Patents by Inventor Kwangwoo Michael Ko

Kwangwoo Michael Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9308710
    Abstract: Mechanism for controlling pressure during the adhesive thermal compression bonding provides benefits of higher production yield, improved adhesive bonding performance and quality. Springs and pneumatic pistons are utilized to provide improved pressure control during the adhesive thermal compression bonding process. All production parts have certain geometric tolerances and automatically accommodating these tolerances increases production yield by reducing waste of incompletely adhesive bonded parts. The gaps caused by the parts tolerance are closed in a controlled manner using the mechanism and the pressure is controlled for effective adhesive bonding.
    Type: Grant
    Filed: June 21, 2013
    Date of Patent: April 12, 2016
    Inventor: Kwangwoo Michael Ko
  • Publication number: 20140150979
    Abstract: Mechanism for controlling pressure during the adhesive thermal compression bonding provides benefits of higher production yield, improved adhesive bonding performance and quality. Springs and pneumatic pistons are utilized to provide improved pressure control during the adhesive thermal compression bonding process. All production parts have certain geometric tolerances and automatically accommodating these tolerances increases production yield by reducing waste of incompletely adhesive bonded parts. The gaps caused by the parts tolerance are closed in a controlled manner using the mechanism and the pressure is controlled for effective adhesive bonding.
    Type: Application
    Filed: June 21, 2013
    Publication date: June 5, 2014
    Inventor: Kwangwoo Michael Ko
  • Patent number: 8469074
    Abstract: Mechanism for controlling pressure during the adhesive thermal compression bonding provides benefits of higher production yield, improved adhesive bonding performance and quality. Springs and pneumatic pistons are utilized to provide improved pressure control during the adhesive thermal compression bonding process. All production parts have certain geometric tolerances and automatically accommodating these tolerances increases production yield by reducing waste of incompletely adhesive bonded parts. The gaps caused by the parts tolerance are closed in a controlled manner using the mechanism and the pressure is controlled for effective adhesive bonding.
    Type: Grant
    Filed: May 19, 2009
    Date of Patent: June 25, 2013
    Inventor: Kwangwoo Michael Ko
  • Patent number: 8262962
    Abstract: Methods are provided for assembling desired die-cuts from individual die-cut components. Each individual die-cut component may consist of films of various materials, diverse adhesive tapes, diverse foam materials, fabrics, metals and others. Individual die-cut components are assembled onto liners that function as carriers or platforms. The liners may be in individual panels or continuous rolls. Individual die-cut components are assembled onto the liner using computer controlled pick and place equipment with a high degree of accuracy and speed. The liner may consist of a film with controlled adhesive strength to maintain the x-y position of placed individual die-cut components. The die-cut comprising the liner and assembled die-cut components is then used for various purposes, such as holding two parts together, in the assembly of various products, such as cell phones.
    Type: Grant
    Filed: October 5, 2007
    Date of Patent: September 11, 2012
    Inventor: Kwangwoo Michael Ko
  • Publication number: 20080268195
    Abstract: Methods are provided for assembling desired die-cuts from individual die-cut components. Each individual die-cut component may consist of films of various materials, diverse adhesive tapes, diverse foam materials, fabrics, metals and others. Individual die-cut components are assembled onto liners that function as carriers or platforms. The liners may be in individual panels or continuous rolls. Individual die-cut components are assembled onto the liner using computer controlled pick and place equipment with a high degree of accuracy and speed. The liner may consist of a film with controlled adhesive strength to maintain the x-y position of placed individual die-cut components. The die-cut comprising the liner and assembled die-cut components is then used for various purposes, such as holding two parts together, in the assembly of various products, such as cell phones.
    Type: Application
    Filed: October 5, 2007
    Publication date: October 30, 2008
    Inventor: Kwangwoo Michael Ko