Abstract: A camera module includes a lens module; a first frame accommodating the lens module; a second frame accommodating the first frame; a third frame accommodating the second frame; and a housing accommodating the third frame. The lens module and the first frame are configured to rotate with respect to the second frame around an optical axis. The lens module, the first frame and the second frame are configured to rotate with respect to the third frame around a first axis that is perpendicular to the optical axis. The lens module, the first frame, the second frame, and the third frame are configured to rotate with respect to the housing around a second axis that is perpendicular to both the optical axis and the first axis.

Abstract: A camera module includes a lens module; a first frame accommodating the lens module; a second frame accommodating the first frame; a third frame accommodating the second frame; and a housing accommodating the third frame. The lens module and the first frame are configured to rotate with respect to the second frame around an optical axis. The lens module, the first frame and the second frame are configured to rotate with respect to the third frame around a first axis that is perpendicular to the optical axis. The lens module, the first frame, the second frame, and the third frame are configured to rotate with respect to the housing around a second axis that is perpendicular to both the optical axis and the first axis.

Abstract: There is provided a semiconductor package including: a substrate having at least one element mounted thereon; a prepreg layer stacked on the substrate to cover the at least one element; a metal shielding layer stacked on the prepreg layer to electrically shield the at least one element; and a via electrode penetrating through the metal shielding layer and the prepreg layer and electrically connected to a ground electrode formed on the substrate.

Abstract: There is provided a multi-layered ceramic capacitor including: a laminated body having a plurality of dielectric layers laminated therein and including first and second surfaces opposed to each other; a first internal electrode formed between the plurality of dielectric layers, exposed to the first surface, and including a plurality of first sub-electrodes; a second internal electrode exposed to the second surface and including a plurality of second sub-electrodes alternately disposed with the first sub-electrodes; a third internal electrode having at least one dielectric layer disposed between the first and second internal electrodes and the third internal electrode, exposed to the second surface, and including a plurality of third sub-electrodes disposed to be opposed to the first sub-electrodes; and a fourth internal electrode exposed to the first surface and including a plurality of fourth sub-electrodes opposed to the second sub-electrodes and alternately disposed with the third sub-electrodes.