Patents by Inventor Kwang-Baek Yoon

Kwang-Baek Yoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing method of double sided printed circuit board
    Patent number: 10080299
    Abstract: Provided is a manufacturing method of a double-sided printed circuit board. In the method, a first conductive circuit pattern configuring a circuit is formed on an upper side of an insulation layer, and a second conductive circuit pattern configuring a circuit is formed on a lower side of the insulation layer. A through hole vertically passing through the insulation layer is formed, and a conductive material is formed on an inner circumferential surface of the through hole such that the first circuit pattern and the second circuit pattern are electrically connected by the through hole.
    Type: Grant
    Filed: January 4, 2013
    Date of Patent: September 18, 2018
    Assignee: INKTEC CO., LTD.
    Inventors: Kwang-Choon Chung, Young-Koo Han, Myung-Bong Yoo, Kwang-Baek Yoon, Bong-Ki Jung
  • Method for manufacturing a double-sided printed circuit board
    Patent number: 9313900
    Abstract: Disclosed is a method for manufacturing a double-sided printed circuit board (PCB) having a circuit pattern by printing a conductive paste. According to the method of the present invention, a circuit pattern that is precise and highly conductive can be formed, and a reduction in raw materials and the simplification of processes are made possible. Also, due to the printing of the conductive paste, short-circuit can be prevented even when a conductive layer is bent or exposed to heat or physical impact.
    Type: Grant
    Filed: April 2, 2010
    Date of Patent: April 12, 2016
    Assignees: Inktec Co., Ltd., Haeun Chemtec Co., Ltd.
    Inventors: Kwang Choon Chung, Young-Koo Han, Myung-Bong Yoo, Nam-Boo Cho, Young-Ho Han, Kyong-Min Lee, Kwang-Baek Yoon, Hee-Yong Ahn, Su-Han Kim
  • METHOD FOR MANUFACTURING TWO-SIDED PRINTED CIRCUIT BOARD
    Publication number: 20150000125
    Abstract: Provided is a manufacturing method of a double-sided printed circuit board. In the method, a first conductive circuit pattern configuring a circuit is formed on an upper side of an insulation layer, and a second conductive circuit pattern configuring a circuit is formed on a lower side of the insulation layer. A through hole vertically passing through the insulation layer is formed, and a conductive material is formed on an inner circumferential surface of the through hole such that the first circuit pattern and the second circuit pattern are electrically connected by the through hole.
    Type: Application
    Filed: January 4, 2013
    Publication date: January 1, 2015
    Inventors: Kwang-Choon Chung, Young-Koo Han, Myung-Bong Yoo, Kwang-Baek Yoon, Bong-Ki Jung
  • Method for Manufacturing a Double-Sided Printed Circuit Board
    Publication number: 20130056250
    Abstract: Disclosed is a method for manufacturing a double-sided printed circuit board (PCB) having a circuit pattern by printing a conductive paste. According to the method of the present invention, a circuit pattern that is precise and highly conductive can be formed, and a reduction in raw materials and the simplification of processes are made possible. Also, due to the printing of the conductive paste, short-circuit can be prevented even when a conductive layer is bent or exposed to heat or physical impact.
    Type: Application
    Filed: April 2, 2010
    Publication date: March 7, 2013
    Applicants: HAEUN CHEMTEC CO., LTD., INKTEC CO., LTD.
    Inventors: Kwang Choon Chung, Young-Koo Han, Myung-Bong Yoo, Nam-Boo Cho, Young-Ho Han, Kyong-Min Lee, Kwang-Baek Yoon, Hee-Yong Ahn, Su-Han Kim