Patents by Inventor Kwan Suk RYU

Kwan Suk RYU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermoplastic resin composition having high rigidity and low coefficient of linear thermal expansion and molded article comprising same
    Patent number: 11820884
    Abstract: The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a first polypropylene resin having crystallinity of 50% to 80%, a second polypropylene resin having a coefficient of linear thermal expansion of 70 ?m/m·° C. to 90 ?m/m·° C., an elastomer, and an inorganic filler.
    Type: Grant
    Filed: July 6, 2022
    Date of Patent: November 21, 2023
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, DAE HA CO., LTD.
    Inventors: Jin Young Yoon, Hee Joon Lee, Dong Eun Cha, Sun Jun Kwon, Chun Ho Park, Seung Ryong Jeong, Kwan Suk Ryu, Tae Kyung Lee
  • THERMOPLASTIC RESIN COMPOSITION HAVING HIGH RIGIDITY AND LOW COEFFICIENT OF LINEAR THERMAL EXPANSION AND MOLDED ARTICLE COMPRISING SAME
    Publication number: 20230016858
    Abstract: The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a first polypropylene resin having crystallinity of 50% to 80%, a second polypropylene resin having a coefficient of linear thermal expansion of 70 ?m/m° C. to 90 ?m/m° C., an elastomer, and an inorganic filler.
    Type: Application
    Filed: July 6, 2022
    Publication date: January 19, 2023
    Inventors: Jin Young Yoon, Hee Joon Lee, Dong Eun Cha, Sun Jun Kwon, Chun Ho Park, Seung Ryong Jeong, Kwan Suk Ryu, Tae Kyung Lee
  • Polypropylene resin composition and molded product thereof
    Patent number: 10533086
    Abstract: A polypropylene resin composition includes: a base resin; a thermoplastic elastomer; and an inorganic filler; a major-axis diameter/minor-axis diameter, which is an aspect ratio of the inorganic filler, is 2 to 8. A molded product includes an injection molding of the polypropylene resin composition. The polypropylene resin composition may simultaneously impart excellent rigidity, impact resistance, and excellent dimensional stability even when applied to a molded product having a small thickness, while maintaining a low specific gravity.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: January 14, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation, LG Hauseys, Ltd., DAE HA Co., Ltd.
    Inventors: Hyun Gyung Kim, Hee Joon Lee, Ju-Hyun Ji, Chun Ho Park, Ki Hyun Sung, Kwan Suk Ryu
  • POLYPROPYLENE RESIN COMPOSITION AND MOLDED PRODUCT THEREOF
    Publication number: 20180258270
    Abstract: A polypropylene resin composition includes: a base resin; a thermoplastic elastomer; and an inorganic filler; a major-axis diameter/minor-axis diameter, which is an aspect ratio of the inorganic filler, is 2 to 8. A molded product includes an injection molding of the polypropylene resin composition; The polypropylene resin composition may simultaneously impart excellent rigidity, impact resistance, and excellent dimensional stability even when applied to a molded product having a small thickness, while maintaining a low specific gravity.
    Type: Application
    Filed: December 14, 2017
    Publication date: September 13, 2018
    Inventors: Hyun Gyung KIM, Hee Joon LEE, Ju-Hyun JI, Chun Ho PARK, Ki Hyun SUNG, Kwan Suk RYU