Abstract: This document discloses techniques, apparatuses, and systems for connecting semiconductor dies through traces. A semiconductor assembly is described that includes two semiconductor dies. The first semiconductor die includes a first dielectric layer at which first circuitry is disposed. The second semiconductor die includes a second dielectric layer at which second circuitry is disposed. One or more traces extend from a side surface of the first dielectric layer and at a side surface of the second dielectric layer to electrically couple the first circuitry and the second circuitry. In doing so, rigid connective structures may not be needed to couple the first semiconductor die and the second semiconductor die.

Abstract: A pallet holds one or more circuit boards for processing. A pallet opening for receiving the circuit board has grooves at one side to retain an edge of the circuit board and rotary clips at the other side to receive and hold the opposite edge of the board. Each clip is a disk which is mounted for rotation about a central axis and is constrained to two angular positions by a detent. A notch in the disk receives the circuit board when in one position and clamps the board against a seat when in the other position. The notch is deep enough to allow the board to be shifted laterally for alignment with test apparatus.