Abstract: A bump manufacturing method may be provided. The bump manufacturing method may include forming a bump on an electrode pad included in a semiconductor device, and controlling a shape of the bump by reflowing the bump formed on the semiconductor device under an oxygen atmosphere.

Abstract: A flip chip light emitting device (LED) package and a manufacturing method thereof are provided.

Abstract: A flip chip light emitting device (LED) package and a manufacturing method thereof are provided.

Abstract: A method for supporting handover from macro Node B to home Node B is proposed according present invention, comprising: informing, by a source radio network control node of a UE1 the UE of configuration parameters of a cell to be measured and indicating the UE to report a unique ID of the measured cell; measuring, by the UE, a signal from the home Node B, and after reading the home Node B's unique ID from the home Node B's system information, reporting the measurement result to said source radio network control node of the UE, said measurement result including the home Node B's unique ID; and sending, by said source radio network control node, a message to a destination radio network control node of said home Node B specified by said unique ID, so that the destination radio network control node can establish radio bearer in the home Node B for the UE.

Abstract: An apparatus and method for saving resources between a CN and an BSC in a mobile communication system are provided. When it is determined that a calling MS and a called MS are located within a service area of the BSC and it is instructed to perform neither traffic bearer setup for the calling MS nor traffic bearer setup for the called MS between the CN and the BSC, an internal traffic path between the calling MS and the called MS is established within the BSC without performing the traffic bearer setup for the calling and called MSs.