Patents by Inventor Kwang H. Chu

Kwang H. Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cable closure injection sealed with organo borane amine complex
    Patent number: 6284976
    Abstract: A cable splice closure includes a closure body having mating surfaces sealed together. An end seal in the closure has an opening for receiving a cable. The end seal is sealed to the closure body by an adhesive bond. An adhesive injection port in the end seal. The port is provided to communicate an adhesive injected into the end seal to bond surfaces of the end seal and the cable to be received, into a sealed unit. The adhesive is a low surface energy adhesive based on acrylic monomers with organoborane are complexes.
    Type: Grant
    Filed: May 11, 2000
    Date of Patent: September 4, 2001
    Assignee: 3M Innovative Properties Company
    Inventors: Jacqueline J. Pulido, Kenneth D. Rebers, Thomas S. Croft, Alan J. Oshinski, Kwang H. Chu, Daniel G. Lee, Russell P. Smith
  • Cable closure injection sealed with organoborane amine complex
    Patent number: 6064006
    Abstract: An end seal for a cable splice closure includes a core portion having a slot for receiving a cable. A tail portion, extending from the core portion, is of sufficient length and flexibility to be extended over the slot. An adhesive injection port is provided in the core portion to communicate an adhesive injected into the injection port to the slot to bond into a sealed unit the surfaces of the end seal and the cable to be received. The adhesive is a low surface energy adhesive based on acrylic monomers with organoborane amine complexes.
    Type: Grant
    Filed: March 12, 1999
    Date of Patent: May 16, 2000
    Assignee: 3M Innovative Properties Company
    Inventors: Jacqueline J. Pulido, Kenneth D. Rebers, Thomas S. Croft, Alan J. Oshinski, Kwang H. Chu, Daniel G. Lee, Russell P. Smith
  • Susceptor composite material patterned in neat polymer
    Patent number: 6048599
    Abstract: A composite material for electromagnetic fusion bonding materials together includes interconnected first and second portions forming a patterned array. The first portions include layer absorptive magnetic particles in a polymer matrix. The second portions include a polymer positioned to separate each first portion from each other first portion.
    Type: Grant
    Filed: January 17, 1997
    Date of Patent: April 11, 2000
    Assignee: 3M Innovative Properties Company
    Inventors: Kwang H. Chu, Armond D. Cosman, Richard L. Miklos
  • Cable closure injection sealed with low surface energy adhesive
    Patent number: 5912433
    Abstract: A cable splice closure includes a closure body having mating surfaces sealed together. An end seal in the closure has an opening for receiving a cable. The end seal is sealed to the closure body by an adhesive bond. An adhesive injection port is provided in the end seal to communicate an adhesive injected into the end seal and to bond into a sealed unit the surf aces of the end seal and the cable to be received. The adhesive is a low surface energy adhesive based on acrylic monomers with organoborane amine complexes.
    Type: Grant
    Filed: January 17, 1997
    Date of Patent: June 15, 1999
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Jacqueline J. Pulido, Kenneth D. Rebers, Thomas S. Croft, Alan J. Oshinski, Kwang H. Chu, Daniel G. Lee, Russell P. Smith