Abstract: According to some aspects of the present disclosure, circuit board assemblies and methods of circuit board assembly are disclosed. Example circuit board assemblies include a circuit board and a magnetic component coupled to the circuit board. The magnetic component includes a primary winding and a secondary winding. The assembly also includes a winding interconnect terminal electrically coupled to the magnetic component. The winding interconnect terminal is disposed on the circuit board remote from the magnetic component, and the circuit board defines an air gap between the winding interconnect terminal and the magnetic component to provide electrical isolation between the winding interconnect terminal and the magnetic component. Corresponding methods of assembling circuit boards and magnetic components are also disclosed.

Abstract: A transformer includes a transformer core, and a primary winding and a secondary winding each wound about the transformer core. The primary winding includes a wire wound in multiple primary winding layers, and each primary winding layer includes multiple primary turns arranged in a spiral. The secondary winding includes one or more substantially flat conductors defining multiple secondary winding layers. Each secondary winding layer includes one secondary turn, every two adjacent secondary turns have a single different one of the primary winding layers positioned between the two adjacent secondary turns to interleave the secondary winding and the primary winding, and each secondary turn has a different diameter than an adjacent one of the secondary turns.

Abstract: According to some aspects of the present disclosure, heat sink assemblies are disclosed. Example heat sink assemblies include a printed circuit board having a first side and a second side. The printed circuit board defines an opening extending from the first side to the second side. The heat sink assembly also includes a heat sink coupled to the first side of the printed circuit board. The heat sink includes a protrusion extending through the through opening of the printed circuit board. The heat sink assembly further includes a surface mounted device coupled to the second side of the printed circuit board. The surface mounted device is in thermal contact with the protrusion of the heat sink to transfer heat from the surface mounted device to the heat sink. Example methods of manufacturing heat sink assemblies are also disclosed.

Abstract: A transformer includes a transformer core, and a primary winding and a secondary winding each wound about the transformer core. The primary winding includes a wire wound in multiple primary winding layers, and each primary winding layer includes multiple primary turns arranged in a spiral. The secondary winding includes one or more substantially flat conductors defining multiple secondary winding layers. Each secondary winding layer includes one secondary turn, every two adjacent secondary turns have a single different one of the primary winding layers positioned between the two adjacent secondary turns to interleave the secondary winding and the primary winding, and each secondary turn has a different diameter than an adjacent one of the secondary turns.

Abstract: According to some aspects of the present disclosure, circuit board assemblies and methods of circuit board assembly are disclosed. Example circuit board assemblies include a circuit board and a magnetic component coupled to the circuit board. The magnetic component includes a primary winding and a secondary winding. The assembly also includes a winding interconnect terminal electrically coupled to the magnetic component. The winding interconnect terminal is disposed on the circuit board remote from the magnetic component, and the circuit board defines an air gap between the winding interconnect terminal and the magnetic component to provide electrical isolation between the winding interconnect terminal and the magnetic component. Corresponding methods of assembling circuit boards and magnetic components are also disclosed.

Abstract: According to some aspects of the present disclosure, heat sink assemblies are disclosed. Example heat sink assemblies include a printed circuit board having a first side and a second side. The printed circuit board defines an opening extending from the first side to the second side. The heat sink assembly also includes a heat sink coupled to the first side of the printed circuit board. The heat sink includes a protrusion extending through the through opening of the printed circuit board. The heat sink assembly further includes a surface mounted device coupled to the second side of the printed circuit board. The surface mounted device is in thermal contact with the protrusion of the heat sink to transfer heat from the surface mounted device to the heat sink. Example methods of manufacturing heat sink assemblies are also disclosed.

Abstract: An integrated circuit assembly includes a first electrically conductive sheet, a second electrically conductive sheet electrically isolated from the first electrically conductive sheet, a non-conductive material disposed between the first and second electrically conductive sheets, an electrical trace disposed on the non-conductive material and electrically isolated from the first and second electrically conductive sheets, and an integrated circuit having at least one lead directly connected to the first electrically conductive sheet, at least one lead directly connected to the second electrically conductive sheet, and at least one lead electrically connected to the electrical trace. Other integrated circuit assemblies and method for making integrated circuit assemblies are also disclosed.

Abstract: An integrated circuit assembly includes a first electrically conductive sheet, a second electrically conductive sheet electrically isolated from the first electrically conductive sheet, a non-conductive material disposed between the first and second electrically conductive sheets, an electrical trace disposed on the non-conductive material and electrically isolated from the first and second electrically conductive sheets, and an integrated circuit having at least one lead directly connected to the first electrically conductive sheet, at least one lead directly connected to the second electrically conductive sheet, and at least one lead electrically connected to the electrical trace. Other integrated circuit assemblies and method for making integrated circuit assemblies are also disclosed.

Abstract: A multiphase power converter includes a plurality of subconverters and a control circuit. Each subconverter has an input circuit, an output circuit, and a magnetic core coupling the input circuit to the output circuit. The magnetic core of at least one of the plurality of subconverters has a core section that is shared by the magnetic core of another one of the plurality of subconverters. The control circuit is configured to operate the input circuits of the plurality of subconverters with different phases. The magnetic cores may be cores of a transformer, a coupled inductor, etc.

Abstract: A multiphase power converter includes a plurality of subconverters and a control circuit. Each subconverter has an input circuit, an output circuit, and a magnetic core coupling the input circuit to the output circuit. The magnetic core of at least one of the plurality of subconverters has a core section that is shared by the magnetic core of another one of the plurality of subconverters. The control circuit is configured to operate the input circuits of the plurality of subconverters with different phases. The magnetic cores may be cores of a transformer, a coupled inductor, etc.

Abstract: An isolated switching power converter includes a power isolation transformer having at least one primary winding, at least one secondary winding and a plurality of sides, a first power board mechanically coupled to a first side of the transformer, and a second power board mechanically coupled to a second side of the transformer. The first power board includes a primary side circuit electrically coupled to the at least one primary winding, and the second power board includes a secondary side circuit electrically coupled to the at least one secondary winding.

Abstract: Assemblies and methods for sensing current through semiconductor device leads are disclosed. One example method includes mounting a current sense assembly about a lead of a semiconductor device. The current sense assembly may include a carrier adapted to hold a current sensor in close proximity to a semiconductor device lead to sense current flowing in the lead. One example assembly for sensing current through a semiconductor device lead includes a carrier for mounting to the semiconductor device lead and a current sensor supported by the carrier. The carrier includes output terminals. The current sensor has leads electrically coupled to the output terminals. The current sensor is positioned to extend around at least a portion of the lead and provide a signal to the output terminals representing current flowing in the lead when the carrier is mounted to the lead.

Abstract: An integrated circuit assembly includes a first electrically conductive sheet, a second electrically conductive sheet electrically isolated from the first electrically conductive sheet, a non-conductive material disposed between the first and second electrically conductive sheets, an electrical trace disposed on the non-conductive material and electrically isolated from the first and second electrically conductive sheets, and an integrated circuit having at least one lead directly connected to the first electrically conductive sheet, at least one lead directly connected to the second electrically conductive sheet, and at least one lead electrically connected to the electrical trace. Other integrated circuit assemblies and method for making integrated circuit assemblies are also disclosed.

Abstract: A transformer. The transformer includes a first conductor plate, a second conductor plate, a plate positioning member, an insulated wire, and a magnetic core. The second conductor plate is spaced apart from and electrically connected to the first conductor plate. The plate positioning member is in contact with and surrounded by the first and second conductor plates. The insulated wire is wound around the plate positioning member and between the first and second conductor plates. The magnetic core includes a portion surrounded by the plate positioning member, the first conductor plate, the second conductor plate, and the insulated wire.

Abstract: A heat spreader is disclosed. The heat spreader includes a body member, a first fin connected to the body member, a second fin connected to the body member, a third fin connected to the body member, and a fourth fin connected to the body member. The first and second fins define a first spacing therebetween. The second and third fins define a second spacing therebetween. The third and fourth fins define a third spacing therebetween. The second spacing is greater than the first spacing and the third spacing.

Abstract: A toroidal transformer enclosure is disclosed. The toroidal transformer enclosure includes a first housing member and a second housing member structured and arranged to receive the first housing member. The first housing member includes a first end, a first wall and a second wall. The first and second walls are connected to the first end, and the second wall surrounds the first wall. The second housing member includes a second end, a third wall and a fourth wall. The third and fourth walls are connected to the second end, and the fourth wall surrounds the third wall and defines a spacing therebetween. The first and second walls are disposed in the spacing between the third and fourth walls when the first housing member is received by the second housing member.

Abstract: A telescoping bobbin. The telescoping bobbin includes a first bobbin element and a second bobbin element adapted to receive at least a portion of the first bobbin element. The first bobbin element includes a first member having first and second ends, a first flange extending from the first end of the first member, and a first base extending from the second end of the first member. The second bobbin element includes a second member having first and second ends, a second flange extending from the first end of the second member, and a second base extending from the second end of the second member. The second flange includes a first portion extending generally outward from the second member and a second portion extending generally inward from the second member. When the first bobbin element is received by the second bobbin element, the second portion is adjacent the first flange and the second base covers at least a portion of the first base.