package that includes an acoustic device, a frame coupled to the acoustic device and a cap substrate coupled to the acoustic device through the frame. The acoustic device includes a substrate and an acoustic element coupled to the substrate. The cap substrate includes an inductor. The cap substrate is configured as a cap for the acoustic device. The package includes a cavity located between the acoustic device and the cap substrate. The frame may include a polymer frame.

Abstract: A package that includes an integrated device, a substrate coupled to the integrated device, and an encapsulation layer coupled to the substrate. The encapsulation layer encapsulates the integrated device. The substrate includes at least one dielectric layer, a plurality of interconnects located in the at least one dielectric layer, a buffer dielectric layer coupled to the at least one dielectric layer, and a buffer interconnect located at least in the buffer dielectric layer.

Abstract: A package that includes an integrated device, a substrate coupled to the integrated device, and an encapsulation layer coupled to the substrate. The encapsulation layer encapsulates the integrated device. The substrate includes at least one dielectric layer, a plurality of interconnects located in the at least one dielectric layer, a buffer dielectric layer coupled to the at least one dielectric layer, and a buffer interconnect located at least in the buffer dielectric layer.

Abstract: A green film composed of varistor material laminated on a ceramic main body, which is provided with metallizations on both sides, and is sintered to form a varistor layer. A terminating electrode pair completes the arrangement and allows the varistor layer to be operated as a varistor. The upper second electrode pair can serve directly as a terminal contact for mounting an electrical component.

Abstract: A green film composed of varistor material is laminated on a ceramic main body (GK), which is provided with metallizations (EP1, AF) on both sides, and is sintered to form a varistor layer (VS). A terminating electrode pair (EP1, EP2) completes the arrangement and allows the varistor layer to be operated as a varistor. The upper second electrode pair (EP2) can serve directly as a terminal contact for mounting an electrical component.

Abstract: An antenna arrangement has a first signal path connected to a first antenna. A second signal path is connected to a second antenna. A third signal path includes a device that measures the signal strength. Directional couplers couple the first and second signal paths to the third signal path. Filters filter out signal components that are coupled by one antenna into the other antenna.

Abstract: An antenna arrangement has a first signal path connected to a first antenna. A second signal path is connected to a second antenna. A third signal path includes a device that measures the signal strength. Directional couplers couple the first and second signal paths to the third signal path. Filters filter out signal components that are coupled by one antenna into the other antenna.

Abstract: A front-end module is for use with at least three radio frequency bands. The front-end module includes at least five signal paths, and an antenna switch to electrically connect an antenna to one of the signal paths. At least one of the signal paths includes subpaths. A frequency separating network interfaces the at least one signal path to the subpaths. The subpaths are for use in passing different radio frequency bands. The different radio frequency bands have frequency ranges that do not overlap.

Abstract: In a configuration with at least one RF component disposed in a signal path and including a ground connection to an external circuit environment, a coupling element is provided which electromagnetically couples to at least part of the ground connection and at the same time decouples a coupling current. By suitably feeding this coupling current back into the signal path of the component, the negative influence of the inductance of the ground connection on the signal path is thus compensated for.

Abstract: In a configuration with at least one RF component disposed in a signal path and including a ground connection to an external circuit environment, a coupling element is provided which electromagnetically couples to at least part of the ground connection and at the same time decouples a coupling current. By suitably feeding this coupling current back into the signal path of the component, the negative influence of the inductance of the ground connection on the signal path is thus compensated for.

Abstract: A circuit array includes an antenna input, a signal input, a signal output, and a switch unit. The switch unit connects the antenna to either the signal input or the signal output. The antenna input is connected to a first productive device. The first protective device is a band-pass filter in a T configuration.

Abstract: A front-end module is for use with at least three radio frequency bands. The front-end module includes at least five signal paths, and an antenna switch to electrically connect an antenna to one of the signal paths. At least one of the signal paths includes subpaths. A frequency separating network interfaces the at least one signal path to the subpaths. The subpaths are for use in passing different radio frequency bands. The different radio frequency bands have frequency ranges that do not overlap.

Abstract: A functional block of a front-end circuit for a communication device, which is employed for multi-band and/or multi-mode operation, is proposed. By positioning, according to this invention, a pin diode switch in one of the parallel signal paths instead of positioning it on the input side before separating the signal paths, it is possible to do without an impedance transformation network on the input side and to thus reduce the signal loss and the space requirement of the circuit. In a further configuration, the signal paths preferably associated with the adjacent frequency bands are combined on the output side, whereby the further processing of the signals corresponding to the different frequency bands takes place in one path. This for example allows a chip set designed for (n?1) frequency bands to be used in a transmission system designed for n bands. Another embodiment of this invention enables monitoring of the received signal of a system even during operation of the other mode in a multi-mode system.

Abstract: The invention relates to a circuit comprising an antenna input (1), a signal input (2) and a signal output (3), and a switching unit (4), wherein the antenna input (1) is connected to a first protection device (6) against electrostatic discharges, said first protection device (6) being a band-pass filter in a ?-configuration. The advantage of the first protection device (6) is that it eliminates the need for a band-pass filter in the front end module, when used in a mobile telephone. Furthermore, the band-pass filter has a very good filtering characteristic, enabling ESD-related disturbances to be effectively suppressed. The invention also relates to a switching module and to the use of the same.

Abstract: A functional block of a front-end circuit for a communication device, which is employed for multi-band and/or multi-mode operation, is proposed. By positioning, according to this invention, a pin diode switch in one of the parallel signal paths instead of positioning it on the input side before separating the signal paths, it is possible to do without an impedance transformation network on the input side and to thus reduce the signal loss and the space requirement of the circuit. In a further configuration, the signal paths preferably associated with the adjacent frequency bands are combined on the output side, whereby the further processing of the signals corresponding to the different frequency bands takes place in one path. This for example allows a chip set designed for (n?1) frequency bands to be used in a transmission system designed for n bands. Another embodiment of this invention enables monitoring of the received signal of a system even during operation of the other mode in a multi-mode system.

Abstract: The invention relates to a circuit array with an antenna input (1), a signal input (2) and a signal output (3), a switch unit (4), in which the antenna input (1) is connected to a first protective device (6) against electrostatic discharges, wherein the first5 protective device (6) is a band-pass filter in a ? configuration. An advantage of the first protective device (6) is that when it is used in a mobile telephone, a band-pass filter in the front-end module can be omitted. In addition, the band-pass filter has very favorable filtering characteristics, so that ESD-related interference can be effectively suppressed. The invention also relates to a circuit module and the use of the circuit module.

Abstract: The invention relates to a circuit array with an antenna input (1), a signal input (2) and a signal output (3), a switch unit (4), in which the antenna input (1) is connected to a first protective device (6) against electrostatic discharges, wherein the first protective device (6) has an antenna input (111) and a switch output (112), which are connected to one another by a line (113), and in which a voltage-limiting element (114) is connected to a ground (8) in parallel to the line (113). The advantage of the circuit array of the invention is that the protective device (6) has a low insertion loss. The invention also relates to a circuit module as well as the use of the circuit module as a front-end module.

Abstract: Circuit array, circuit module with the circuit array, and use of the circuit module The invention relates to a circuit array with an antenna input (1), a signal input (2) and a signal output (3), a switch unit (4), in which the antenna input (1) is connected to a first protective device (6) against electrostatic discharges, wherein the first protective device (6) is a band-pass filter in a T configuration. An advantage of the first protective device (6) is that when it is used in a mobile telephone, a band-pass filter in the front-end module can be omitted. In addition, the band-pass filter has very favorable filtering characteristics, so that ESD-related interference can be effectively suppressed. The invention also relates to a circuit module and use of the circuit module.

Abstract: The invention relates to a circuit array with an antenna input (1), a signal input (2) and a signal output (3), and having a switch unit (4) which has a control line (5), with which the optional connecting of the antenna input (1) to the signal input (2) or the signal output (3) can be controlled, in which the antenna input (1) is connected to a first protective device (6) against electrostatic discharges and the control line (5) to a second protective device (7) against electrostatic discharges. As a result of the protective device in the control line, the ESD safety of the circuit array can be improved. The invention also relates to a circuit module and its use as a front-end module in a mobile telephone.