Patents by Inventor Kwang-Ru Wang
Kwang-Ru Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6864554Abstract: An optoelectronic device is disclosed. The optoelectronic device comprises a transparent conductive substrate, an optoelectronic element, and a base. The transparent conductive substrate comprises a transparent plate, a transparent electrode film formed on the transparent plate, and an insulating part formed on the transparent plate. The insulating part divides the transparent electrode film into a first transparent electrode film and a second transparent electrode film that non-conduct each other. The optoelectronic element comprising a positive electrode and a negative electrode is disposed on the transparent conductive substrate and electrically connected to the first transparent electrode film and the second transparent electrode film individually. The base is formed with an opening that has a reflective surface on the bottom of the opening, and the optoelectronic element is held in the opening in a manner of suspending from or connecting with the bottom of the opening.Type: GrantFiled: January 6, 2003Date of Patent: March 8, 2005Assignee: Highlink Technology CorporationInventors: Ming-Der Lin, Kwang-Ru Wang
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Patent number: 6856087Abstract: A full-color display device is disclosed. The present invention comprises a plurality of pixel units each comprising a base, a plurality of transparent conductive substrates, a plurality of light emitting elements, and a plurality of electrode parts. The base has at least three openings formed thereon, the bottom of each opening is a reflective surface, and each of the transparent conductive substrates individually covers each opening. Each of the light emitting elements is individually disposed on one side of each transparent conductive substrate and held in each opening. Each of the electrode parts is formed on the base and electrically connected to the electrodes of the light emitting elements and the transparent conductive substrates.Type: GrantFiled: January 6, 2003Date of Patent: February 15, 2005Assignee: Highlink Technology CorporationInventors: Ming-Der Lin, Kwang-Ru Wang, Shih-Cheng Huang, Ming-Fa Yeh, Yi-Tai Chung
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Patent number: 6812503Abstract: The present invention discloses a light-emitting device with improved reliability so as to achieve a prolonged lifetime, better stability and excellent illumination quality. The light-emitting device comprises a substrate; a light-emitting component, having a p-n junction, mounted on a top surface of the substrate so as to be connected to corresponding metal pads through at least one conducting wire; and a cap, formed of a transparent material to have an inward concave, wherein the light-emitting component is disposed in the inward concave such that there is a gap between the light-emitting component and the cap.Type: GrantFiled: November 27, 2002Date of Patent: November 2, 2004Assignee: Highlink Technology CorporationInventors: Ming-Der Lin, Kwang-Ru Wang
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Patent number: 6809341Abstract: A light-emitting diode with enhanced brightness and a method for fabricating the diode is provided. The light-emitting diode includes an epitaxial LED structure having at least one lighting-emitting active layer with a plurality of windows formed in a highly doped layer. At least one conductive contact is formed on the bottom surface of the highly doped layer. A transparent material layer is formed in the windows. An adhesion layer is formed between the transparent material layer and a permanent substrate. A bottom electrode is formed on the bottom surface of the permanent substrate and an opposed electrode is formed on the top surface of the epitaxial LED structure.Type: GrantFiled: March 11, 2003Date of Patent: October 26, 2004Assignee: Opto Tech UniversityInventors: Jung-Kuei Hsu, Hsueh-Chih Yu, Hung-Yuan Lu, Chui-Chuan Chang, Kwang-Ru Wang, Chang-Da Tsai, San Bao Lin, Yung-Chiang Hwang, Ming-Der Lin
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Publication number: 20040178415Abstract: The present invention discloses a light-emitting diode with enhanced brightness and a method for fabricating the same. The light-emitting diode comprises: an epitaxial LED structure having at least one lighting-emitting active layer with a plurality of spacers inside the lighting-emitting active layer; at least one conductive contact, formed on the bottom surface where no spacer is formed inside the lighting-emitting active layer; a transparent material layer formed in the spacers; an adhesion layer formed between the transparent material layer and a permanent substrate; a bottom electrode formed on the bottom surface of the permanent substrate; and an opposed electrode formed on the top surface of the epitaxial LED structure.Type: ApplicationFiled: March 11, 2003Publication date: September 16, 2004Inventors: Jung-Kuei Hsu, Hsueh-Chih Yu, Hung-Yuan Lu, Yen-Hu Chu, Chui-Chuan Chang, Kwang-Ru Wang, Chang-Da Tsai, San Bao Lin, Yung-Chiang Hwang, Ming-Der Lin
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Patent number: 6791151Abstract: A base of an optoelectronic device is disclosed. The present invention comprises an opening and a reflective surface. The base of the optoelectronic device incorporates with a transparent conductive substrate and an optoelectronic element to construct the optoelectronic device, wherein the optoelectronic element is disposed on the transparent conductive substrate, and the opening is used to hold the optoelectronic element. Moreover, the transparent conductive substrate is placed on the top of the opening, and the reflective surface is located at the bottom in the opening.Type: GrantFiled: January 6, 2003Date of Patent: September 14, 2004Assignee: Highlink Technology CorporationInventors: Ming-Der Lin, Kwang-Ru Wang
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Patent number: 6737679Abstract: An optoelectronic unit and a transparent conductive substrate of the same are disclosed. The transparent conductive substrate comprises a transparent plate, a transparent electrode film, an insulation part, and a bounding pad, wherein the transparent electrode film and the insulation part are formed on the transparent plate, the insulation part divides the transparent electrode film into a first transparent electrode film area and a second transparent electrode film area that non-conduct each other, and the bounding pad is formed on the second transparent electrode film area. The optoelectronic unit comprises the aforementioned transparent conductive substrate, an optoelectronic element, and a conductive wire, wherein one electrode of the optoelectronic element is electrically connected to the aforementioned first transparent electrode film area, and the other electrode of the optoelectronic element is electrically connected to the aforementioned bounding pad by the conductive wire.Type: GrantFiled: January 6, 2003Date of Patent: May 18, 2004Assignee: Highlink Technology CorporationInventors: Ming-Der Lin, Kwang-Ru Wang
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Publication number: 20040070333Abstract: A full-color display device is disclosed. The present invention comprises a plurality of pixel units each comprising a base, a plurality of transparent conductive substrates, a plurality of light emitting elements, and a plurality of electrode parts. The base has at least three openings formed thereon, the bottom of each opening is a reflective surface, and each of the transparent conductive substrates individually covers each opening. Each of the light emitting elements is individually disposed on one side of each transparent conductive substrate and held in each opening. Each of the electrode parts is formed on the base and electrically connected to the electrodes of the light emitting elements and the transparent conductive substrates.Type: ApplicationFiled: January 6, 2003Publication date: April 15, 2004Applicant: HIGHLINK TECHNOLOGY CORPORATIONInventors: Ming-Der Lin, Kwang-Ru Wang, Shih-Cheng Huang, Ming-Fa Yeh, Yi-Tai Chung
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Publication number: 20040070014Abstract: A base of an optoelectronic device is disclosed. The present invention comprises an opening and a reflective surface. The base of the optoelectronic device incorporates with a transparent conductive substrate and an optoelectronic element to construct the optoelectronic device, wherein the optoelectronic element is disposed on the transparent conductive substrate, and the opening is used to hold the optoelectronic element. Moreover, the transparent conductive substrate is placed on the top of the opening, and the reflective surface is located at the bottom in the opening.Type: ApplicationFiled: January 6, 2003Publication date: April 15, 2004Applicant: HIGHLINK TECHNOLOGY CORPORATIONInventors: Ming-Der Lin, Kwang-Ru Wang
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Publication number: 20040069992Abstract: An optoelectronic unit and a transparent conductive substrate of the same are disclosed. The transparent conductive substrate comprises a transparent plate, a transparent electrode film, an insulation part, and a bounding pad, wherein the transparent electrode film and the insulation part are formed on the transparent plate, the insulation part divides the transparent electrode film into a first transparent electrode film area and a second transparent electrode film area that non-conduct each other, and the bounding pad is formed on the second transparent electrode film area. The optoelectronic unit comprises the aforementioned transparent conductive substrate, an optoelectronic element, and a conductive wire, wherein one electrode of the optoelectronic element is electrically connected to the aforementioned first transparent electrode film area, and the other electrode of the optoelectronic element is electrically connected to the aforementioned bounding pad by the conductive wire.Type: ApplicationFiled: January 6, 2003Publication date: April 15, 2004Applicant: HIGHLINK TECHNOLOGY CORPORATIONInventors: Ming-Der Lin, Kwang-Ru Wang
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Publication number: 20040069999Abstract: An optoelectronic device is disclosed. The optoelectronic device comprises a transparent conductive substrate, an optoelectronic element, and a base. The transparent conductive substrate comprises a transparent plate, a transparent electrode film formed on the transparent plate, and an insulating part formed on the transparent plate. The insulating part divides the transparent electrode film into a first transparent electrode film and a second transparent electrode film that non-conduct each other. The optoelectronic element comprising a positive electrode and a negative electrode is disposed on the transparent conductive substrate and electrically connected to the first transparent electrode film and the second transparent electrode film individually. The base is formed with an opening that has a reflective surface on the bottom of the opening, and the optoelectronic element is held in the opening in a manner of suspending from or connecting with the bottom of the opening.Type: ApplicationFiled: January 6, 2003Publication date: April 15, 2004Applicant: HIGHLINK TECHNOLOGY CORPORATIONInventors: Ming-Der Lin, Kwang-Ru Wang
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Patent number: 6717711Abstract: A forming method and a structure of a high efficiency electro-optics device are disclosed. In the present invention, the cell-fixing surface between the die carrier and the electro-optics cell is decreased to increase the light emitting and absorbing regions of the electro-optics device. Thus, the operating efficiency and the sensitivity of the electro-optics device is increased substantially. Especially, the present invention has the advantage of fully showing the efficacy of device using the transparent substrate. Furthermore, when the electro-optics cell is fixing on the cell-fixing surface by utilizing the eutectic or metal-melting bonding method, a result of self-alignment can be achieved. Thus, the accuracy of the packaging device is increased substantially, thereby reducing the loss caused by the failure of poor cell-fixing while in mass production and meanwhile increasing the accuracy of fixing cell. Therefore, the present technology is quite suitable for use in the packaging of high precision.Type: GrantFiled: February 11, 2002Date of Patent: April 6, 2004Assignee: Opto Tech CorporationInventors: Ming-Der Lin, Kwang-Ru Wang, Chang-Da Tsai, Jung-Kuei Hsu
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Patent number: 6716654Abstract: The present invention discloses a light-emitting diode with enhanced brightness and a method for fabricating the same. The light-emitting diode comprises: an epitaxial LED structure having at least one lighting-emitting active layer with a plurality of spacers inside the lighting-emitting active layer; at least one conductive contact, formed on the bottom surface where no spacer is formed inside the lighting-emitting active layer; a transparent material layer formed in the spacers; an adhesion layer formed between the transparent material layer and a permanent substrate; a bottom electrode formed on the bottom surface of the permanent substrate; and an opposed electrode formed on the top surface of the epitaxial LED structure.Type: GrantFiled: March 12, 2002Date of Patent: April 6, 2004Assignee: Opto Tech CorporationInventors: Jung-Kuei Hsu, Hsueh-Chih Yu, Chia-Liang Hsu, Hung-Yuan Lu, Yen-Hu Chu, Chui-Chuan Chang, Kwang-Ru Wang, Chang-Da Tsai, San Bao Lin, Yung-Chiang Hwang, Ming-Der Lin
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Patent number: 6686218Abstract: A method for packaging an electro-optics device is disclosed. A transparent material is added between the die carrier and the electro-optics device, so that the light emitted from the backside of the electro-optics device can be extracted. Furthermore, a light reflective layer is formed on the die carrier, and a pattern of the light reflective layer is designed to prevent the light from being reflected to the active layer, the reflecting decreasing light-emitting efficiency again.Type: GrantFiled: January 15, 2003Date of Patent: February 3, 2004Assignee: Opto Tech CorporationInventors: Ming-Der Lin, Chang-Da Tsai, Kwang-Ru Wang, Ching-Liang Kao, Wen-Liang Tseng, Chia-Chen Chang
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Publication number: 20030173602Abstract: The present invention discloses a light-emitting diode with enhanced brightness and a method for fabricating the same. The light-emitting diode comprises: an epitaxial LED structure having at least one lighting-emitting active layer with a plurality of spacers inside the lighting-emitting active layer; at least one conductive contact, formed on the bottom surface where no spacer is formed inside the lighting-emitting active layer; a transparent material layer formed in the spacers; an adhesion layer formed between the transparent material layer and a permanent substrate; a bottom electrode formed on the bottom surface of the permanent substrate; and an opposed electrode formed on the top surface of the epitaxial LED structure.Type: ApplicationFiled: March 12, 2002Publication date: September 18, 2003Inventors: Jung-Kuei Hsu, Hsueh-Chih Yu, Chia-Liang Hsu, Hung-Yuan Lu, Yen-Hu Chu, Chui-Chuan Chang, Kwang-Ru Wang, Chang-Da Tsai, San Bao Lin, Yung-Chiang Hwang, Ming-Der Lin
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Patent number: 6614058Abstract: A light emitting semiconductor device with a surface-mounted and flip-chip package structure is disclosed. The light emitting semiconductor device includes an insulating substrate and an LED. The LED includes a substrate, a first-type semiconductor layer, a first electrode formed on part of the first-type semiconductor layer surface, a second-type semiconductor layer formed on the first-type semiconductor layer surface but not covering the first electrode, and a second electrode formed on the second-type semiconductor layer. Two electrode layers are formed on the two sides of the insulating substrate and extend upwardly and downwardly to the upper and lower surface of the insulating substrate. The device is characterized in that the LED is mounted on the insulating substrate by a flip chip method and the insulating substrate is formed with two electrode layers at both side walls to surface-mounted with the LED.Type: GrantFiled: July 9, 2002Date of Patent: September 2, 2003Assignee: Highlink Technology CorporationInventors: Ming-der Lin, Kwang-ru Wang
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Patent number: 6603151Abstract: A method and a structure for packaging an electro-optics device are disclosed. A transparent material is added between the die carrier and the electro-optics device, so that the light emitted from the backside of the electro-optics device can be extracted. Furthermore, a light reflective layer is formed on the die carrier, and a pattern of the light reflective layer is designed to prevent the light from being reflected to the active layer, the reflecting decreasing light-emitting efficiency again.Type: GrantFiled: March 1, 2002Date of Patent: August 5, 2003Assignee: Opto Tech CorporationInventors: Ming-Der Lin, Chang-Da Tsai, Kwang-Ru Wang, Ching-Liang Kao, Wen-Liang Tseng, Chia-Chen Chang
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Publication number: 20030098651Abstract: The present invention discloses a light-emitting device with improved reliability so as to achieve a prolonged lifetime, better stability and excellent illumination quality. The light-emitting device comprises a substrate; a light-emitting component, having a p-n junction, mounted on a top surface of the substrate so as to be connected to corresponding metal pads through at least one conducting wire; and a cap, formed of a transparent material to have an inward concave, wherein the light-emitting component is disposed in the inward concave such that there is a gap between the light-emitting component and the cap.Type: ApplicationFiled: November 27, 2002Publication date: May 29, 2003Inventors: Ming-Der Lin, Kwang-Ru Wang
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Publication number: 20030100140Abstract: A method for packaging an electro-optics device is disclosed. A transparent material is added between the die carrier and the electro-optics device, so that the light emitted from the backside of the electro-optics device can be extracted. Furthermore, a light reflective layer is formed on the die carrier, and a pattern of the light reflective layer is designed to prevent the light from being reflected to the active layer, the reflecting decreasing light-emitting efficiency again.Type: ApplicationFiled: January 15, 2003Publication date: May 29, 2003Applicant: OPTO TECH CORPORATIONInventors: Ming-Der Lin, Chang-Da Tsai, Kwang-Ru Wang, Ching-Liang Kao, Wen-Liang Tseng, Chia-Chen Chang
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Publication number: 20030010986Abstract: A light emitting semiconductor device with a surface-mounted and flip-chip package structure is disclosed. The light emitting semiconductor device includes an insulating substrate and a LED. The LED includes a substrate, a first-type semiconductor layer, a first electrode formed on part of the first-type semiconductor layer surface, a second-type semiconductor layer formed on the first-type semiconductor layer surface but not covering the first electrode, and a second electrode formed on the second-type semiconductor layer. Two electrode layers are formed on the two sides of the insulating substrate and extend upwardly and downwardly to the upper and lower surface of the insulating substrate. The device is characterized in that the LED is mounted on the insulating substrate by a flip chip method and the insulating substrate is formed with two electrode layers at both side walls to surface-mounted with the LED.Type: ApplicationFiled: July 9, 2002Publication date: January 16, 2003Inventors: Ming-der Lin, Kwang-ru Wang