Abstract: A testing module for use in testing a semiconductor chip for failures in its integrated circuits includes a test fixture, and a decapsulated semiconductor device package mounted to the fixture. The semiconductor device package includes a semiconductor chip having an active front surface at which the integrated circuits are formed, a back which is opposed to the active front, a plurality of leads for electrically connecting the semiconductor chip to an external apparatus, and a package body having a backside which is decapsulated so as to expose the back of the semiconductor chip. The test fixture includes a fixture body having a loading surface contacting the front of the package body and supporting the semiconductor device package, a cover which has an opening through which the back of the semiconductor chip is exposed, and a plurality of projections contacting the leads of the semiconductor device package.