Patents by Inventor Kwang Soon Hwang

Kwang Soon Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Inter-stacking module system
    Patent number: 8410594
    Abstract: An inter-stacking module system is provided by mounting an integrated circuit on a first substrate, the first substrate having a first bond pad, mounting an inter-stacking module substrate over the integrated circuit, forming an inter-stacking module bonding pad on the inter-stacking module substrate, and connecting bond wires between the inter-stacking module bonding pad and the first bond pad.
    Type: Grant
    Filed: January 11, 2006
    Date of Patent: April 2, 2013
    Assignee: Stats Chippac Ltd.
    Inventors: Kwang Soon Hwang, Youngcheol Kim, Hun Teak Lee, Koo Hong Lee
  • Integrated circuit package system with wire bond pattern
    Patent number: 7863737
    Abstract: An integrated circuit package system including providing a plurality of substantially identical package leads formed in a single row, and attaching bond wires having an offset on adjacent locations of the package leads.
    Type: Grant
    Filed: April 1, 2006
    Date of Patent: January 4, 2011
    Assignee: Stats Chippac Ltd.
    Inventors: Byoung Wook Jang, Hun Teak Lee, Kwang Soon Hwang
  • INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WIRE BOND PATTERN
    Publication number: 20070235869
    Abstract: An integrated circuit package system including providing a plurality of substantially identical package leads formed in a single row, and attaching bond wires having an offset on adjacent locations of the package leads.
    Type: Application
    Filed: April 1, 2006
    Publication date: October 11, 2007
    Applicant: STATS CHIPPAC LTD.
    Inventors: Byoung Wook Jang, Hun Teak Lee, Kwang Soon Hwang