Abstract: A radio frequency signal repeater includes, a first communication printed circuit board, a second communication printed circuit board, at least one embedded radio frequency module printed circuit board disposed between and communicably coupled to both the first communication printed circuit board and the second communication printed circuit board. The at least one embedded radio frequency module printed circuit board, the first communication printed circuit board, and the second communication printed circuit board are stacked one board on top of the others, and adjacent boards of the at least one embedded radio frequency module printed circuit board, the first communication printed circuit board, and the second communication printed circuit board are electrically coupled by a respective interconnection join layer so as to form an integrated printed circuit board module, where the adjacent boards are electrically coupled to each other through vias that extend through the interconnection join layer.

Abstract: A radio frequency signal repeater includes, a first communication printed circuit board, a second communication printed circuit board, at least one embedded radio frequency module printed circuit board disposed between and communicably coupled to both the first communication printed circuit board and the second communication printed circuit board. The at least one embedded radio frequency module printed circuit board, the first communication printed circuit board, and the second communication printed circuit board are stacked one board on top of the others, and adjacent boards of the at least one embedded radio frequency module printed circuit board, the first communication printed circuit board, and the second communication printed circuit board are electrically coupled by a respective interconnection join layer so as to form an integrated printed circuit board module, where the adjacent boards are electrically coupled to each other through vias that extend through the interconnection join layer.

Abstract: A multi-embedded radio frequency board includes a plurality of printed circuit boards stacked one on the others, at least one of the printed circuit boards of the plurality of printed circuit boards being configured so as to have a different processing function than another processing function of another printed circuit board of the plurality of printed circuit boards, and an interconnection join layer disposed between adjacent printed circuit boards of the plurality of printed circuit boards so as to physically and electrically couple the adjacent printed circuit boards to each other so as to form an integrated printed circuit board module having a predetermined radio frequency communication characteristic.

Abstract: An antenna array including a printed circuit board having a plurality of printed circuit board launchers, and an array of antenna horns configured to couple with the printed circuit board, one or more antenna horns of the array of antenna horns includes a frame having at least one aperture forming a cup structure that circumscribes a respective printed circuit board launcher, the frame having a first end coupled to the printed circuit board and a second end longitudinally spaced from the first end and extending from the printed circuit board, and a plurality of compliant coupling members extending longitudinally from the first end, the plurality of compliant coupling members being coupled with respective receiving apertures of the printed circuit board such that coupling of plurality of compliant coupling members and the respective receiving apertures solely couples the one or more antenna horns to the printed circuit board.

Abstract: A multi-embedded radio frequency board includes a plurality of printed circuit boards stacked one on the others, at least one of the printed circuit boards of the plurality of printed circuit boards being configured so as to have a different processing function than another processing function of another printed circuit board of the plurality of printed circuit boards, and an interconnection join layer disposed between adjacent printed circuit boards of the plurality of printed circuit boards so as to physically and electrically couple the adjacent printed circuit boards to each other so as to form an integrated printed circuit board module having a predetermined radio frequency communication characteristic.

Abstract: An antenna array including a printed circuit board having a plurality of printed circuit board launchers, and an array of antenna horns configured to couple with the printed circuit board, one or more antenna horns of the array of antenna horns includes a frame having at least one aperture forming a cup structure that circumscribes a respective printed circuit board launcher, the frame having a first end coupled to the printed circuit board and a second end longitudinally spaced from the first end and extending from the printed circuit board, and a plurality of compliant coupling members extending longitudinally from the first end, the plurality of compliant coupling members being coupled with respective receiving apertures of the printed circuit board such that coupling of plurality of compliant coupling members and the respective receiving apertures solely couples the one or more antenna horns to the printed circuit board.

Abstract: A system includes a carrier defining a plurality of channels. The system includes an integrated circuit (IC) die having a first side and having a second side opposite the first side. The second side of the IC die is coupled to the carrier. The system includes a die attach layer between the carrier and the second side of the IC die. The die attach layer defines one or more openings that enable a fluid to flow from the carrier to the second side of the IC die.

Abstract: A system includes a carrier defining a plurality of channels. The system includes an integrated circuit (IC) die having a first side and having a second side opposite the first side. The second side of the IC die is coupled to the carrier. The system includes a die attach layer between the carrier and the second side of the IC die. The die attach layer defines one or more openings that enable a fluid to flow from the carrier to the second side of the IC die.