Abstract: A bump may be formed by forming a diffusion barrier layer pattern over a substrate having a conductive pad; forming a seed layer over the substrate having the diffusion barrier layer pattern and the conductive pad; forming a conductive bump over the seed layer; and patterning the seed layer using the conductive bump as an etching mask.

Abstract: An array inkjet printhead includes a substrate including an ink chamber to store ink to be ejected, a heater to apply heat to the ink, a TFT (thin film transistor) to control a voltage supplied to the heater, and a manifold to supply ink to the ink chamber, the ink chamber, the heater, and the TFT being formed in a top surface of the substrate, a nozzle plate formed on the substrate and including a plurality of nozzles through which the ink is ejected when the heater applies heat to the ink, and a driving unit to drive the TFT to make the heater generate the heat to eject the ink.

Abstract: A photoresist stripping composition and a method of fabricating a semiconductor device using the photoresist stripping composition are provided. The photoresist stripping composition is made of a mixed solution of acetone and isopropyl alcohol. A preferred volume ratio of acetone to isopropyl alcohol is in a range of about 50:50 to about 95:5.

Abstract: An image device includes a substrate in which a light receiving element is formed, an interlayer dielectric structure which is formed on the substrate and has a cavity over the light receiving element, a transparent dielectric layer which fills the cavity and has a lens-shaped portion protruding beyond an upper portion of the interlayer dielectric structure, and a color filter which is formed on the transparent dielectric layer.