Abstract: An air conditioning device for a vehicle includes: a housing having an inside divided into an inflow space, a heat exchange space, and an outflow space, which are straightly arranged, and having a plurality of discharge ports, which communicates with an interior, at the inflow space; a blowing unit disposed at the inflow space of the housing and configured to blow air; a heat exchange unit disposed at the heat exchange space of the housing and configured to adjust a temperature of conditioned air by exchanging heat with air; and an opening-closing door disposed at the outflow space of the housing and configured to open and close the plurality of discharge ports such that conditioned air at an adjusted temperature selectively flows to the plurality of discharge ports. The air conditioning device adjusts the temperature of conditioned air for respective modes and reduces a flow resistance of air.

Abstract: A method of predicting membrane fouling in a reverse osmosis process includes collecting information relative to the reverse osmosis process being performed over a predetermined period of time, the collected information including a process factor and a water quality factor, the process factor including a produced water flow rate; calculating a salt removal rate and a pressure drop based on the collected information; normalizing the produced water flow rate, the salt removal rate, and the pressure drop; generating a prediction equation using normalized values of the produced water flow rate, the salt removal rate, and the pressure drop values; and predicting membrane fouling through the generated prediction equation to determine a chemical cleaning time. Process and water quality factors are normalized to temperature and/or flow rate, and the prediction equation uses the normalized factors. Both short-term and long-term predictions are made for chemical cleaning time and membrane module replacement time.

Abstract: A method of predicting membrane fouling in a reverse osmosis process includes collecting information relative to the reverse osmosis process being performed over a predetermined period of time, the collected information including a process factor and a water quality factor, the process factor including a produced water flow rate; calculating a salt removal rate and a pressure drop based on the collected information; normalizing the produced water flow rate, the salt removal rate, and the pressure drop; generating a prediction equation using normalized values of the produced water flow rate, the salt removal rate, and the pressure drop values; and predicting membrane fouling through the generated prediction equation to determine a chemical cleaning time. Process and water quality factors are normalized to temperature and/or flow rate, and the prediction equation uses the normalized factors. Both short-term and long-term predictions are made for chemical cleaning time and membrane module replacement time.

Abstract: The present invention relates to a method and system for recovering carbonate from steel slag, in which it is possible to extract carbonate from steel slag and reuse the extracted carbonate, and to recycle steel slag and make use of CO2 gas without emission to the atmosphere. Since unreacted metal ions and an acidic solvent are reused in the method and system, it is possible to increase carbonate extraction efficiency and reduce an amount of waste.

Abstract: The present invention relates to a method and system for recovering carbonate from steel slag, in which it is possible to extract carbonate from steel slag and reuse the extracted carbonate, and to recycle steel slag and make use of CO2 gas without emission to the atmosphere. Since unreacted metal ions and an acidic solvent are reused in the method and system, it is possible to increase carbonate extraction efficiency and reduce an amount of waste.

Abstract: A loading/unloading method of a semiconductor manufacturing apparatus for randomly designating a slot of a wafer in loading/unloading the wafer is provided. The method of loading and unloading a wafer through a random designation of wafer slot instead of sequential designation in a semiconductor manufacturing apparatus includes pre-setting a wafer slot selection mode; loading wafers into a piece of process equipment in the pre-set slot selection sequence when the wafer slot selection mode is set as a random mode; performing a process on the wafers; and unloading the wafers having been processed in a pre-set slot selection sequence, thereby preventing defects in the wafer.

Abstract: A wafer transfer method of semiconductor fabricating equipment is capable of successively arranging a plurality of wafers in a designated order (e.g., an ascending order, a descending order, an odd/even number order or an individual selection order). The wafer transfer method uses a first cassette containing the wafers, and a second cassette for receiving the wafers. A wafer transfer robot having a wafer transfer arm moves the wafers from the first cassette to the second cassette, after the wafer serial numbers have been read and sent to a computer. The computer uses a selected wafer arrangement order to decide where within the second cassette each wafer from the first cassette should be placed and then controls the wafer transfer robot to place each wafer into the desired location. With the wafers arranged in the selected order, it is not necessary to test each wafer after each fabricating process.

Abstract: A wafer transfer system of semiconductor fabricating equipment is capable of successively arranging a plurality of wafers in a designated order (e.g., an ascending order, a descending order, an odd/even number order or an individual selection order). The wafer transfer system includes a first cassette containing the wafers, and a second cassette for receiving the wafers. A wafer transfer robot having a wafer transfer arm moves the wafers from the first cassette to the second cassette, after the wafer serial numbers have been read and sent to a computer. The computer uses a selected wafer arrangement order to decide where within the second cassette each wafer from the first cassette should be placed and then controls the wafer transfer robot to place each wafer into the desired location. With the wafers arranged in the selected order, it is not necessary to test each wafer after each fabricating process.