Abstract: A method and system for testing a wafer comprising semiconductor chips are disclosed. A determination of whether or not the wafer is defective is made in relation to a spatially related group of filtered failed semiconductor chips on the wafer, where the spatially related group corresponds to a localized failure on the wafer and is used to calculate a defect index value.

Abstract: A method and system for testing a wafer comprising semiconductor chips are disclosed. A determination of whether or not the wafer is defective is made in relation to a spatially related group of filtered failed semiconductor chips on the wafer, where the spatially related group corresponds to a localized failure on the wafer and is used to calculate a defect index value.

Abstract: In a method of and apparatus for controlling probe tip sanding in semiconductor device testing equipment, resistance values of pads of a probed chip are measured and stored. If a maximum resistance value among the stored resistance values is greater than a contact resistance reference value, a consecutive fail counting value and an accumulated fail counting value are increased. An automatic sanding command is generated to activate automatic sanding of a probe tip, when at least one of the consecutive fail counting value and the accumulated fail counting value is greater than a respective counting reference value. In this manner, false negative readings in the testing of semiconductor devices as the result of increased contact resistance between a probe tip and a pad in an EDS test are reduced and therefore device yield is improved.

Abstract: In a method of and apparatus for controlling probe tip sanding in semiconductor device testing equipment, resistance values of pads of a probed chip are measured and stored. If a maximum resistance value among the stored resistance values is greater than a contact resistance reference value, a consecutive fail counting value and an accumulated fail counting value are increased. An automatic sanding command is generated to activate automatic sanding of a probe tip, when at least one of the consecutive fail counting value and the accumulated fail counting value is greater than a respective counting reference value. In this manner, false negative readings in the testing of semiconductor devices as the result of increased contact resistance between a probe tip and a pad in an EDS test are reduced and therefore device yield is improved.

Abstract: In a method of and apparatus for controlling probe tip sanding in semiconductor device testing equipment, resistance values of pads of a probed chip are measured and stored. If a maximum resistance value among the stored resistance values is greater than a contact resistance reference value, a consecutive fail counting value and an accumulated fail counting value are increased. An automatic sanding command is generated to activate automatic sanding of a probe tip, when at least one of the consecutive fail counting value and the accumulated fail counting value is greater than a respective counting reference value. In this manner, false negative readings in the testing of semiconductor devices as the result of increased contact resistance between a probe tip and a pad in an EDS test are reduced and therefore device yield is improved.

Abstract: A test control system for controlling overall test procedures which processes test data generated from the final test process and analyzes bin category results. The control system uses testers for testing electrical characteristics of IC devices, a host computer for processing data transmitted from the testers and for creating a number of database structures, and distributed computers for monitoring the test progress and analyzing the test results using the database structures stored in the host computer. A control method using the control system includes the steps of: performing a final test as a lot; monitoring the status of the final test progress while storing test data during the final test; determining if the final test is completed; performing a lot decision after the final test is completed based on bin category limits; and displaying the lot decision result and storing the test data.

Abstract: A test control system for controlling overall test procedures which processes test data generated from the final test process and analyzes bin category results. The control system uses testers for testing electrical characteristics of IC devices, a host computer for processing data transmitted from the testers and for creating a number of database structures, and distributed computers for monitoring the test progress and analyzing the test results using the database structures stored in the host computer. A control method using the control system includes the steps of: performing a final test as a lot; monitoring the status of the final test progress while storing test data during the final test; determining if the final test is completed; performing a lot decision after the final test is completed based on bin category limits; and displaying the lot decision result and storing the test data.